Ayyuka da Halayen Fim ɗin OSP a cikin Tsarin Jagoranci-Kyauta na PCB Kwafi Board

OSP (Organic Solderable Protective Film) ana ɗaukarsa a matsayin mafi kyawun tsarin jiyya na saman saboda ingantaccen solderability, tsari mai sauƙi da ƙarancin farashi.

A cikin wannan takarda, ana amfani da thermal desorption-gas chromatography-mass spectrometry (TD-GC-MS), thermogravimetric analysis (TGA) da photoelectron spectroscopy (XPS) don nazarin yanayin juriya na zafi na sabon ƙarni na fina-finai na OSP masu zafi mai zafi. Gas chromatography yana gwada ƙananan kayan aikin kwayoyin halitta a cikin fim ɗin OSP mai zafi mai zafi (HTOSP) wanda ke shafar iyawar. A lokaci guda, yana nuna cewa alkylbenzimidazole-HT a cikin fim ɗin OSP mai zafi mai zafi yana da ɗan ƙaramin ƙarfi. Bayanan TGA sun nuna cewa fim din HTOSP yana da zafi mai zafi fiye da na yanzu na masana’antu na OSP. Bayanai na XPS sun nuna cewa bayan 5 da aka sake gudana ba tare da gubar ba na OSP mai zafi, abun cikin oxygen ya karu da kusan 1%. Abubuwan haɓakawa na sama suna da alaƙa kai tsaye da buƙatun masana’antu marasa sarrafa gubar solderability.

An yi amfani da fim ɗin OSP a cikin allon kewayawa shekaru da yawa. Yana da wani organometallic polymer film kafa ta hanyar dauki na azole mahadi tare da mika mulki karfe abubuwa, kamar jan karfe da kuma zinc. Yawancin karatu [1,2,3] sun bayyana tsarin hana lalata na mahadi na azole akan saman ƙarfe. GPBrown [3] ya sami nasarar haɗa benzimidazole, jan karfe (II), zinc (II) da sauran abubuwan ƙarfe na canzawa na polymers na organometallic, kuma sun bayyana kyakkyawan juriya na zafin jiki na poly(benzimidazole-zinc) ta hanyar halayen TGA. Bayanan TGA na GPBrown ya nuna cewa lalatawar zafin jiki na poly(benzimidazole-zinc) ya kai 400 ° C a cikin iska da 500 ° C a cikin yanayi na nitrogen, yayin da lalatawar zafin jiki na poly (benzimidazole-jan karfe) ya kasance 250 ° C kawai. . Sabon fim din HTOSP da aka yi kwanan nan ya dogara ne akan abubuwan sinadarai na poly (benzimidazole-zinc), wanda ke da mafi kyawun juriya na zafi.

Fim ɗin OSP ya ƙunshi nau’ikan polymers na organometallic da ƙananan ƙwayoyin halitta waɗanda aka haɗa su yayin aiwatarwa, kamar fatty acids da mahaɗan azole. polymers na Organometallic suna ba da juriya mai mahimmanci, mannewar jan ƙarfe, da taurin saman OSP. Matsakaicin zafin jiki na organometallic polymer dole ne ya zama mafi girma fiye da wurin narkewa na mai siyar da ba ta da gubar don tsayayya da tsarin da ba shi da gubar. In ba haka ba, fim ɗin OSP zai ragu bayan an sarrafa shi ta hanyar da ba ta da gubar. Zazzaɓin zafin jiki na fim ɗin OSP ya dogara ne akan juriyar zafi na polymer organometallic. Wani muhimmin al’amari da ke shafar juriya na iskar shaka na jan karfe shine rashin daidaituwa na mahaɗan azole, irin su benzimidazole da phenylimidazole. Ƙananan ƙwayoyin na fim ɗin OSP za su ƙafe a lokacin tsarin sake gudana ba tare da gubar ba, wanda zai shafi juriya na iskar shaka na jan karfe. Gas chromatography-mass spectrometry (GC-MS), thermogravimetric analysis (TGA) da photoelectron spectroscopy (XPS) za a iya amfani da su a kimiyance don bayyana juriya na zafi na OSP.

