- 29
- Oct
BGA IC substrate
Product Name: BGA IC substrate
Plate: Mitsubishi Gas HF BT HL832NX-A-HS
Minimum width / spacing: 30 / 30um
Surface: ENEPIG(2U)
PCB thickness: 0.3mm
Layer: 4Layers
Structure: 1L-4L,1L-2L,3L-4L
Solder mask ink: TAIYO PSR4000 AUS308
Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm
Application: BGA IC substrate