Avea o le feaveaʻiga o vaega eseese ma le hub o faʻasologa faʻailo faailoilo, PCB ua avea ma sili ona taua ma autu vaega o faʻaeletoroni faʻamatalaga oloa, lona lelei ma le faʻatuatuaina tulaga fuafuaina le lelei ma le faʻatuatuaina o le atoa masini. Peitai, ona o tau ma faʻatekinolosi mafuaʻaga, e tele naua faʻaletonu faʻafitauli i PCB gaosiga ma le faʻaogaina.

Mo lenei ituaiga o faʻaletonu faʻafitauli, tatou manaʻomia le faʻaaogaina o ni metotia masani o le faʻataʻitaʻia o le le faʻaogaina e faʻamautinoa ai le lelei ma le faʻatuatuaina tulaga o le PCB i le gaosiaina. O lenei pepa ua aoteleina ai le sefulu faʻataʻitaʻiga auiliili metotia faʻasino.

Faiga ma mafua ai suʻesuʻega o le PCB toilalo

1. Se vaʻaiga vaʻaia

Vaʻaiga vaʻaiga o le vaʻaia faʻapitoa vaʻaia pe faʻaaogaina ni mea faigaluega faigofie, e pei o microscope stereoscopic, microscope uamea poʻo faʻateleina tioata, e siaki ai foliga o PCB ma maua ai le le manuia vaega ma talafeagai faʻamaoniga tino. O le autu galuega o le sailia le le manuia ma muamua faʻamasinoina le le manuia faiga o PCB. Foliga asiasiga masani siaki PCB filogia, pala, o le nofoaga o laupapa laupapa pa, matagaluega uaea ma le masani ai o le toilalo, pe a fai o se faʻaputuga pe taʻitoʻatasi, pe e masani ona faʻalauteleina i se tasi vaega, ma isi. In addition, the failure of many PCBS was discovered after the assembly of PCBA. Whether the failure was caused by the influence of the assembly process and materials used in the process also requires careful examination of the characteristics of the failure area.

2. X-ray fluoroscopy

Mo nisi vaega e le mafai ona asiasia e foliga vaaia, faʻapea foʻi ma totonu o le PCB e ala i le pu ma isi faʻaletonu i totonu, e tatau ona tatou faʻaaogaina le X-ray fluoroscopy system e siaki ai. O le X-ray fluoroscopy system o le faʻaaogaina o mea eseese mafiafia poʻo eseese mea oona o le X-ray hygroscopicity poʻo le faʻasalalauina o mataupu eseʻese i ata. O lenei tekonolosi e sili atu faʻaaoga e siaki ai le nofoaga o faʻaletino i PCBA solder sooga, ala i pupu faʻaletonu ma faaletonu i BGA poʻo CSP masini ma maualuga density afifiina. At present, the resolution of industrial X-ray fluoroscopy equipment can reach less than one micron, and is changing from two dimensional to three dimensional imaging equipment. There are even five dimensional (5D) equipment used for packaging inspection, but this 5D X-ray fluoroscopy system is very expensive, and rarely has practical application in the industry.

3. Suʻesuʻega o vaega

Fasi fasi o le gaioiga o le mauaina PCB koluse vaega fausaga e ala i faʻataʻitaʻiga, Mose, fasi, faaiilaina, pala, vaʻaia ma se faʻasologa o metotia ma sitepu. Tele faʻamatalaga e uiga i le microstructure o PCB (ala pu, ufiufi, ma isi) mafai ona maua e ala i fasi fasi, lea e maua ai se lelei faʻavae mo le isi lelei faʻaleleia. However, this method is destructive, once the slice is carried out, the sample will inevitably be destroyed; I le taimi lava e tasi, o le metotia o faʻataʻitaʻiga manaʻoga e maualuga, faʻataʻitaʻiga sauniuniga taimi e umi foi, o le manaʻoga mo aʻoaʻoina tagata faigaluega faʻapitoa e maeʻa. For detailed slicing procedures, please refer to IPC standards IPC-TM-650 2.1.1 and IPC-MS-810.

