La deformazione del PCB bordo, also known as the degree of warpage, has a great influence on the welding and use. Especially for communication products, the single board is installed in a plug-in box. There is a standard spacing between the boards. With the narrowing of the panel, the gap between the components on the adjacent plug-in boards becomes smaller and smaller. If the PCB is bent, it will Affect the plugging and unplugging, it will touch the components. On the other hand, the deformation of the PCB has a great influence on the reliability of BGA components. Therefore, it is very important to control the deformation of the PCB during and after the soldering process.

(1) The degree of deformation of the PCB is directly related to its size and thickness. Generally, the aspect ratio is less than or equal to 2, and the width to thickness ratio is less than or equal to 150.

(2) Il PCB rigido multistrato è composto da lamina di rame, preimpregnato e scheda centrale. Al fine di ridurre la deformazione dopo la pressatura, la struttura laminata del PCB deve soddisfare i requisiti di progettazione simmetrica, ovvero lo spessore della lamina di rame, il tipo e lo spessore del supporto, la distribuzione degli elementi grafici (strato del circuito, piano strato) e la pressione relativa allo spessore del PCB. La linea centrale della direzione è simmetrica.

(3) Per PCB di grandi dimensioni, dovrebbero essere progettati rinforzi antideformazione o pannelli di rivestimento (chiamati anche pannelli ignifughi). Questo è un metodo di rinforzo meccanico.

(4) For partially installed structural parts that are likely to cause PCB board deformation, such as CPU card sockets, a backing board that prevents PCB deformation should be designed.