Mgbe etinyere mgbama ugboro redio dị elu/microwave n’ime PCB sekit, ọnwụ nke sekit ahụ n’onwe ya na ihe sekit ga-esi na ya pụta ga-emepụta ụfọdụ okpomọkụ. Nke ka ọnwụ na-abawanye, ike dị elu na-agafe na ihe PCB, na ka ọkụ na-esiwanye ike. Mgbe okpomọkụ na-arụ ọrụ nke sekit karịrị ọnụ ahịa echere, sekit nwere ike ịkpata nsogbu ụfọdụ. Dị ka ọmụmaatụ, ahụkarị paramita ọrụ MOT, nke a maara nke ọma na PCBs, bụ kacha arụ ọrụ okpomọkụ. Mgbe okpomọkụ na-arụ ọrụ karịrị MOT, arụmọrụ na ntụkwasị obi nke sekit PCB ga-eyi egwu. Site na nchikota nke ihe nlere elektrọnik na nha nnwale, ịghọta njirimara ọkụ nke RF microwave PCBs nwere ike inye aka zere mmebi arụmọrụ sekit na mmebi ntụkwasị obi nke oke okpomọkụ kpatara.

Ịghọta ka ntinye ntinye na-apụta na ihe sekit na-enyere aka ịkọwa nke ọma ihe ndị dị mkpa metụtara arụmọrụ okpomọkụ nke sekit PCB dị elu. Edemede a ga-ewere sekit nnyefe microstrip dị ka ihe atụ iji kwurịta ahịa-offs metụtara arụmọrụ okpomọkụ nke sekit. N’ime sekit microstrip nwere PCB nwere akụkụ abụọ, mfu gụnyere mfu dielectric, ọnwụ onye nduzi, mfu radieshon, na mfu nke ntapu. Ihe dị iche n’etiti ihe dị iche iche ọnwụ bụ nnukwu. Ewezuga ole na ole, mfu nke sekit PCB dị elu na-adịkarị ala. N’isiokwu a, ebe ọ bụ na ọnụ ahịa nkwụsị nke ntanye dị ntakịrị, a ga-eleghara ya anya maka oge a.

Ọnwụ radieshon

Ọnwụ radieshon na-adabere na ọtụtụ sekit paramita dị ka ọrụ ugboro ugboro, sekit substrate ọkpụrụkpụ, PCB dielectric mgbe niile ( ikwu dielectric mgbe niile ma ọ bụ εr) na imewe atụmatụ. N’ihe gbasara atụmatụ imewe, ọnwụ radieshon na-esitekarị na ngbanwe impedance na-adịghị mma na sekit ma ọ bụ ọdịiche dị na nnyefe ikuku electromagnetic na sekit. Mpaghara ngbanwe impedance sekit na-agụnye mpaghara mgbama n’ime, ebe nkwụsị ụkwụ, stub na netwọk dakọtara. Nhazi sekit ezi uche dị na ya nwere ike ịghọta mgbanwe ngbanwe nke impedance, si otú ahụ belata ọnwụ radieshon nke sekit. N’ezie, e kwesịrị ịghọta na e nwere ike nke impedance mismatch na-eduga radieshon ọnwụ na ọ bụla interface nke sekit. Site n’echiche nke ugboro ole na-arụ ọrụ, na-emekarị ka ọ dịkwuo elu, na-abawanye ụba radieshon nke sekit.

The parameters nke sekit ihe metụtara radieshon ọnwụ bụ tumadi dielectric mgbe niile na PCB ihe ọkpụrụkpụ. The thicker na sekit mkpụrụ, ukwuu ohere nke ịkpata ọnwụ radieshon; na ala εr nke PCB ihe onwunwe, ukwuu radieshon ọnwụ nke sekit. Comprehensively-erikpu ihe e ji mara, ojiji nke mkpa sekit substrates nwere ike iji dị ka a ụzọ dechapụ radieshon ọnwụ kpatara ala εr sekit ihe. Mmetụta nke sekit mkpụrụ ọkpụrụkpụ na εr na sekit radieshon ọnwụ bụ n’ihi na ọ bụ a ugboro-adabere ọrụ. Mgbe ọkpụrụkpụ nke mkpụrụ sekit anaghị agafe 20mil na oge ọrụ ya dị ala karịa 20GHz, ọnwụ radieshon nke sekit dị obere. Ebe ọ bụ na ọtụtụ n’ime ihe ngosi sekit na nha nha n’isiokwu a dị ala karịa 20GHz, mkparịta ụka dị n’isiokwu a ga-eleghara mmetụta nke ọnwụ radieshon na kpo oku sekit anya.