4. Suʻesuʻe mikerosekope leo

At present, c-mode ultrasonic scanning acoustic microscope is mainly used for electronic packaging or assembly analysis. It makes use of the amplitude, phase and polarity changes generated by the reflection of high-frequency ultrasound on the discontinuous interface of materials to image, and its scanning mode is to scan the information in the X-Y plane along the Z-axis. Therefore, scanning acoustic microscopy can be used to detect various defects, including cracks, delamination, inclusions, and voids, in components, materials, and PCB and PCBA. Internal defects of solder joints can also be directly detected if the frequency width of scanning acoustics is sufficient. Of a typical scanning acoustic image in color red alert said defects exist, because a large amount of plastic packaging components used in SMT process, by a lead into the process of lead-free technology, a large number of moisture reflow sensitive problem, namely the moisture absorption of powder coating devices will be at a higher temperature reflow lead-free process occurs within or substrate layer cracking phenomenon, Under the high temperature of lead-free process, common PCB will often burst board phenomenon. Ile taimi nei, ole microscope suʻesuʻe suʻesuʻe o loʻo faʻaalia ai lona faʻapitoa faapitoa i le le maua o ni mea e faʻaaoga e tele-layer PCB maualuga. The general obvious bursting plate can be detected by visual inspection.

5. Suʻesuʻega ole microinfrared

Micro infrared auiliiliga o le infrared spectroscopy tuʻufaʻatasia ma microscope metotia metotia, e faʻaaoga ai mea eseese (e tele lava o mea totoʻa) i luga o le faʻavae o le infrared fusi o alaleo, suʻesuʻeina le tuʻufaʻatasiga tuʻufaʻatasia o mea, faʻatasi ma le microscope mafai ona vaʻaia malamalama malamalama ma malamalama infrared ma le auala malamalama, pe a lava i lalo o le vaʻaiga vaʻaia, mafai ona vaʻai mo le auiliiliga o suʻesuʻega faʻaleagaina o meaola. I le leai o se microscope, infrared spectroscopy mafai masani ona iloiloina naʻo tele tele. In many cases, trace pollution in electronic process can lead to poor weldability of PCB pad or lead pin. It can be imagined that it is difficult to solve the process problem without the matching infrared spectrum of microscope. The main use of microscopic infrared analysis is to analyze the organic pollutants on the welding surface or solder spot surface, and analyze the causes of corrosion or poor solderability.

6. Suʻesuʻe suʻesuʻega eletise microscopy

O le suʻesuʻeina o le eletise microscope (SEM) o se tasi o sili ona aoga tele-fua electron microscopic imaging system mo le le lelei suʻesuʻega. O lona galue mataupu faavae o le fausiaina o se eletise uila ma le lapoa o le sefulu i le afe o angstroms (A) e ala i le taulaʻiina o le eletise utupoto emitted mai le cathode faatelevaveina e le anode. I lalo o le gaioiga o le faʻaseʻeina o le kiliva tiliva, O le eletise utupoto vaʻai luga o le vaega faʻataʻitaʻiga e ala i le manatu i se taimi ma se faʻasologa avanoa. O le maualuga-malosi eletise eletise susulu pomuina luga o le faʻataʻitaʻiga ma gaosia ai le tele o ituaiga o faʻamatalaga, lea e mafai ona aoina ma faʻateleina ia maua eseese tutusa ata i luga o le faʻaaliga vaʻaia. The excited secondary electrons are generated within the range of 5 ~ 10nm on the surface of the sample. Therefore, the secondary electrons can better reflect the surface topography of the sample, so they are most commonly used for morphology observation. O le fiafia fiafia backscattered electrons ua gaosia i le tulaga o le 100 ~ 1000nm luga o le vaega o le faʻataʻitaʻiga, ma latou emit eseʻese uiga ma le eseʻesega o atomic numera o le vailaʻau. O le mea lea, o le backscattered electron image o loʻo i ai uiga o le morphologic ma le atomic number discrimination mafai, ma o le mea lea, o le backscattered electron image e mafai ona atagia mai le tufatufaina o vailaʻau elemeni. O le taimi nei scanner electron microscope ua matua mamana lava, soʻo se lelei fausaga poʻo luga foliga mafai ona faʻateleina i le selau ma selau o afe taimi mo matauga ma auiliiliga.

