Kuita uye Hunhu hweOSP Firimu mune Inotungamira-Yemahara Maitiro e PCB Copy Board

OSP (Organic Solderable Protective Firimu) inoonekwa seyakanyanya kunaka kurapwa maitiro nekuda kwekunaka kwayo solderability, nyore maitiro uye mutengo wakaderera.

Mupepa iri, thermo desorption-gasi chromatography-mass spectrometry (TD-GC-MS), thermogravimetric analysis (TGA) uye photoelectron spectroscopy (XPS) inoshandiswa kuongorora maitiro ekudzivirira kupisa kwechizvarwa chitsva chepamusoro tembiricha inodzivirira OSP mafirimu. Gasi chromatography inoedza madiki mamorekuru organic zvikamu mune yakakwirira tembiricha inodzivirira OSP firimu (HTOSP) inokanganisa kushambadza. Panguva imwecheteyo, inoratidza kuti alkylbenzimidazole-HT mune yakakwirira tembiricha inopikisa OSP firimu ine zvishoma kushanduka. Iyo TGA data inoratidza kuti firimu reHTOSP rine tembiricha yekudzikira kupfuura yazvino indasitiri yakajairwa OSP firimu. XPS data inoratidza kuti mushure me5 inotungamira-isina kuyerera kwepamusoro-tembiricha OSP, iyo okisijeni yemukati yakawedzera neanenge 1%. Kuvandudzwa kuri pamusoro kwakanangana nezvinodiwa zveindasitiri inotungamira-isina solderability.

Firimu reOSP rave richishandiswa mumabhodhi edunhu kwemakore mazhinji. Iyo inonzi organometallic polymer firimu inoumbwa nekuita kweazole komputa ine shanduko yesimbi zvinhu, zvakaita semhangura uye zinc. Zvidzidzo zvakawanda [1,2,3] zvakaratidza corrosion inhibition mechanism yeazole compounds panzvimbo dzesimbi. GPBrown [3] yakabudirira kugadzira benzimidazole, mhangura (II), zingi (II) uye zvimwe zvekuchinja simbi zvinhu zve organometallic polymers, uye yakatsanangura yakanakisa tembiricha yekuramba kwepoly(benzimidazole-zinc) kuburikidza neTGA hunhu. GPBrown’s TGA data inoratidza kuti kushatisa tembiricha yepoly(benzimidazole-zinc) yakakwira kusvika 400°C mumhepo uye 500°C mumhepo yenitrogen, ukuwo tembiricha yepoly(benzimidazole-copper) ingori 250°C chete. . Iyo ichangoburwa nyowani HTOSP firimu yakavakirwa pamakemikari epoly(benzimidazole-zinc), iyo ine yakanyanya kupisa kupisa.

OSP firimu rinonyanya kuumbwa ne organometallic polymers uye madiki organic mamorekuru akaiswa panguva yekuisa maitiro, akadai semafuta acids uye azole makomisheni. Organometallic polymers inopa inodiwa corrosion kuramba, kunamatira kwemhangura, uye kuoma kwepasi kweOSP. Kudzikira tembiricha ye organometallic polymer inofanirwa kunge yakakwira kupfuura nzvimbo yekunyungudika ye lead-isina solder kuti imirire iyo lead-isina maitiro. Zvikasadaro, iyo OSP firimu inodzikisira mushure mekugadzirisa neinotungamira-isina maitiro. Kudzikira tembiricha yeOSP bhaisikopo zvakanyanya zvinoenderana nekupikiswa kwekupisa kweiyo organometallic polymer. Chimwe chinhu chakakosha chinokanganisa kurwisa kwe oxidation yemhangura ndeye kushata kweazole komputa, senge benzimidazole uye phenylimidazole. Iwo mamorekuru madiki emufirimu weOSP anoputika panguva yekutungamira-isina reflow process, iyo inozokanganisa iyo oxidation kuramba kwemhangura. Gasi chromatography-mass spectrometry (GC-MS), thermogravimetric analysis (TGA) uye photoelectron spectroscopy (XPS) inogona kushandiswa kutsanangura nesainzi kupikisa kupisa kweOSP.

