Ke hāʻawi ʻia ka hōʻailona lekiō kiʻekiʻe/microwave i loko o ka PCB kaapuni, ʻo ka poho i hoʻokumu ʻia e ke kaapuni ponoʻī a me ka mea kaapuni e hoʻopuka i kekahi nui o ka wela. ʻOi aku ka nui o ka poho, ʻoi aku ka kiʻekiʻe o ka mana e hele ana i ka mea PCB, a ʻoi aku ka nui o ka wela i hana ʻia. Ke ʻoi aku ka mahana hana o ke kaapuni i ka waiwai i helu ʻia, hiki i ke kaapuni ke hoʻopilikia i kekahi mau pilikia. No ka laʻana, ʻo ka mea hoʻohana maʻamau MOT, ka mea i ʻike nui ʻia i nā PCB, ʻo ia ka wela hana kiʻekiʻe. Ke ʻoi aku ka mahana o ka hana ma mua o ka MOT, e hoʻoweliweli ʻia ka hana a me ka hilinaʻi o ka PCB circuit. Ma o ka hui pū ʻana o ka hoʻohālike electromagnetic a me nā ana hoʻokolohua, ʻo ka hoʻomaopopo ʻana i nā hiʻohiʻona wela o RF microwave PCB hiki ke kōkua i ka pale ʻana i ka hoʻohaʻahaʻa hana kaapuni a me ka hōʻemi ʻana i ka hilinaʻi i hoʻokumu ʻia e nā wela kiʻekiʻe.

ʻO ka hoʻomaopopo ʻana i ke ʻano o ka nalowale ʻana o ka hoʻokomo ʻana i nā mea kaapuni e kōkua i ka wehewehe maikaʻi ʻana i nā mea nui e pili ana i ka hana wela o nā kaapuni PCB kiʻekiʻe. E lawe kēia ʻatikala i ka microstrip transmission line circuit ma ke ʻano he laʻana e kūkākūkā ai i nā kālepa-off e pili ana i ka hana wela o ke kaapuni. I loko o kahi kaapuni microstrip me kahi ʻaoʻao PCB ʻaoʻao ʻelua, ʻo nā poho e komo pū me ka poho dielectric, ka nalowale conductor, ka nalowale o ka radiation, a me ka nalowale leakage. Nui ka ʻokoʻa ma waena o nā ʻāpana poho like ʻole. Me nā ʻokoʻa liʻiliʻi, ʻoi loa ka haʻahaʻa o ka leakage o nā kaapuni PCB kiʻekiʻe. Ma kēia ʻatikala, ʻoiai he haʻahaʻa loa ka waiwai o ka leakage, e mālama ʻia ia no ka manawa.

ʻO ka poho o ka uila

ʻO ka poho o ka radiation e pili ana i nā ʻāpana kaapuni he nui e like me ke alapine hana, ka mānoanoa substrate kaapuni, PCB dielectric mau (relative dielectric constant a i ʻole εr) a me ka hoʻolālā hoʻolālā. E pili ana i nā papahana hoʻolālā, loaʻa pinepine ka nalowale o ka radiation ma muli o ka hoʻololi impedance maikaʻi ʻole i ke kaapuni a i ʻole nā ​​ʻokoʻa o ka neʻe ʻana o ka hawewe electromagnetic i ke kaapuni. Hoʻokomo pinepine ʻia ka wahi hoʻololi impedance kaapuni i ka wahi hānai hōʻailona, ​​wahi impedance step, stub a me ka pūnaewele pili. Hiki i ka hoʻolālā kaapuni kūpono ke hoʻomaopopo i ka hoʻololi impedance maʻalahi, a laila e hōʻemi ana i ka nalowale o ka radiation o ke kaapuni. ʻOiaʻiʻo, pono e hoʻomaopopo ʻia aia ka hiki ke hiki i ka impedance mismatch ke alakaʻi i ka nalowale o ka radiation ma kēlā me kēia interface o ke kaapuni. Mai ka manaʻo o ka hana pinepine, ʻoi aku ka kiʻekiʻe o ke alapine, ʻoi aku ka nui o ka nalowale o ka radiation o ke kaapuni.

