- 29
- Oct
SiP package IC Substrate PCB Board
Product Name: SiP Package Substrate
Material: Shengyi SI10U
Layers: 6L
Thickness: 0.5-0.6mm
Single size: 35 * 35mm
Resistance welding: PSR-4000 AUS308
Surface treatment: ENEPIG
Minimum aperture: 0.075/0.1mm
Minimum line distance: 30um
Minimum line width: 50um
Application: SiP package IC Substrate PCB Board