After ignoring the radiation loss below 20GHz, the insertion loss of a microstrip transmission line circuit mainly includes two parts: dielectric loss and conductor loss. The proportion of the two mainly depends on the thickness of the circuit substrate. For thinner substrates, conductor loss is the main component. For many reasons, it is generally difficult to accurately predict conductor loss. For example, the surface roughness of a conductor has a huge influence on the transmission characteristics of electromagnetic waves. The surface roughness of copper foil will not only change the electromagnetic wave propagation constant of the microstrip circuit, but also increase the conductor loss of the circuit. Due to the skin effect, the influence of copper foil roughness on conductor loss is also frequency-dependent. Figure 1 compares the insertion loss of 50 ohm microstrip transmission line circuits based on different PCB thicknesses, which are 6.6 mils and 10 mils, respectively

Nsonaazụ atụnyere na simulated

Ọkpụkpụ dị na eserese 1 nwere nsonaazụ atụpụtara na nsonaazụ simulation. A na-enweta nsonaazụ ịme anwansị site na iji ngwanrọ mgbako impedance microwave MWI-2010 nke Rogers Corporation. Akụrụngwa MWI-2010 na-ehota nha nha anya nyocha n’ime akwụkwọ kpochapụrụ n’ọhịa nke microstrip line modeling. A na-enweta data nnwale dị na eserese 1 site na usoro nha ogologo dị iche nke ihe nyocha netwọkụ vector. Enwere ike ịhụ site na Fig. 1 na nsonaazụ ịme anwansị nke mkpokọta ọnwụ na-adaba adaba na nsonaazụ atụpụtara. Enwere ike ịhụ site na ọnụ ọgụgụ ahụ na nkwụsị nke onye nduzi nke sekit thinner (mpịakọta dị n’aka ekpe kwekọrọ na ọkpụrụkpụ nke 6.6 mil) bụ isi ihe na-akpata nkwụsị ntinye. Ka ọkpụkpụ sekit na-abawanye (ọkpụrụkpụ nke kwekọrọ na ntụgharị dị n’aka nri bụ 10mil), ọnwụ dielectric na nkwụsị nke onye nduzi na-abịarute nso, na abụọ ahụ jikọtara ọnụ na-emejupụta nkwụsị ntinye.

Ụdị ịme anwansị dị na Figure 1 na ihe ndị dị na sekit ihe eji eme ihe na sekit n’ezie bụ: dielectric 3.66 na-adịgide adịgide, ihe nkwụsị 0.0037, na onye na-eduzi ọla kọpa 2.8 um RMS. Mgbe elu roughness nke ọla kọpa n’okpuru otu ihe sekit ihe na-ebelata, onye nduzi ọnwụ nke 6.6 mil na 10 mil sekit na Figure 1 ga-abụ nke ukwuu belata; Otú ọ dị, mmetụta adịghị anya maka sekit 20 mil. Ọnụọgụ 2 na-egosi nsonaazụ ule nke ihe sekit abụọ nwere ike dị iche iche, ya bụ Rogers RO4350B ™ ọkọlọtọ sekit ihe dị elu na ihe sekit Rogers RO4350B LoPro ™ nwere obere ike.

Dị ka egosiri na eserese 1 na eserese 2, ihe dị nro nke sekit nke sekit, nke dị elu nke ntinye ntinye nke sekit. Nke a pụtara na mgbe a na-enye sekit ahụ nri ụfọdụ nke ike microwave RF, sekit ahụ dị gịrịgịrị ga-eme ka ọ dịkwuo ọkụ. Mgbe ị na-atụle n’ụzọ zuru ezu okwu nke kpo oku sekit, n’otu aka ahụ, a thinner sekit na-emepụta ihe okpomọkụ karịa oké sekit na elu ike ọkwa, ma n’aka nke ọzọ, a thinner sekit nwere ike nweta irè okpomọkụ eruba site okpomọkụ sink. Debe okpomọkụ dịtụ ala.

Iji dozie nsogbu kpo oku nke sekit, ezigbo mkpa sekit kwesịrị inwe àgwà ndị a: obere ihe na-efu nke ihe sekit, ezigbo ọla kọpa mkpa elu, ala εr na elu thermal conductivity. E jiri ya tụnyere ihe sekit nke elu εr, onye na-eduzi obosara nke otu impedance nwetara n’okpuru ọnọdụ nke ala εr nwere ike ibu ibu, nke bara uru iji belata nkwụsị nke nchịkwa nke sekit. Site n’echiche nke dissipation okpomọkụ sekit, ọ bụ ezie na ọtụtụ elu-ugboro PCB sekit substrates nwere nnọọ ogbenye thermal conductivity ikwu na-eduzi, thermal conductivity nke sekit ihe ka bụ ihe dị oké mkpa oke.

A kọwawo ọtụtụ mkparịta ụka gbasara thermal conductivity nke sekit substrates n’isiokwu ndị mbụ, na isiokwu a ga-ehota ụfọdụ nsonaazụ na ozi sitere na isiokwu ndị mbụ. Ọmụmaatụ, ndị na-esonụ equation na Figure 3 na-enyere aka ịghọta ihe ndị metụtara thermal arụmọrụ nke PCB sekit ihe. Na nhata, k bụ thermal conductivity (W / m / K), A bụ mpaghara, TH bụ okpomọkụ nke isi iyi ọkụ, TC bụ okpomọkụ nke isi iyi oyi, na L bụ ebe dị anya n’etiti isi iyi ọkụ na isi iyi oyi.