1. Gas chromatography-mass spectrometry analysis

An rufe faranti na jan karfe da aka gwada da: a) sabon fim din HTOSP; b) fim ɗin OSP na masana’antu; da kuma c) wani fim na OSP masana’antu. Cire kimanin 0.74-0.79 MG na fim din OSP daga farantin jan karfe. Waɗannan faranti na tagulla da aka goge da samfuran da aka goge ba su yi wani magani na sake kwarara ba. Wannan gwajin yana amfani da kayan aikin H/P6890GC/MS, kuma yana amfani da sirinji ba tare da sirinji ba. sirinji marasa sirinji na iya lalata samfurori kai tsaye a cikin ɗakin samfurin. sirinji ba tare da sirinji ba zai iya canja wurin samfurin a cikin ƙaramin bututun gilashi zuwa mashigin chromatograph gas. Mai ɗaukar iskar gas na iya ci gaba da kawo mahaɗan ƙwayoyin halitta masu canzawa zuwa ginshiƙin chromatograph gas don tarawa da rabuwa. Sanya samfurin kusa da saman ginshiƙi don a iya maimaita lalatawar thermal yadda ya kamata. Bayan isassun samfurori da aka desorbed, gas chromatography ya fara aiki. A cikin wannan gwaji, an yi amfani da ginshiƙin chromatography na RestekRT-1 (0.25mmid × 30m, kauri na fim ɗin 1.0μm). Shirin hawan zafin jiki na ginshiƙin chromatography na gas: Bayan dumama a 35 ° C na minti 2, zafin jiki yana farawa zuwa 325 ° C, kuma yawan dumama shine 15 ° C / min. Yanayin narkewar thermal sune: bayan dumama a 250 ° C na minti 2. Ana gano ma’auni/cajin ma’auni na madaidaicin ma’auni na ma’auni ta hanyar yawan gani a cikin kewayon 10-700daltons. Hakanan ana yin rikodin lokacin riƙe duk ƙananan ƙwayoyin halitta.

2. Thermogravimetric analysis (TGA)

Hakazalika, wani sabon fim na HTOSP, fim ɗin OSP na masana’antu, da kuma wani fim na OSP na masana’antu an rufe su a kan samfurori. Kimanin 17.0 MG na fim din OSP an goge shi daga farantin jan karfe azaman samfurin gwajin kayan aiki. Kafin gwajin TGA, samfurin ko fim ɗin ba zai iya yin wani magani na sake kwararar dalma ba. Yi amfani da TA Instruments’2950TA don yin gwajin TGA a ƙarƙashin kariya ta nitrogen. An ajiye zafin aiki a dakin da zafin jiki na mintina 15, sa’an nan kuma ya karu zuwa 700 ° C a cikin adadin 10 ° C / min.

3. Photoelectron spectroscopy (XPS)

Photoelectron Spectroscopy (XPS), wanda kuma aka sani da Chemical Analysis Electron Spectroscopy (ESCA), hanya ce ta binciken sararin samaniya. XPS iya auna 10nm sinadaran abun da ke ciki na shafi surface. Sanya fim ɗin HTOSP da ma’aunin OSP na masana’antu akan farantin tagulla, sannan ku wuce ta 5 sake kwarara mara gubar. An yi amfani da XPS don nazarin fim ɗin HTOSP kafin da kuma bayan sake dawowa magani. Fim ɗin OSP na masana’antu na masana’antu bayan 5-free sake kwarara kuma XPS ya bincikar shi. Kayan aikin da aka yi amfani da shi shine VGESCALABMarkII.

4. Ta hanyar gwajin solderability na rami

Yin amfani da allunan gwajin solderability (STVs) don gwajin solderability ta rami. Akwai jimillar 10 solderability test board STV arrays (kowane tsararru yana da 4 STVs) mai rufi tare da kauri na fim na kusan 0.35μm, wanda 5 STV arrays an lullube shi da fim na HTOSP, da sauran 5 STV arrays suna mai rufi da daidaitattun masana’antu. OSP fim. Sa’an nan kuma, STVs masu rufaffiyar suna fuskantar jerin yanayin zafi mai zafi, jiyya marasa gubar da aka sake fitarwa a cikin tanda mai sake dawo da solder. Kowane yanayin gwaji ya haɗa da sake gudana 0, 1, 3, 5 ko 7 a jere. Akwai STVs 4 don kowane nau’in fim don kowane yanayin gwajin sake kwarara. Bayan tsarin sake kwarara, duk STVs ana sarrafa su don babban zafin jiki da kuma siyar da igiyoyin ruwa mara gubar. Za’a iya ƙayyade solderability ta hanyar-rami ta hanyar duba kowane STV da ƙididdige adadin da aka cika daidai ta ramuka. Ma’aunin karɓuwa don ta ramuka shine cewa cikewar solder dole ne a cika shi zuwa saman farantin ta cikin rami ko gefen babba na ramin.