PCB ibhodi lokulingisa ibhodi lekhophi le-PCB, ibhodi lekopi le-PCB liyi-clone ye-PCB, liyi-PCB design reverse engineering. Okokuqala, izingxenye ebhodini le-PCB ziyasuswa zenziwe i-BOM, futhi ibhodi elingenalutho liskenelwa ezithombeni futhi libuyiselwe kumafayili wokudweba ibhodi le-PCB ngebhodi yokukopisha isoftware. Thumela ifayili lokudweba ibhodi le-PCB efektri ye-PCB ukwenza ibhodi (i-PCBA), bese ufaka izingxenye (thenga izinto ezihambisanayo ngokuya nge-BOM), futhi ibhodi le-PCB lifana ncamashi nebhodi le-PCB lokuqala.

Ngobuchwepheshe bokukopisha be-PCB bungaqedela noma yikuphi ukulingiswa komkhiqizo we-elekthronikhi, ukuhlanganiswa komkhiqizo ngogesi.

Ikhophi lebhodi libizwa nangokuthi ibhodi lokushintsha, ukuklama ucwaningo lwe-PCB board reverse technology. Ngokubhekisele kunombolo enkulu yolwazi, inqubo yokukopisha ibhodi ifingqwe ngale ndlela elandelayo:

Isinyathelo sokuqala, thola i-PCB, okokuqala ephepheni ukurekhoda zonke izingxenye zemodeli, amapharamitha, kanye nokuma, ikakhulukazi i-diode, isiqondisi samapayipi amathathu, isiqondisi se-IC notch. Kungcono ukuthatha izithombe ezimbili zesimo se-ski ngekhamera yedijithali. Manje ibhodi lesifunda le-PCB selithuthuke kakhulu ngaphezu kwe-diode triode abanye abanaki umane bangaboni.

Isinyathelo 2: Susa zonke izinto bese ususa ithini emigodini ye-PAD. Hlanza i-PCB ngotshwala bese uyifaka kuskena eskena amaphikseli aphakeme kancane ukuthola isithombe esibukhali. Bese, pholisha izingqimba ezingenhla nezingezansi kancane ngephepha lentambo yamanzi kuze kube yilapho ifilimu yethusi icwebezela. Bafake kuskena, qala i-PHOTOSHOP, bese uxubha izingqimba zombili ngokwehlukana ngombala. Qaphela ukuthi i-PCB kufanele ibekwe ngokuvundlile nangokuqondile ku-scanner, ngaphandle kwalokho isithombe esiskeniwe ngeke sisetshenziswe.

Isinyathelo sesithathu, lungisa ukugqama nomthunzi wendwangu, ukuze ingxenye enefilimu yethusi nengxenye ngaphandle kokuqhathaniswa kwefilimu yethusi ngokuqinile, bese uphendulela isigatshana kokumnyama nokumhlophe, hlola ukuthi ngabe imigqa icacile, uma kungenjalo, phinda lesi sinyathelo. Uma kucacile, gcina isithombe njengamafomethi wefomethi ye-BMP emnyama namhlophe top.bmp kanye bot.bmp. Uma kunenkinga ngesithombe, ungasebenzisa i-PHOTOSHOP ukuyilungisa nokusilungisa.

Isinyathelo sesine ukuguqula amafayela amabili we-BMP abe amafayela we-PROTEL ngokulandelana, futhi adlulise izingqimba ezimbili zibe yi-PROTEL. Isibonelo, izikhundla ze-PAD ne-VIA ezidlulise lezi zingqimba ezimbili ngokuyisisekelo ziyafana, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma kukhona ukuphambuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopishwa kwebhodi le-PCB kungumsebenzi onesineke kakhulu, ngoba inkinga encane izothinta ikhwalithi kanye nezinga elifanayo ngemuva kokukopisha kwebhodi.

Isinyathelo 5, guqula isendlalelo se-TOP BMP siye ku-TOP.PCB, qiniseka ukuguqula ungqimba lwe-SILK, leso ungqimba oluphuzi, bese ulandela umugqa kusendlalelo se-TOP, bese ubeka idivayisi ngokusho komdwebo wesinyathelo 2. Susa ungqimba lwe-SILK ngemuva kokupenda. Phinda kuze kudwetshwe zonke izendlalelo.

Isinyathelo 6, ku-PROTEL, shayela phezulu. I-PCB ne-bot. I-PCB, bese uwahlanganisa abe munye.

Step 7, use laser printer to print the TOP LAYER and the BOTTOM LAYER to transparent film (1:1 ratio), put the film on that PCB and compare if it is wrong, if it is right, you are done.

