How to prevent sag and fracture of flexible PCB?

The neutral bent crankshaft of a flexible circuit board may not be right in the middle of the circuit stack. Proper handling of flexible circuit boards may help prevent dents and fractures in PCB fleksibel.

Flexible PCB as much as mechanical equipment as electrical equipment. Conductors should be arranged so that the whole circuit functions reliably and adequately. Unlike traditional rigid printed circuit boards (rigid PCBS), flexible PCBS can be bent, bent, and twisted to fit the final component. When bent beyond a fixed point, this bending severely strains the circuit, causing the flexible PCB to break and sag.

ipcb

The flexibility of flexible circuits gives designers a range of options that rigid PCBS lack. Even though flexible circuits are ideal for use in situations that require bending and twisting, that doesn’t mean flexible copper wiring will never crack. As with all materials, copper has limits on the type of stress and strength it can withstand.

There are all kinds of challenges. When dynamic bending (continuous bending for product use) is required, or in applications where the circuit needs to be folded into a narrow space within a multi-lane housing, precision must be maintained and extra care must be taken to avoid breaking

Optimization of flex and bending considerations for flexible circuits.

Know the stress point and bending radius

You need to understand bending, folding and bending design issues – understand the physics of bending. For single-sided flexible circuit bending, the copper layer will eventually break if it is extended or compressed beyond the bending radius or stress point. Always make sure you operate within these parameters.

Neutral axis

For dynamic flexible applications, one side (one layer copper circuit) is recommended. This provides space for the copper to move around the center of the structure at an equivalent thickness.Through this structure, the copper layer is neither compressed nor tensioned during dynamic bending or flexing.

Thinner is better

The thinner the layer, the smaller the inner bending radius, and therefore the less stress on the outer layer. For applications that require frequent bending, thinner copper and a thinner dielectric layer are preferred.

I beam design

I-beam construction is where the other sides of the copper or dielectric directly overlap each other. This type of structure becomes more robust in the folded area. Due to the compression layer of the inner layer, the outward extension force is significantly increased. To eliminate this problem, opposite marks should be staggered.

To bend or fold sharply

Many flexible circuit boards fold as part of a design suite. Well-constructed circuits can easily withstand first folds, twists or creases. However, wrinkled circuits should not fold frequently because the copper will eventually break. This is not recommended under any circumstances. To avoid this problem, some design considerations are provided. For example, flexible circuit boards with rounded corners are designed for this purpose.

Other considerations to avoid trail breakage on flexible circuits include:

Use solder or a path coated with solder

RA (rolled annealed) copper or electrodeposited copper (ED) was used, and the grain orientation was observed

Covering the bent or curved area of the polyimide film,

Use stiffeners at the bottom and cladding at the top.