பிசிபி packaging is the actual electronic components, chip and other parameters (such as the size of components, length and width, straight insert, patch, pad size, pin length and width, pin spacing, etc.) in a graphical representation, so that it can be called when drawing PCB diagram.

1) PCB packaging can be divided into mount devices, plug-in devices, mixed devices (both mount and plug-in exist at the same time) and special devices according to the installation mode. Special devices generally refer to sink plate devices.

2) PCB packaging can be divided into the following categories according to functions and device shapes:

SMD: Surface Mount Devices/ Surface Mount Devices.

RA: Resistor Arrays/ Resistor.

MELF: Metal electrode face Components/Metal electrode without lead end components.

SOT: Small outline transistor/ Small outline transistor

SOD: Small Outline diode/ Small outline diode.

SOIC: Small outline Integrated Circuits.

Shrink Small Outline Integrated Circuits SSOIC: Shrink Small Outline Integrated Circuits

SOP: Small Outline Package Integrated Circuits.

SSOP: Shrink Small Outline Package Integrated Circuits

TSOP: Thin Small Outline Package/ Thin Small Outline Package.

TSSOP: Thin Shrink Small Outline Package/ Thin Shrink Small Outline Package

SOJ: Small outline Integrated Circuits with J Leads/ “J” pins

CFP: Ceramic Flat Packs.

PQFP: Plastic Quad Flat Pack/ Plastic square Flat Pack

SQFP: Shrink Quad Flat Pack/ Shrink square Flat Pack.

CQFP: Ceramic Quad Flat Pack/ Ceramic square Flat Pack.

PLCC: PlasTIc Leaded chip Carriers/PlasTIc Package.

LCC: Leadless Ceramic Chip Carriers/Leadless ceramic chip Carriers

QFN: Quad Flat non-leaded package/ four side pin less Flat package.

DIP: dual-in-line components/ Dual pin components.

PBGA: PlasTIc Ball Grid Array/PlasTIc Ball Grid Array.

RF: RF microwave devices.

AX: Non-polarized axial-leaded Discretes/ Non-polar Axial pin discrete components.

CPAX: Polarized capacitor, axial/ Axial pin capacitor with polarity.

CPC: Polarized capacitor, cylindrical capacitor

CYL: Non-polarized cylindrical element

DIODE: No.

LED: Light-emitting diode.

DISC: Non-polarized offset-leaded Discs/ Discrete elements with non-polarized Offset pins.

RAD: Non-polarized Radial-Leaded Discretes/ Non-polarized Radial pin discrete components.

TO: Transistors, JEDEC compaTIble types/ Transistor appearance, JEDEC component type.

VRES: Variable Resistors/Adjustable potentiometer

PGA: PlasTIc Grid Array/PlasTIc Grid Array

RELAY: RELAY/RELAY.

SIP: single-in-line components/ single-row pin components.

TRAN: Transformer/ Transformer.

PWR: Power module/ Power module.

CO: Crystal oscillator.

OPT: Optical module/Optical device.

SW: Switch/ Switch device (especially non-standard package).

IND: Inductance/ inductor (esp. Non-standard package)