PCB ibhodi yokuxelisa ibhodi yekopi ye-PCB, ibhodi yekopi ye-PCB yi-clone ye-PCB, uyilo lobunjineli be-PCB. Okokuqala, amacandelo kwibhodi PCB zisuswe zenziwe BOM, kwaye ibhodi engenanto iskeniwe imifanekiso kwaye ibuyiselwe kwiifayile PCB ibhodi ukuzoba ngebhodi ukukopa software. Thumela ifayile yebhodi yePCB yokuzoba kwifektri yePCB ukwenza ibhodi (PCBA), emva koko ungeze izinto (uthenge izinto ezihambelanayo ngokweBOM), kwaye ibhodi yePCB iyafana ngqo nebhodi yePCB yoqobo.

Ngokusebenzisa iteknoloji yokukopa ye-PCB inokugqibezela nayiphi na imveliso yokulingisa, ukwenziwa kwemveliso ye-elektroniki.

Ikopi yebhodi ikwabizwa ngokuba yibhodi yotshintsho, kukuyila ibhodi ye-PCB yophando lobuchwephesha. Ngokubhekisele kwinani elikhulu lolwazi, inkqubo yokukopisha ibhodi ishwankathelwe ngolu hlobo lulandelayo:

Inyathelo lokuqala, fumana i-PCB, okokuqala ephepheni ukurekhoda onke amacandelo emodeli, iiparameter kunye nokuma, ngakumbi i-diode, ulwalathiso lombhobho amathathu, ulwalathiso lwe-IC. Kukulungele ukuthatha imifanekiso emibini yesimo se-ski ngekhamera yedijithali. Ngoku ibhodi yesekethe yePCB iqhubela phambili nangaphezulu ngaphezulu kwe-diode triode ezinye azihoyi ngokungaboni.

Inyathelo 2: Susa zonke izinto kwaye ususe i-tin kwimingxunya ye-PAD. Coca i-PCB ngotywala kwaye uyibeke kwiskena eskena iipikseli eziphakamileyo kancinci ukuze ufumane umfanekiso obukhali. Emva koko, polisha amanqwanqwa aphezulu kunye nezantsi kancinci ngephepha lomsonto wamanzi de ifilimu yobhedu ikhanye. Beka kwi-scanner, qalisa i-PHOTOSHOP, kwaye uhlambe iindawo ezihlukeneyo ngombala. Qaphela ukuba i-PCB kufuneka ibekwe ngokuthe tye kwaye ngokuthe nkqo kwiskena, kungenjalo umfanekiso ovavanyiweyo awunakusetyenziswa.

Inyathelo lesithathu, lungelelanisa umahluko kunye nomthunzi we-tovas, ukuze indawo ngefilimu yobhedu kunye nenxalenye ngaphandle kobhedu lwefilimu ngokungafaniyo, emva koko ujike umhlathana ube mnyama nomhlophe, jonga ukuba imigca icacile, ukuba akunjalo, phinda eli nyathelo. Ukuba icacile, gcina umfanekiso njengombala omnyama nomhlophe wefayile yeBMP top.bmp kunye bot.bmp. Ukuba kukho ingxaki ngomfanekiso, ungasebenzisa iPHEPHOPHOP ukuwulungisa nokulungisa.

Inyathelo lesine kukuguqula iifayile ezimbini ze-BMP zibe ziifayile ze-PROTEL ngokwahlukeneyo, kwaye ugqithise maleko mabini kwiPROTEL. Umzekelo, izikhundla ze-PAD kunye ne-VIA ezidlulile kumanqanaba amabini ngokuhambelana, zibonisa ukuba amanyathelo angaphambili enziwe kakuhle. Ukuba kukho nakuphi na ukuphambuka, phinda inyathelo lesithathu. Ke ngoko, ukukopisha ibhodi ye-PCB ngumsebenzi onomonde kakhulu, kuba ingxaki encinci iya kuchaphazela umgangatho kunye nenqanaba lokuthelekisa emva kokukopa kwebhodi.

Inyathelo 5, guqula TOP umaleko we-BMP uye kwi-TOP.PCB, qiniseka ukuguqula umaleko we-SILK, lo ngumaleko otyheli, emva koko ulandele umgca kwilayini ephezulu, kwaye ubeke isixhobo ngokomzobo wenyathelo 2. Cima umaleko weSILK emva kokupeyinta. Phinda ude ubekhona kuzo zonke izaleko.

Inyathelo 6, kwiPROTEL, tsalela umnxeba ngaphezulu. I-PCB kunye ne-bot. I-PCB, kwaye uzidibanise zibe mfanekiso mnye.

Inyathelo 7, sebenzisa umshicileli we-laser ukuprinta i-TOP LAYER kunye ne-BOTTOM LAYER kwifilimu ebonakalayo (1: 1 ratio), beka ifilimu kuloo PCB kwaye uthelekise ukuba ayilunganga, ukuba ilungile, ugqibile.

