PCB packaging is the actual electronic components, chip and other parameters (such as the size of components, length and width, straight insert, patch, pad size, pin length and width, pin spacing, etc.) in a graphical representation, so that it can be called when drawing PCB diagram.

1) PCB packaging can be divided into mount devices, plug-in devices, mixed devices (both mount and plug-in exist at the same time) and special devices according to the installation mode. Special devices generally refer to sink plate devices.

2) PCB iepakojumu var iedalīt šādās kategorijās atbilstoši funkcijām un ierīces formām:

SMD: Virsmas stiprinājuma ierīces/ Virsmas stiprinājuma ierīces.

RA: Resistor Arrays/ Resistor.

MELF: metāla elektrodu virsmas komponenti/metāla elektrods bez svina gala komponentiem.

SOT: Small outline transistor/ Small outline transistor

SOD: Small Outline diode/ Small outline diode.

SOIC: Small outline Integrated Circuits.

Shrink Small Outline Integrated Circuits SSOIC: Shrink Small Outline Integrated Circuits

SOP: Integrētās shēmas ar nelielu kontūru paketi.

SSOP: Shrink Small Outline Package Integrated Circuits

TSOP: Thin Small Outline Package/ Thin Small Outline Package.

TSSOP: plānas saraušanās mazas kontūras iepakojums/ plānas saraušanās mazas kontūras iepakojums

SOJ: Small outline Integrated Circuits with J Leads/ “J” pins

KZP: plakani keramikas iepakojumi.

PQFP: Plastic Quad Flat Pack/ Plastic square Flat Pack

SQFP: Shrink Quad Flat Pack/ Shrink square Flat Pack.

CQFP: Keramikas kvadrātveida dzīvoklis/ keramikas kvadrātveida plakanais iepakojums.

PLCC: PlasTIc Leaded chip Carriers/PlasTIc Package.

LCC: Leadless Ceramic Chip Carriers/Leadless ceramic chip Carriers

QFN: Quad Flat non-leaded package/ four side pin less Flat package.

DIP: dual-in-line components/ Dual pin components.

PBGA: PlasTIc Ball Grid Array/PlasTIc Ball Grid Array.

RF: RF microwave devices.

AX: nepolārizēti aksiāli svina diskreti/ nepolāri aksiālie tapas diskrētie komponenti.

CPAX: Polarized capacitor, axial/ Axial pin capacitor with polarity.

CPC: Polarized capacitor, cylindrical capacitor

CYL: Non-polarized cylindrical element

DIODE: No.

LED: Light-emitting diode.

DISC: Non-polarized offset-leaded Discs/ Discrete elements with non-polarized Offset pins.

RAD: Non-polarized Radial-Leaded Discretes/ Non-polarized Radial pin discrete components.

TO: Transistors, JEDEC compaTIble types/ Transistor appearance, JEDEC component type.

VRES: Variable Resistors/Adjustable potentiometer

PGA: PlasTIc Grid Array/PlasTIc Grid Array

RELAY: RELAY/RELAY.

SIP: single-in-line components/ single-row pin components.

TRAN: Transformer/ Transformer.

PWR: Power module/ Power module.

CO: Crystal oscillator.

OPT: Optical module/Optical device.

SW: Switch/ Switch device (especially non-standard package).

IND: Inductance/ inductor (esp. Non-standard package)