ʻO nā ʻāpana o nā mea kaapuni e pili ana i ka nalo radiation ka nui o ka dielectric mau a me ka mānoanoa o nā mea PCB. ʻOi aku ka mānoanoa o ka substrate kaapuni, ʻoi aku ka nui o ka hiki ke lilo i ka nalowale o ka radiation; ʻo ka haʻahaʻa o ka εr o ka mea PCB, ʻoi aku ka nui o ka nalowale o ka radiation o ke kaapuni. Hiki ke hoʻohana ʻia ka hoʻohana ʻana i nā substrate kaapuni lahilahi i mea e hoʻopau ai i ka nalowale o ka radiation i kumu ʻia e nā mea kaapuni εr haʻahaʻa. ʻO ka mana o ka mānoanoa o ka substrate kaapuni a me ka εr i ka nalowale ʻana o ka radiation kaapuni no ka mea he hana hilinaʻi ia. Inā ʻaʻole ʻoi aku ka mānoanoa o ka substrate kaapuni ma mua o 20mil a ʻoi aku ka haʻahaʻa o ka hana ma mua o 20GHz, haʻahaʻa loa ka nalowale o ka radiation. No ka mea ʻoi aku ka haʻahaʻa o ka hapa nui o ka hoʻohālike kaapuni a me nā alapine ana ma kēia ʻatikala ma mua o 20GHz, e haʻalele ka kūkākūkā ma kēia ʻatikala i ka mana o ka nalowale o ka radiation ma ka hoʻomehana kaapuni.

Ma hope o ka haʻalele ʻole ʻana i ka nalowale o ka radiation ma lalo o 20GHz, ʻo ka nalowale o ka hoʻokomo ʻana o kahi kaapuni laina microstrip ʻelua mau ʻāpana: ka poho dielectric a me ka nalowale conductor. ʻO ka māhele o nā mea ʻelua e pili ana i ka mānoanoa o ka substrate kaapuni. No nā substrate ʻoi aku ka lahilahi, ʻo ka nalowale conductor ka mea nui. No nā kumu he nui, he paʻakikī ke wānana pololei i ka nalowale o ka conductor. No ka laʻana, he mana nui ka ʻili o kahi conductor i nā hiʻohiʻona hoʻoili o nā hawewe electromagnetic. ʻAʻole e hoʻololi wale ka ʻili o ka ʻili keleawe i ka hoʻolaha ʻana o ka nalu electromagnetic mau o ka microstrip circuit, akā e hoʻonui pū i ka nalowale o ka conductor. Ma muli o ka hopena o ka ʻili, ʻo ka hopena o ka ʻeleʻele keleawe keleawe i ka nalowale o ka conductor e hilinaʻi pū ʻia. Hoʻohālikelike ka Figure 1 i ka nalowale o ka hoʻokomo ʻana o 50 ohm microstrip transmission line circuit ma muli o nā mānoanoa PCB like ʻole, ʻo ia ka 6.6 mils a me 10 mils, kēlā me kēia.

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Kiʻi 1. Ka hoʻohālikelike o 50 ohm microstrip kaapuni laina laina ma muli o nā mea PCB o nā mānoanoa like ʻole.

Nā hualoaʻa i ana a hoʻohālikelike ʻia

Aia i loko o ke kiʻi 1 nā hopena i ana ʻia a me nā hopena hoʻohālike. Loaʻa nā hopena hoʻohālikelike ma o ka hoʻohana ʻana i ka polokalamu helu impedance impedance microwave a Rogers Corporation MWI-2010. Hōʻike ka polokalamu MWI-2010 i nā hoʻohālikelike analytical i loko o nā pepa maʻamau i ke kahua o ka microstrip line modeling. Loaʻa ka ʻikepili hoʻāʻo ma ke Kiʻi 1 e ke ʻano ana ʻokoʻa o ka lōʻihi o kahi mea hoʻoponopono pūnaewele vector. Hiki ke ʻike ʻia mai ka Fig. 1 ʻo nā hopena hoʻohālikelike o ka huina pohō i ke kumu kūpono me nā hopena i ana ʻia. Hiki ke ʻike ʻia mai ke kiʻi, ʻo ka nalowale o ka conductor o ke kaapuni ʻoi aku ka lahilahi (ʻo ka pihi ma ka hema e pili ana i ka mānoanoa o 6.6 mil) ʻo ia ka mea nui o ka huina hoʻokomo. Ke piʻi aʻe ka mānoanoa kaapuni (ʻo ka mānoanoa e pili ana i ka pihi ma ka ʻaoʻao ʻākau he 10mil), ʻo ka nalo dielectric a me ka nalo conductor e hele kokoke mai, a ʻo ia mau mea ʻelua i ka huina hoʻokomo.

