PCB的中文名称是 印刷电路板, also known as printed circuit board, is an important electronic component, so what is the basic process of PCB production? The following xiaobian will take you to understand.

PCB制造的基本流程

PCB制造的基本流程如下：内电路→层压→钻孔→孔金属化→外干膜→外电路→丝印→表面处理→后处理

内线

主要工艺流程为切割→前处理→压膜→曝光→DES→冲孔。

层压

将铜箔、半固化片和棕色内层电路板压制合成多层板。

钻孔

PCB layer to generate through hole, can achieve connectivity between layers.

孔金属化

Metallization of the non-conductor part on the hole can make the electroplating process more convenient.

The outer dry film

所需的电路通过图形转移技术暴露在干膜上。

外线

目的是使镀铜达到客户要求的厚度，完成客户要求的线型。

丝网印刷

The protective layer of the outer circuit, used to ensure the insulation, protection board, welding resistance of PCB.

流程结束后

根据客户要求进行精加工并进行测试，以确保最终的质量审核。