1. Gasi chromatography-mass spectrometry kuongorora

Mahwendefa emhangura akaedzwa akaputirwa ne: a) itsva HTOSP firimu; b) indasitiri yakajairika OSP firimu; uye c) imwe indasitiri yeOSP firimu. Nyora nezve 0.74-0.79 mg yeOSP firimu kubva mundiro yemhangura. Aya mahwendefa akavharidzirwa emhangura uye samples dzakarukwa hadzina kumborapwazve. Chiyedzo ichi chinoshandisa H/P6890GC/MS chiridzwa, uye chinoshandisa sirinji isina sirinji. Majekiseni asina-sirinji anogona kunyura zvakananga masampuli akasimba mukamuri yekuenzanisira. Sirinji isina sirinji inogona kuendesa sample mudiki girazi chubhu kuenda kunopinza kwegasi chromatograph. Iyo inotakura gasi inogona kuenderera mberi ichiunza iyo inopisa organic makomisheni kune gasi chromatograph column kuti iunganidze uye kupatsanurwa. Isa sampuli pedyo nechepamusoro pekoramu kuitira kuti kupisa kwekushisa kunogona kudzokororwa zvinobudirira. Mushure mekunge sampuli dzakakwana dzakabviswa, iyo gasi chromatography yakatanga kushanda. Mukuyedza uku, RestekRT-1 (0.25mmid×30m, ukobvu hwefirimu hwe1.0μm) gasi chromatography column yakashandiswa. Iyo tembiricha yekusimudza chirongwa chegasi chromatography column: Mushure mekupisa pa35 ° C kwemaminetsi maviri, tembiricha inotanga kukwira kusvika 2 ° C, uye mwero wekupisa i325 ° C / min. Thermal desorption mamiriro ndeiyi: mushure mekupisa pa 15 ° C kwemaminitsi maviri. Huremu/chaji reshiyo yezvakapatsanurwa volatile organic compounds inoonekwa ne mass spectrometry muhuwandu hwe250-2daltons. Nguva yekuchengetedza yeese madiki ma organic molecules inonyorwa zvakare.

2. Thermogravimetric analysis (TGA)

Saizvozvo, firimu idzva reHTOSP, indasitiri yakajairwa OSP firimu, uye imwe indasitiri yeOSP firimu yakaputirwa pamasampuli. Inenge 17.0 mg yefirimu yeOSP yakakweshwa kubva mundiro yemhangura semuyedzo wezvinhu. Pamberi pekuyedzwa kweTGA, hapana sampuli kana firimu rinogona kuitiswa chero lead-isina reflow kurapwa. Shandisa TA Instruments ‘2950TA kuita TGA bvunzo pasi pe nitrogen dziviriro. Kupisa kwekushanda kwakachengetwa pakushambidzika kwemaminetsi gumi nemashanu, ndokuzowedzera kusvika ku15 ° C pamwero we700 ° C / min.

3. Photoelectron spectroscopy (XPS)

Photoelectron Spectroscopy (XPS), inozivikanwawo seKemikari Analysis Electron Spectroscopy (ESCA), ikemikari pamusoro pekuongorora nzira. XPS inogona kuyera iyo 10nm kemikari kuumbwa kwenzvimbo yekubikira. Pfekedza iyo HTOSP firimu uye indasitiri yakajairwa OSP firimu pandiro yemhangura, uye wobva wapfuura nepakati pe5 lead-isina reflows. XPS yakashandiswa kuongorora firimu reHTOSP risati rasvika uye mushure mekurapwazve. Iyo indasitiri-yakajairwa OSP firimu mushure me5 lead-yemahara reflow yakaongororwawo neXPS. Chiridzwa chakashandiswa chaive VGESCALABMarkII.

4. Kuburikidza negomba solderability bvunzo

Kushandisa solderability test board (STVs) yekupfuura-gomba solderability bvunzo. Kune huwandu hwegumi hwekutengesa test board STV arrays (imwe neimwe ine 10 STVs) yakavharwa nehukobvu hwefirimu hunosvika 4μm, iyo 0.35 STV arrays akaputirwa neHTOSP firimu, uye mamwe mashanu eSTV arrays akaputirwa neindasitiri standard. OSP firimu. Zvadaro, maSTV akavharidzirwa anotarisana nemhando yepamusoro-yekushisa, inotungamira-isina reflow kurapwa mune solder paste reflow oveni. Yese mamiriro ebvunzo anosanganisira 5, 5, 0, 1 kana 3 anoteedzana reflows. Kune 5 maSTV emhando yega yega yefirimu kune yega yega reflow test mamiriro. Mushure mekuita reflow, ese maSTV anogadziriswa kupisa kwakanyanya uye lead-isina wave soldering. Kuburikidza ne-gomba solderability inogona kutariswa nekuongorora imwe neimwe STV uye kuverenga nhamba yekunyatsozadzwa kuburikidza nemaburi. Chiyero chekugamuchira kuburikidza nemaburi ndechekuti solder yakazadzwa inofanira kuzadzwa kumusoro kweiyo yakaputirwa neburi kana kumucheto kwepamusoro kweburi.