In PCB or solder joint failure analysis, SEM is mainly used for failure mechanism analysis, specifically, is used to observe the surface morphology structure of the pad, solder joint metallographic structure, measurement of intermetallic compounds, solderable coating analysis and tin must be analyzed and measured. Different from the optical microscope, the scanning electron microscope produces electronic images, so it has only black and white colors. Moreover, the sample of the scanning electron microscope is required to conduct electricity, and the non-conductor and part of the semiconductor need to be sprayed with gold or carbon, otherwise the charge will gather on the surface of the sample and affect the sample observation. I se faʻaopopoga, o le loloto o le fanua o le scanning electron microscope ata e sili atu lapoʻa nai lo o le microscope opitika, o se taua metotia mo le auʻiliʻiliga o le metotia faʻatulagaina, microscopic gau ma apa apa.

7. X-ray energy spectrum analysis

O le mea ua taʻua i luga o le siakiina o le eletise microscopy e masani ona faʻaauupegaina i le X-ray spectrometer malosi. When the high-energy electron beam hit the surface, the surface material of the inner electrons in the atoms are bombarded escape, outer electrons to low energy level transition will inspire characteristic X ray, atomic energy level difference of different elements from different characteristic X ray is different, therefore, can send sample of the characteristics of X-ray as chemical composition analysis. I le taimi lava e tasi, o mea tutusa e taua o loʻo taʻua o le spectrum dispersion spectrometer (WDS mo puʻupuʻu) ma le specterometer faataapeapeina o le malosi (EDS mo puʻupuʻu) e tusa ai ma le uiga eseʻesegavaʻa poʻo uiga mataʻina o le X-ray faʻailo faailo. O le iugafono a le spectrometer e maualuga atu nai lo le spectrometer malosiʻaga, ma o le saoasaoa auiliiliina o le malosi spectrometer e sili atu le vave nai lo o le malosi fua uila. Ona o le televave ma le maualalo o tau o spectrometers malosi, o le lautele SCANNING electron microscopy ua faʻaauupegaina i malosiʻaga spectrometers.

Faʻatasi ai ma le eseʻesega faʻataʻitaʻiga o le uila eletise, o le malosi uila e mafai ona auiliiliina le mea, laina ma le vaʻalele o le laualuga, ma maua ai faʻamatalaga o tufatufaina eseʻesega o elemeni.Point analysis yields all elements of a point; Laina auiliiliga O se elemeni auiliiliga e faia i luga o se laina faʻapitoa i taimi taʻitasi, ma le tufatufaina laina o elemene uma e maua i le tele o suʻesuʻega. Luga auiliiliga O le auʻiliʻiliga o elemeni uma i totonu o se tulaga. O le fuaina mataupu elemeni o le averesi o le tele o le laualuga fua.

In the analysis of PCB, energy dispersive spectrometer is mainly used for the composition analysis of pad surface, and the elemental analysis of contaminants on the surface of pad and lead pin with poor solderability. O le aofaʻiga auiliiliga sao o le malosi spectrometer e faʻatapulaʻaina, ma o mea i lalo ifo o le 0.1% e masani ona le faigofie ona iloa. O le tuʻufaʻatasia o le malosi o fusi o alaleo ma SEM mafai ona mauaina le faʻamatalaga o luga morphology ma le tuʻufaʻatasia i le taimi e tasi, o le mafuaʻaga ua ala ai ona latou faʻaaogaina lautele.

