Qauv: 8L 2 + N + 2 Mobile Main Board

Khoom siv: FR4
Kev tsim kho: 8L 2 + N + 2 HDI
Ua tiav Thickness: 1.0mm
Copper Thickness: 1 OZ
Xim: Ntsuab / Dawb
Surface Treatment: Immersion Kub
Min Trace / Chaw: 3.5mil / 3.5mil
Min Qhov: Mechanical Qhov 0.2mm, Laser Qhov 0.1mm
Daim ntawv thov: Mobile Main Board