Ikhophi yebhodi lokuqala yadalwa, kepha kwenziwa uhhafu kuphela. Yiba nokuhlolwa, nokusebenza kobuchwepheshe be-elekthronikhi okuhlola ibhodi lokukopisha kuyafana nebhodi lokuqala. Uma kuyefana-ke kusuke sekwenziwe ngempela.

bathi: Uma kuyibhodi enezingqimba eziningi kodwa futhi ipholishwe ngokucophelela ngaphakathi ngaphakathi kwesendlalelo sangaphakathi, ngasikhathi sinye phinda isinyathelo sesithathu kuya kwesesihlanu sokukopisha izinyathelo zebhodi, kunjalo, imidwebo yegama ihlukile, ngokusho inani lezendlalelo okufanele zithathe isinqumo, ibhodi yokukopisha iphaneli ephindwe kabili ilula kakhulu kunebhodi enezendlalelo eziningi, ibhodi lokukopisha elinemigqa eminingi livame ukungahambi kahle, Ngakho-ke ibhodi yamakhophi ebhodi ye-multilayer kufanele iqaphelisise futhi iqaphele (okungaphakathi kwembobo hhayi ngomgodi kuthanda ukuba nezinkinga).

Iphaneli ekopisha indlela:

1. Skena izingqimba ezingenhla nezingezansi zebhodi lesifunda ukuze ulondoloze izithombe ezimbili ze-BMP.

2. Vula i-quickPC 2005, chofoza u- “File” no- “Open Base” ukuvula isithombe eskeniwe. Khulisa isikrini nge-PAGEUP, bheka iphedi, beka iphedi ngokuya nge-PP, bona umugqa ngokuya ngomugqa we-PT …… Njengomdwebo wengane, yidonse kusoftware bese uqhafaza ku- “Save” ukwenza ifayili le-B2P.

3. Chofoza u- “File” ne- “Open Base Map” ukuvula ibalazwe lemibala yokuskena yolunye ungqimba;

4. Chofoza u- “File” no- “Open” ukuze uvule ifayela le-B2P ebeligcinwe ngaphambilini. Siyabona ukuthi ibhodi elisanda kukopishwa liphakanyiswe kulesi sithombe – ibhodi elifanayo le-PCB elinezimbobo endaweni efanayo, kepha ukuxhumana kwesifunda kuhlukile. Ngakho-ke sicindezela “Izinketho” – “Izendlalelo Zesendlalelo” ukucisha umugqa ophezulu wokubonisa nesikrini sikasilika lapha, sishiya izingqimba eziningi zemigodi.

5. Izimbobo ezisendlaleni ephezulu zisesimweni esifanayo nezimbobo ezisendlaleni engezansi. Manje sesingakwazi ukulandela imigqa kusendlalelo esingezansi njengoba senza ebuntwaneni. Chofoza u- “Save” futhi – ifayela le-B2P manje selinedatha emazingeni aphezulu naphansi.

6. Chofoza u- “File” “Export to PCB File”, ungathola ifayela le-PCB elinezendlalelo ezimbili zedatha, ezingashintshwa ebhodini noma kumdwebo wesikimu noma zithunyelwe ngqo ku-PCB plate factory ukuze zikhiqizwe

Indlela yokukopisha ibhodi enezendlalelo eziningi:

In fact, the four board copy board is repeated copy two double panels, six is repeated copy three double panels…… Izendlalelo ziyesabeka ngoba asikwazi ukubona izintambo ngaphakathi. Ibhodi elinemicu eminingi eyinkimbinkimbi, siyibona kanjani indawo yonke yayo yangaphakathi? – egqinsiwe.

Manje kunezindlela eziningi zokubeka, kukhona ukugqwala kwe-potion, ukukhishwa kwethuluzi, kepha kulula ukubeka ungqimba kakhulu, ukulahleka kwedatha. Okuhlangenwe nakho kusitshela ukuthi i-sandpaper iyona enembile kunazo zonke.

Lapho siqeda ukukopisha ungqimba ophezulu nangaphansi we-PCB, imvamisa sisebenzisa i-sandpaper ukugaya ungqimba olungaphezulu futhi sikhombise ungqimba lwangaphakathi. I-sandpaper yi-sandpaper ejwayelekile edayiswa esitolo se-hardware, imvamisa ibekwa ku-PCB, bese ibamba i-sandpaper, ngokulinganayo ihlikihliwe ku-PCB (uma ibhodi lincane, futhi lingabekwa ku-sandpaper, ngomunwe owodwa wokubamba i-PCB ku-sandpaper friction). Iphuzu ukuthi ulisheleleze ukuze lilingane.

Isikrini sikasilika namafutha aluhlaza ngokuvamile kuyasulwa, ucingo lwesethusi nesikhumba sethusi kufanele kusulwe kaningana. Ngokuvamile, ibhodi ye-bluetooth ingasulwa ngemizuzu embalwa, inkumbulo yemizuzu eyishumi; Vele, ngamandla amakhulu, kuthatha isikhathi esincane; Imbali yamandla izoba nesikhathi esithe xaxa.

IMill plate wuhlelo olujwayeleke kakhulu olusetshenziswa ekwakheni ibhande njengamanje, kepha futhi lungumnotho kakhulu. Singathola ucezu lwe-PCB elahliwe ukuzama. Eqinisweni, akunzima ngokomthetho ukugaya ibhodi, kepha kumane nje kuyisicefe. Kuthatha umzamo othile, futhi asikho isidingo sokukhathazeka ngokugaya ibhodi ngapha nangapha eminweni yakho.