Yadda za a yi amfani da PCB don IC kunshin zafi dissipation?

Fannin farko na ƙirar PCB wanda zai iya inganta aikin zafi shine shimfidar na’urar PCB. A duk lokacin da zai yiwu, manyan abubuwan haɗin wuta akan PCB yakamata a raba su da juna. Wannan rarrabuwar jiki tsakanin manyan abubuwan haɗin gwiwar yana haɓaka yankin PCB da ke kewaye da kowane ɓangaren ƙarfi mai ƙarfi, ta haka yana taimakawa don cimma ingantacciyar tafiyar zafi. Yakamata a kula don ware abubuwan da ke da zafin zafin jiki akan PCB daga abubuwan haɗin wuta mai ƙarfi. A duk lokacin da zai yiwu, wurin shigarwa na manyan kayan aikin ya kamata ya yi nisa daga sasanninta na PCB. Ƙarin wurin PCB na tsakiya zai iya ƙara girman yankin allon kusa da manyan abubuwan haɗin wuta, ta haka yana taimakawa wajen watsar da zafi. Hoto na 2 yana nuna na’urorin semiconductor guda biyu iri ɗaya: bangaren A da bangaren B. Bangaren A yana a kusurwar PCB kuma yana da zafin junction na mutu wanda ya fi 5% sama da bangaren B saboda bangaren B yana kusa da tsakiya. Tun da yankin allon da ke kewaye da kayan aikin zafi ya fi ƙanƙanta, zafi mai zafi a kusurwar sashin A yana iyakance.

Yadda ake amfani da PCB don zubar da zafi na fakitin IC?

Bangare na biyu shine tsarin PCB, wanda ke da mafi girman tasiri akan aikin thermal na ƙirar PCB. Ka’ida ta gaba ɗaya ita ce: ƙarin jan ƙarfe a cikin PCB, mafi girman aikin thermal na abubuwan tsarin. Madaidaicin yanayin zubar da zafi don na’urorin semiconductor shine cewa an ɗora guntu akan babban yanki na jan ƙarfe mai sanyaya ruwa. Ga mafi yawan aikace-aikacen, wannan hanyar hawa ba ta da amfani, don haka kawai za mu iya yin wasu canje-canje ga PCB don inganta aikin watsar da zafi. Don yawancin aikace-aikace a yau, jimillar ƙarar tsarin yana ci gaba da raguwa, wanda ke da mummunar tasiri akan aikin zafi. Mafi girman PCB, girman yankin da za a iya amfani da shi don tafiyar da zafi, kuma yana da mafi girman sassauci, yana ba da damar isashen sarari tsakanin manyan abubuwan da aka haɗa.

A duk lokacin da zai yiwu, ƙara girman lamba da kauri na PCB tagulla jiragen ƙasa. Nauyin layin jan ƙarfe na ƙasa gabaɗaya yana da girman gaske, kuma hanya ce mai kyau ta thermal don duk PCB don watsar da zafi. Shirye-shiryen wayar da kan kowane Layer zai kuma ƙara yawan adadin tagulla da ake amfani da shi don tafiyar da zafi. Koyaya, wannan wayoyi galibi ana keɓance shi ta hanyar lantarki da kuma yanayin zafi, wanda ke iyakance aikinsa a matsayin yuwuwar watsar zafi. Wayar da jirgin ƙasa na na’urar ya kamata ya kasance mai ƙarfi kamar yadda zai yiwu tare da jiragen ƙasa da yawa, don taimakawa haɓaka ƙarfin zafi. Rushewar zafi ta hanyar PCB a ƙarƙashin na’urar semiconductor yana taimakawa zafi don shigar da yadudduka da aka binne na PCB da kuma tafiyar da bayan allon kewayawa.

Don inganta aikin watsar da zafi, saman da kasa yadudduka na PCB sune “wuraren zinariya”. Yi amfani da wayoyi masu faɗi kuma ka nisanta su daga na’urori masu ƙarfi don samar da hanyar zafi don ɓarkewar zafi. Kwamitin da aka keɓe na thermal hanya ce mai kyau don zubar da zafi na PCB. Thermal allon gaba ɗaya yana saman ko bayan PCB, kuma ana haɗa shi da na’urar ta hanyar haɗin tagulla kai tsaye ko ta hanyar zafi. A cikin yanayin kunshin layi (fakitoci tare da jagora a bangarorin biyu), irin wannan jirgi mai sarrafa zafi na iya kasancewa a saman PCB kuma ana siffata shi kamar “kashin kare” (tsakiyar tana kunkuntar kamar kunshin, kuma Yankin da ke nesa da kunshin yana da ƙananan ƙananan. Babba, ƙarami a tsakiya da babba a ƙarshen). A cikin yanayin kunshin gefe huɗu (akwai jagora a duk bangarorin huɗu), farantin mai sarrafa zafi dole ne a kasance a bayan PCB ko shigar da PCB.

Yadda ake amfani da PCB don zubar da zafi na fakitin IC?

Ƙara girman allon zafin jiki hanya ce mai kyau don inganta aikin zafi na kunshin PowerPAD. Girman farantin zafi daban-daban suna da babban tasiri akan aikin thermal. Takardar bayanan samfurin da aka bayar a cikin nau’i na tebur gabaɗaya yana lissafin waɗannan girman bayanan. Koyaya, yana da wahala a ƙididdige tasirin ƙarar jan ƙarfe na PCBs na al’ada. Yin amfani da wasu na’urori na kan layi, masu amfani za su iya zaɓar na’ura sannan su canza girman kushin tagulla don kimanta tasirinsa akan aikin ɓarkewar zafi na PCBs marasa JEDEC. Waɗannan kayan aikin lissafin suna nuna tasirin ƙirar PCB akan aikin thermal. Don kunshin gefe huɗu, yankin saman kushin ya yi ƙasa kaɗan fiye da yankin fallen kushin na’urar. A wannan yanayin, rufin da aka binne ko baya shine hanya ta farko don samun mafi kyawun sanyaya. Don fakitin layi-biyu, zamu iya amfani da salon kushin “kashin kare” don watsar da zafi.

A ƙarshe, ana iya amfani da tsarin tare da manyan PCBs don sanyaya. A cikin yanayin da aka haɗa sukurori zuwa farantin mai sarrafa zafi da jirgin ƙasa don zubar da zafi, wasu screws da ake amfani da su don hawan PCB kuma na iya zama ingantattun hanyoyin zafi zuwa tushen tsarin. Yin la’akari da tasirin zafi da farashi, yawan adadin ya kamata ya zama matsakaicin darajar da ta kai ga raguwar dawowa. Bayan an haɗa shi da farantin sarrafa zafi, farantin ƙarfafa PCB na ƙarfe yana da ƙarin wurin sanyaya. Ga wasu aikace-aikace inda PCB ke rufe da harsashi, nau’in kayan gyaran walda mai sarrafawa yana da mafi girman aikin zafi fiye da harsashi mai sanyaya iska. Hanyoyin kwantar da hankali, irin su magoya baya da wuraren zafi, suma hanyoyin gama gari ne don sanyaya tsarin, amma yawanci suna buƙatar ƙarin sarari ko buƙatar gyara ƙira don haɓaka tasirin sanyaya.

Don tsara tsarin da mafi girman aikin thermal, bai isa ba don zaɓar na’urar IC mai kyau da bayani mai rufewa. Ayyukan zafi na IC ya dogara da PCB da ikon tsarin zafi don kwantar da na’urorin IC da sauri. Ta amfani da hanyar sanyaya mai wucewa ta sama, ana iya inganta aikin watsar da zafi na tsarin sosai.