Amaphakheji we-IC ancike ku- PCB ukushabalalisa ukushisa. Ngokuvamile, i-PCB iyindlela yokupholisa eyinhloko yamadivayisi aphezulu we-semiconductor. Idizayini enhle yokusabalalisa ukushisa kwe-PCB inethonya elikhulu, ingenza uhlelo lusebenze kahle, kepha futhi ingangcwaba ingozi efihliwe yezingozi ezishisayo. Ukuphathwa ngokucophelela kokuhlelwa kwe-PCB, ukwakheka kwebhodi, nokufakwa kwedivayisi kungasiza ekuthuthukiseni ukusebenza kokushiswa kokushisa kwezicelo eziphakathi nendawo namandla amakhulu.

Abakhiqizi be-Semiconductor banobunzima bokulawula amasistimu asebenzisa amadivayisi abo. Kodwa-ke, uhlelo olune-IC olufakiwe lubalulekile ekusebenzeni kwedivayisi yonke. Kumadivayisi we-IC wangokwezifiso, umklami wohlelo ngokujwayelekile usebenza eduze nomenzi ukuqinisekisa ukuthi uhlelo luhlangabezana nezidingo eziningi zokuhlakazeka kokushisa kwamadivayisi aphezulu wamandla. Lokhu kusebenzisana kokuqala kuqinisekisa ukuthi i-IC ihlangabezana namazinga kagesi nokusebenza, ngenkathi iqinisekisa ukusebenza okufanele ngaphakathi kohlelo lokupholisa lekhasimende. Izinkampani eziningi ezinkulu zama-semiconductor zithengisa amadivayisi njengezinto ezijwayelekile, futhi akukho ukuxhumana phakathi komkhiqizi nesicelo sokugcina. Kulokhu, singasebenzisa kuphela imihlahlandlela ejwayelekile ukusiza ukufezekisa isixazululo esihle sokushabalalisa ukushisa kwe-IC nohlelo.

Uhlobo lwephakeji elijwayelekile le-semiconductor alinalutho noma iphakethe le-PowerPADTM. Kula mapakeji, i-chip ibekwe kupuleti lensimbi elibizwa nge-chip pad. Lolu hlobo lwe-chip pad lusekela i-chip ngenkathi kucutshungulwa i-chip, futhi futhi luyindlela enhle yokushisa yokushabalalisa ukushisa kwedivayisi. Lapho iphakethe elingenalutho lifakwe ku-PCB, kuphuma ukushisa ngokushesha kusuka kuphakheji kuye ku-PCB. Ukushisa bese kuhlakazeka ngezingqimba ze-PCB kungene emoyeni ozungezile. Amaphakheji we-pad pad ngokuvamile adlulisa cishe ama-80% wokushisa angene ku-PCB phansi kwephakeji. Ukushisa okungu-20% okusele kukhishwa ngezintambo zedivayisi nezinhlangothi ezahlukahlukene zephakeji. Ngaphansi kuka-1% wokushisa kuphuma phezulu kwephakeji. Endabeni yamaphakeji angenalutho, ukwakheka okuhle kokushisa kokushisa kwe-PCB kubalulekile ukuqinisekisa ukusebenza kwensiza ethile.

Isici sokuqala sokuklanywa kwe-PCB esithuthukisa ukusebenza okushisayo ukwakheka kwedivayisi ye-PCB. Noma nini lapho kunokwenzeka, izingxenye zamandla aphezulu ku-PCB kufanele zihlukaniswe zodwa. Lesi sikhala somzimba phakathi kwezakhi zamandla aphezulu sandisa indawo ye-PCB ezungeze ingxenye ngayinye yamandla aphezulu, esiza ukufeza ukudluliswa okungcono kokushisa. Ukunakekelwa kufanele kuthathwe ekuhlukaniseni izingxenye ezizwelayo zokushisa ezivela kuzakhi zamandla aphezulu ku-PCB. Lapho kungenzeka khona, izingxenye zamandla aphezulu kufanele zitholakale kude namakhona we-PCB. Ukuma okuphakathi kwe-PCB kukhulisa indawo yebhodi ezungeze izinto ezinamandla amakhulu, ngaleyo ndlela kusize ukuqeda ukushisa. Umdwebo 2 ukhombisa amadivayisi amabili we-semiconductor afanayo: izingxenye A no-B. Ingxenye A, etholakala ekhoneni le-PCB, inokushisa okuhlangana nge-chip okungu-5% ngaphezulu kwengxenye B, ebekwe phakathi nendawo. Ukushiswa kokushisa ekhoneni lengxenye A kukhawulwe indawo encane yephaneli ezungeze ingxenye esetshenziselwa ukushabalalisa ukushisa.

Isici sesibili ukwakheka kwe-PCB, okunethonya eliwujuqu ekusebenzeni okushisayo komklamo we-PCB. Njengomthetho ojwayelekile, lapho i-PCB inethusi eliningi, kuyanda ukusebenza okushisayo kwezingxenye zohlelo. Isimo esifanelekile sokushabalalisa ukushisa samadivayisi we-semiconductor ukuthi i-chip ibekwe ebhulokini elikhulu lethusi elipholile uketshezi. Lokhu akusebenzi ezinhlelweni eziningi, ngakho-ke bekufanele senze ezinye izinguquko ku-PCB ukuthuthukisa ukushabalalisa ukushisa. Kuzinhlelo eziningi namuhla, inani eliphelele lohlelo liyancipha, kuthinta ukusebenza kokushabalalisa kokushisa. Ama-PCBS amakhulu anendawo engaphezulu engasetshenziselwa ukudlulisa ukushisa, kodwa futhi abe nokuguquguquka okuningi ukushiya isikhala esanele phakathi kwezakhi zamandla aphezulu.