Ikopi yebhodi yoqobo yenziwe, kodwa yayenziwe ngesiqingatha kuphela. Yiba novavanyo nokuba, ukusebenza kwetekhnoloji ye-elektroniki kuvavanyo lwebhodi yokukopa kuyafana nebhodi yoqobo. Ukuba iyafana ke yenzekile.

sokumakishwa: Ukuba yibhodi enemigangatho emininzi kodwa ikwalungiswe ngononophelo ngaphakathi kumaleko angaphakathi, kwangaxeshanye phinda inyathelo lesithathu ukuya kwesihlanu lokukopa amanyathelo ebhodi, ewe, imifanekiso yemifanekiso yahlukile, ngokwe Inani leendlela zokuthatha isigqibo, ibhodi yokukopisha iphaneli ephindwe kabini ilula kakhulu kunebhodi yemigangatho emininzi, ibhodi yokukopa eyahlukeneyo ilungele ukungalungelelaniswa, Ke ibhodi yekopi yeebhodi ezininzi ikhathalela ngakumbi kwaye inyamekile (ngaphakathi kungena ngomngxunya hayi ngomngxunya kulungele iingxaki).

Ukukopa iphaneli kabini:

1. Skena iindawo ezingaphezulu nezisezantsi zebhodi yesekethe ukugcina imifanekiso emibini ye-BMP.

2. Vula i-quickPC 2005, cofa u “Ifayile” kunye no “vula isiseko” ukuvula umfanekiso ovavanyiweyo. Yandisa isikrini nge-PAGEUP, bona iphedi, beka iphedi ngokwe-PP, jonga umgca ngokolayini we-PT …… Njengomzobo womntwana, zobe kwisoftware kwaye ucofe u “Gcina” ukwenza ifayile yeB2P.

3. Cofa u “Fayile” kunye no “Vula iMephu yeSiseko” ukuvula imephu yombala wokuskena kolunye uluhlu;

4. Cofa u- “File” no- “Open” ukuvula ifayile ebigcinwe ngaphambili ye-B2P. Siyabona ukuba ibhodi esandula ukukopishwa iphakanyisiwe kulo mfanekiso-ibhodi enye ye-PCB enemingxunya kwindawo enye, kodwa unxibelelwano lwesekethe lwahlukile. Ke sicinezela “uKhetho” – “Useto lweLayer” ukucima umboniso ophezulu kunye nesilika screen apha, sishiya kuphela iindawo ezininzi zemingxunya.

5. Imingxunya ekumaleko aphezulu ikwindawo enye nemingxuma esezantsi. Ngoku sinokulandela imigca ekwindawo esezantsi njengoko senzile ebuntwaneni. Cofa u “Gcina” kwakhona – ifayile ye-B2P ngoku inayo idatha kumanqanaba aphezulu nasezantsi.

6. Cofa “Ifayile” “Rhweba ngaphandle kwiFayile yePCB”, unokufumana ifayile yePCB enamanqwanqwa amabini edatha, anokulungiswa kwibhodi okanye kumzobo weskim okanye athunyelwe ngqo kumzi-mveliso weplate yePCB kwimveliso

Indlela yokukopa yebhodi eyahlukeneyo:

In fact, the four board copy board is repeated copy two double panels, six is repeated copy three double panels…… Imigangatho iyothusa kuba asiziboni iintambo ngaphakathi. Ibhodi ebanzi ephucukileyo, siyibona njani indalo yangaphakathi? – ezahluliweyo.

Ngoku zininzi iindlela zokwenza umaleko, kukho ukubola komhlwa, isixhobo esikhululayo, kodwa kulula ukugcoba kakhulu, ukulahleka kwedatha. Amava asixelela ukuba iphepha lesandpaper lelona lichanekileyo.

Xa sigqiba ukukopa umaleko ophezulu nowezantsi we-PCB, sihlala sisebenzisa i-sandpaper ukucola umaleko womgangatho kwaye sibonise umaleko wangaphakathi. Isandpaper yi-sandpaper eqhelekileyo ethengiswa kwivenkile yehardware, ihlala ibekwa kwi-PCB, emva koko ibambe isandpaper, ngokulinganayo ihlikihlwe kwi-PCB (ukuba ibhodi incinci, nayo ingabekwa kwi-sandpaper, ngomnwe omnye wokubamba i-PCB kukhuhlwano lwesandpaper). Inqaku kukuyilungelelanisa ukuze ilingane.

Isikrini sesilika kunye neoyile eluhlaza ngokubanzi ziyacinywa, ucingo lobhedu kunye nolusu lobhedu kufuneka zisulwe amatyeli aliqela. Ukuthetha nje ngokubanzi, ibhodi yeBluetooth inokucinywa kwimizuzu embalwa, malunga nenkumbulo yemizuzu elishumi; Ewe ngamandla amakhulu, kuthatha ixesha elincinci; Amandla eentyatyambo aya kuba nexesha elingaphezulu.

Isingqengqelo sesona sisicwangciso sixhaphakileyo esisetyenzisiweyo kulwabiwo okwangoku, kodwa nolona luqoqosho lukhulu. Singafumana isiqwenga sePCB esilahliweyo ukuzama. Ngapha koko, akukho nzima ngokusesikweni ukusila ibhodi, kodwa iyadika nje. Kuthatha umzamo othile, kwaye akukho sidingo sokukhathazeka ngokugaya ibhodi kunye neminwe yakho.