8. Photoelectron spectroscopy (XPS) auiliiliga

Faʻataʻitaʻiga e le X ray faʻasasaʻoina, o le pito i luga o le atigi atigi electrons o le atoma o le a sosola ese mai le faʻapologa o le ogatotonu ma mautu luga fausiaina, fuaina lona malosi malosiaga o lo o Ex, o le atigi atigi electrons o le atoma mafai ona maua le fusia malosiaga o O le Eb, o le Eb e eseʻese mai elemeni eseese ma le eseesega o le atigi electron, o le “alofilima” o le faʻailoga faʻailoaina o atoma, faʻavaeina o laina eletise o le photoelectron spectroscopy (XPS). XPS mafai ona faʻaaogaina mo agavaʻa ma aofaʻiga auiliiliga o elemeni i luga papaʻu (tele nanometers) o faʻataʻitaʻi luga. I se faʻaopopoga, faʻamatalaga e uiga i vailaʻau valence setete o elemeni mafai ona maua mai fesuiaʻiga sifi o fusifusia malosiaga. E mafai ona tuʻuina atu le faʻamatalaga o le fusi i le va o le valence tulaga o le pito i luga ma vaega o loʻo lata mai. The incident beam is X-ray photon beam, so insulation sample analysis can be carried out, without damaging the analyzed sample rapid multi-element analysis; Multilayers mafai foi ona auʻiliʻiliina umi i le argon ion stripping (vaʻai le mataupu o loʻo i lalo) ma sili atu le malamalama nai lo le malosi fusi (EDS). XPS e masani ona faʻaaogaina i le suʻesuʻega o le PCB ufiufi lelei le auiliiliina, faʻamaʻotiina faʻamaʻitaʻina ma faʻamaʻotiina faʻailoga tikeri, ina ia mafai ai ona iloa le loloto mafuaʻaga o le le lelei weldability.

9. Differential Scanning Calorim-etry

O se metotia o le fuaina o le eseʻesega o le paoa sao i le va o se vailaʻau ma se faʻasino vailaʻau o se gaioiga o le vevela (poʻo le taimi) i lalo o polokaina vevela faʻatonutonuina. DSC is equipped with two groups of compensation heating wire under the sample and reference container, when the sample in the heating process due to the thermal effect and reference temperature difference δ T, through the differential heat amplifier circuit and differential heat compensation amplifier, so that the current flowing into the compensation heating wire changes.

The temperature difference δ T disappears, and the relationship between the difference of the thermal power of the two electrically compensated samples and the reference material with temperature (or time) is recorded. According to this relationship, the physicochemical and thermodynamic properties of the material can be studied and analyzed. DSC is widely used in PCB analysis, but is mainly used to measure the curing degree of various polymer materials used in PCB and glass state transformation temperature, these two parameters determine the reliability of PCB in the subsequent process.

10. Thermomechanical analyzer (TMA)

E faʻaaogaina le Thermal Mechanical Analysis e fua ai le faʻaleagaina o mea totino, suavai ma gels i lalo o Malosiʻaga poʻo Malosiʻaga malosiaga i lalo o le polokalame faʻatonutonu o le vevela. E masani ona faʻaaogaina metotia metotia aofia ai faʻapipiʻi, pine faʻaofiina, faʻaloaloa, punou, ma isi. Suʻesuʻega suʻesuʻega aofia ai faʻamau i luga o le cantilever pou ma fesoasoani tautotogo helical, ala i le afi o le avega avega, pe a o le faʻataʻitaʻiga o le faʻaletonu foliga o loʻo tupu, eseesega transformer e vaʻaia le suiga, ma faʻatasi ma le faʻagasologa o faʻamatalaga, e pei o le vevela, mafatiaga ma faʻalavelave ina ua maeʻa e mafai ona maua le mea i lalo o le le amanaʻiaina avega deformation sootaga ma le vevela (po o le taimi). E tusa ai ma le sootaga i le va deformation ma le vevela (po o le taimi), le physicochemical ma thermodynamic meatotino o mea mafai mafai ona suesueina ma iloiloina. TMA e lautele faʻaaogaina i le PCB auiliiliga ma e masani ona faʻaaogaina i le fuaina o le sili ona taua lua tapulaʻa o PCB: laina faʻalautelega coefficient ma tioata suiga suiga. PCB ma tele tele faʻalauteleina coefficient o le a masani ona taʻitaʻia ai i le gagau toilalo o metallized pu ina ua maeʻa maopoopo ma faʻapipiʻi.