ʻO ke kumu hoʻohālike ma ke Kiʻi 1 a me nā ʻāpana mea kaapuni i hoʻohana ʻia i ke kaapuni maoli: dielectric mau 3.66, kumu poho 0.0037, a me ka ʻili o ka ʻili keleawe 2.8 um RMS. Ke emi iho ka roughness o ka ili keleawe ma lalo o ka mea kaapuni like, e emi loa ka lilo o ka conductor o ka 6.6 mil a me 10 mil kaapuni ma ke Kii 1; akā naʻe, ʻaʻole maopopo ka hopena no ke kaapuni 20 mil. Hōʻike ke Kiʻi 2 i nā hopena hoʻāʻo o ʻelua mau mea kaapuni me nā ʻano ʻokoʻa ʻē aʻe, ʻo ia hoʻi ʻo Rogers RO4350B™ mea kaapuni maʻamau me ka ʻeleʻele kiʻekiʻe a me Rogers RO4350B LoPro™ mea kaapuni me ka haʻahaʻa haʻahaʻa.

Hōʻike ka Kiʻi 2 i nā mea maikaʻi o ka hoʻohana ʻana i kahi substrate ili keleawe maʻemaʻe no ka hoʻoponopono ʻana i nā kaapuni microstrip. No nā substrate ʻoi aku ka liʻiliʻi, hiki i ka hoʻohana ʻana i ka foil keleawe maʻemaʻe ke hōʻemi nui i ka nalowale o ka hoʻokomo. No ka substrate 6.6mil, ua ho’ēmiʻia ka poho hoʻokomo e 0.3 dB ma 20GHz ma muli o ka hoʻohanaʻana i ka paʻi keleawe maʻemaʻe; ka 10mil substrate ua ho’ēmiʻia e 0.22 dB ma 20GHz; a me ka 20mil substrate, hoʻemi ʻia ka poho hoʻokomo e 0.11 dB.

E like me ka mea i hōʻike ʻia ma ka Figure 1 a me Figure 2, ʻoi aku ka lahilahi o ka substrate kaapuni, ʻoi aku ka kiʻekiʻe o ka hoʻokomo ʻana o ke kaapuni. ʻO ia ke ʻano o ka hānai ʻia ʻana o ke kaapuni me kahi nui o ka mana microwave RF, ʻoi aku ka ʻoi aku o ka wela o ke kaapuni. Ke kaupaona nui ʻia ka pilikia o ka hoʻomehana kaapuni, ma kekahi ʻaoʻao, ʻoi aku ka wela o ke kaapuni lahilahi ma mua o ke kaapuni mānoanoa ma nā pae mana kiʻekiʻe, akā ma ka ʻaoʻao ʻē aʻe, hiki i kahi kaapuni lahilahi ke loaʻa i ka kahe wela ʻoi aku ka maikaʻi ma o ka wela wela. E mālama haʻahaʻa i ka mahana.

I mea e hoʻoponopono ai i ka pilikia wela o ke kaapuni, pono e loaʻa i ke kaʻapuni lahilahi maikaʻi nā hiʻohiʻona penei: kumu poho haʻahaʻa o ka mea kaapuni, ʻili keleawe lahilahi, haʻahaʻa εr a me ka conductivity thermal kiʻekiʻe. Ke hoʻohālikelike ʻia me ka mea kaapuni o ka εr kiʻekiʻe, ʻo ka laulā conductor o ka impedance like i loaʻa ma lalo o ke kūlana o ka εr haʻahaʻa hiki ke ʻoi aku ka nui, he mea pono ia e hōʻemi i ka nalowale o ka conductor o ke kaapuni. Mai ka hiʻohiʻona o ke kaapuni wela dissipation, ʻoiai ka hapa nui o ka PCB kaapuni substrates i loaʻa ka maikaʻi ʻole o ka conductivity wela e pili ana i nā conductors, ʻo ka conductivity thermal o nā mea kaapuni he mea nui loa.

Ua wehewehe ʻia ka nui o nā kūkākūkā e pili ana i ka thermal conductivity o nā substrates circuit ma nā ʻatikala mua, a e haʻi kēia ʻatikala i kekahi mau hopena a me nā ʻike mai nā ʻatikala mua. No ka laʻana, kōkua ka hoohalike a me ka Figure 3 e hoʻomaopopo i nā mea e pili ana i ka hana wela o nā mea kaapuni PCB. Ma ka hoohalike, k ka wela (W/m/K), A ka wahi, TH ka wela o ke kumu wela, TC ka wela o ke kumu anu, a o L ka mamao ma waena o ke kumu wela a me. ke kumu anu.