Uma kungenzeka, khulisa inombolo nokushuba kwezingqimba zethusi ze-PCB. Isisindo sethusi lokumisa ngokuvamile sikhulu, okuyindlela enhle kakhulu yokushisa kwayo yonke ukushisa kokushisa kwe-PCB. Ukuhlelwa kwezintambo zezendlalelo nakho kukhulisa amandla adonsela phansi ethusi asetshenziselwe ukuqhuba ukushisa. Kodwa-ke, le wiring ivame ukufakwa ngogesi, inciphise ukusetshenziswa kwayo njengendawo yokushisa engaba khona. Isisekelo sedivayisi kufanele sifakwe izintambo ngogesi ngangokunokwenzeka kwizendlalelo eziningi zokusiza ngangokunokwenzeka ukusiza ukukhulisa ukuqhutshwa kokushisa. Izimbobo zokushiswa kokushisa ku-PCB engezansi kwensiza ye-semiconductor zisiza ukushisa ukufaka izingqimba ezishumekiwe ze-PCB bese zidlulisela emuva ebhodini.

Izendlalelo eziphezulu nezingezansi ze-PCB “yizindawo eziphambili” zokwenza ngcono ukupholisa ukusebenza. Kusetshenziswa izintambo ezibanzi nokuhamba umzila kude namadivayisi anamandla amakhulu kunganikeza indlela eshisayo yokushabalalisa ukushisa. Ibhodi elikhethekile lokuqhuba ukushisa kuyindlela enhle kakhulu yokushabalalisa ukushisa kwe-PCB. Ipuleti lokushisa elishisayo litholakala phezulu noma emuva kwe-PCB futhi lixhunywe ngomshini kudivayisi ngokuxhuma ngqo kwethusi noma imbobo eshisayo. Endabeni yokupakisha okusemgqeni (kuphela ngemikhondo ezinhlangothini zombili zephakeji), ipuleti lokuqhuba ukushisa lingabekwa ngaphezulu kwe-PCB, elibunjwe “njengethambo lenja” (maphakathi mncane njengephakethe, ithusi elikude nephakeji linendawo enkulu, lincane phakathi futhi likhulu emaphethelweni womabili). Endabeni yephakethe elinezinhlangothi ezine (elinemikhondo kuzo zonke izinhlangothi ezine), ipuleti lokuqhuba ukushisa kufanele libekwe ngemuva kwe-PCB noma ngaphakathi kwe-PCB.

Ukukhulisa usayizi wepuleti lokuqhuba ukushisa kuyindlela enhle kakhulu yokwenza ngcono ukushisa kwamaphakeji we-PowerPAD. Usayizi ohlukile wepuleti yokuqhuba ukushisa unethonya elikhulu ekusebenzeni okushisayo. Ishidi ledatha yomkhiqizo eliwuhlu olujwayelekile libala lezi zilinganiso. Kepha ukulinganisa umthelela wethusi elengeziwe kuma-PCBS wangokwezifiso kunzima. Ngama-calculator aku-inthanethi, abasebenzisi bangakhetha idivaysi futhi bashintshe usayizi wephedi yethusi ukulinganisa umphumela wayo ekusebenzeni okushisayo kwe-non-JEDEC PCB. Lawa mathuluzi wokubala aqokomisa izinga lapho ukwakheka kwe-PCB kunomthelela ekusebenzeni kokushabalalisa ukushisa. Kumaphakeji ezinhlangothini ezine, lapho indawo yephedi ephezulu ingaphansi nje kwendawo engenalutho yedivayisi, ukushumeka noma ungqimba lwangemuva kuyindlela yokuqala yokufeza ukupholisa okungcono. Ngamaphakheji ama-in-line amabili, singasebenzisa isitayela sephedi “inja yethambo” ukuqeda ukushisa.

Ekugcineni, amasistimu ane-PCBS emikhulu angasetshenziselwa ukupholisa. Izikulufo ezisetshenziselwa ukufaka i-PCB zinganikeza nokufinyelela okushisayo okusebenzayo esisekelweni sohlelo lapho kuxhunywe kupuleti elishisayo nongqimba lomhlabathi. Uma kubhekwa ukuhanjiswa okushisayo nezindleko, inani lezikulufo kufanele likhuliswe kuze kufike ezingeni lokuncipha kwembuyiselo. Ukuqina kwensimbi ye-PCB kunendawo epholisa kakhulu ngemuva kokuxhunywa kupuleti elishisayo. Kwezinye izinhlelo zokusebenza lapho izindlu ze-PCB zinegobolondo, impahla ye-TYPE B solder patch inokusebenza okuphezulu okushisayo kunegobolondo elipholile lomoya. Izixazululo zokupholisa, ezinjengabalandeli namaphiko, nazo zivame ukusetshenziselwa ukupholisa uhlelo, kepha zivame ukudinga isikhala esithe xaxa noma zidinga ukuguqulwa kokuklama ukukhulisa ukupholisa.

Ukuklama uhlelo olunokusebenza okuphezulu okushisayo, akwanele ukukhetha idivayisi enhle ye-IC nesisombululo esivaliwe. Ukuhlelwa kokusebenza kokupholisa kwe-IC kuncike ku-PCB namandla esistimu yokupholisa ukuvumela amadivayisi we-IC ukuthi aphole ngokushesha. Indlela yokupholisa engenziwanga eshiwo ngenhla ingathuthukisa kakhulu ukusebenza kokushabalalisa ukushisa kohlelo.