Kuyini PCB ukugoqa

Izintambo ezikwi-PCB zimbozwe ngamafutha, angavimbela ukujikeleza okufushane nokulimala kwedivayisi. Okubizwa ngewindi ukususa ungqimba wopende ocingweni, ukuze ucingo luvezwe kuthayela.

Ungayakha kanjani i-PCB yokuvula iwindi le-PCB ukuthi ungayisetha kanjani ukuvula iwindi

Njengoba ukwazi ukubona esithombeni esingenhla, kungenxa yewindi. Ukuvulwa kwewindi le-PCB akuvamile, futhi okuvame kakhulu kungenzeka ukuthi kuyimodyuli yememori. Labo kini abaqaqe ikhompyutha bayazi ukuthi imodyuli yememori inomunwe owodwa wegolide, njengoba kukhonjisiwe esithombeni esingezansi:

Ungayakha kanjani i-PCB yokuvula iwindi le-PCB ukuthi ungayisetha kanjani ukuvula iwindi

Umunwe wegolide lapha usho ukuvula iwindi, ipulaki bese udlala.

Ukuvulwa kwewindi nakho kungumsebenzi ojwayelekile kakhulu, okungukuthi, i-ayina yensimbi ikhulisa ukushuba kocwecwe lwethusi esikhathini esizayo, esivumelana nesikhathi samanje eseqile, esivame ebhodini lamandla nakwibhodi lokulawula izimoto.

Vula iWindows nethusi elikhanyayo kudizayini ye-PCB

Ekudizayineni, sihlala sihlangabezana nezidingo zamakhasimende zokuvula iWindows nokukhanyisa ithusi, kepha kunzima kakhulu ukuxhumana nawo ngoba amakhasimende anolwazi oluncane noma asicaci kahle ngale nqubo. Ekudizayineni kwethu, amakhasimende ahlangana kaningi kudingeka afake ikhava yesihlangu, ipuleti onqenqemeni ithusi elikhanyayo lendawo, ngokusebenzisa imbobo evulekile yokumelana nokushisela, i-IC heat sink emuva ithusi eliveziwe, iphedi yethini eyebiwe njalonjalo. Ngokwesimo sangempela, ake sibheke ezinye zezithombe esizichazayo.

1. Ikhava yokuvikela

Uma ikhasimende lidinga ukufaka ikhava yokuvikela, okudingeka sikwenze ukufaka i-soldmask enobubanzi okungenani obuyi-1mm. Sidinga ukuqinisekisa nekhasimende ukuthi sidinga yini ukufaka anezikhala zensimbi. Lapho ufaka iSoldmask, sidinga ukubeka isikhumba sethusi senethiwekhi yomhlaba endaweni yokwengeza iSoldmask. Indiza yeSoldmask kufanele imbozwe, ngaphandle kwalokho i-substrate izodalulwa (FR4, njll.). Amanye amanethiwekhi angewona awomhlaba akufanele eqe iSoldmask. Faka indawo yeSoldmask kumphumela we-PCB ukuveza ithusi eliphuzi. Izindawo ezingafakiwe zizombozwa ngokuvinjelwa kwe-solder.

Ungaklama kanjani ukuvula iwindi le-PCB _PCB design ukuthi ungakusetha kanjani ukuvulwa kwewindi

2, Welding imbobo iwindi

Ekuklanyeni, sihlala sizwa imbobo yebhodi yonke noma umgodi wepulagi wendawo, lapho ufaka izimbobo, sinaka igama lenkampani yomgodi wepulagi livame ukufakwa i-BGA, kunalokho, ayikho i-BGA eboshwe ngefasitela lembobo (inkampani yethu incazelo). Ukucaciswa kwenkampani okujwayelekile kudlula izimbobo eziyi-12mil kufanele kube nezimbobo zewindi eziphothene.

Ungaklama kanjani ukuvula iwindi le-PCB _PCB design ukuthi ungakusetha kanjani ukuvulwa kwewindi

3, IC ukushisa ukushisa pad

Ngokuvamile, ngemuva kwe-IC ukushisa kokushisa ukushisa kungeza ifasitela le-welding (engeza i-backmask yangemuva enkulu noma elingana nephedi engaphezulu) nembobo, nangemuva kokushisela ikhava yethusi, ukuze ubeke kahle ukushisa komhlaba umgodi ngemuva kwesikhumba sethusi uphume kangcono.

Ungaklama kanjani ukuvula iwindi le-PCB _PCB design ukuthi ungakusetha kanjani ukuvulwa kwewindi

4. Ukweba amapayipi kathayela

Ku-soldering wave, ukuze kuxazululwe inkinga yokuxhuma ithini okubangelwa isikhala esiseduze samaphayiphu, sizosebenzisa uhlobo lwetadpole lwamaphakethe we-tin owebiwe. Qaphela isikhumba sethusi esilingana ne-solder okufanele sengezwe.

Ungaklama kanjani ukuvula iwindi le-PCB _PCB design ukuthi ungakusetha kanjani ukuvulwa kwewindi

Ungayibona kanjani i-tin kufasitela le-PCB wiring

Isifunda sidinga ukushayela ukudluliswa kweziteshi eziyi-8, lapho ukudluliswa kweziteshi eziningi kuvaliwe lapho ukwanda kwamanje, ukuze kuqinisekiswe umphumela wangempela, ekwandiseni umugqa wamanje ngasikhathi sinye, kunethemba lokususa ukumelana nokushisela ungqimba womugqa wamanje – ungqimba kawoyela oluhlaza, ngemuva kokuba ibhodi lenziwe, ungangeza ithini phezulu, uqine umugqa, ungadlula njengamanje.

Imiphumela yangempela imi kanje:

Ungaklama kanjani ukuvula iwindi le-PCB _PCB design ukuthi ungakusetha kanjani ukuvulwa kwewindi

Indlela yokuqalisa imi ngale ndlela elandelayo:

Mane udwebe umugqa kuToPlayer (noma bottomLayer kuye ngokuthi ungqimba olusethwe kusengaphambili lukuluphi ungqimba), bese udweba umugqa ohambisana nalo kusendlalelo se-Topsolder (noma i-solder engezansi).

Idizayini ye-PCB ukuthi ungamisa kanjani iwindi lezintambo

Idizayini ye-CB ingasetha izintambo zocingo kusendlalelo se-TOP / BOTTOM SOLDER.

Isendlalelo sika-TOP / BOTTOM SOLDER samafutha aluhlaza: Gqoka ungqimba we-TOP / BOTTOM ngamafutha we-SOLDER aluhlaza ukuvimbela ithini ekugqokeni ucwecwe lwethusi futhi ligcine ukwahlukanisa.

Ukuvinjwa kwewindi likawoyela oluhlaza kungasethwa epalini, kudlule imbobo kanye nezintambo ezingezona ezikagesi zalesi sendlalelo.

1. Ngokuzenzakalelayo, i-pad izovula iwindi ekwakhiweni kwe-PCB (OVERRIDE: 0.1016mm), okungukuthi, iphedi iveza ucwecwe lwethusi, inwebeka u-0.1016mm, futhi kuzofakwa ithini ngesikhathi sokushiswa kwegagasi. Azikho izinguquko zedizayini ezinconywayo ukuqinisekisa ukuthi i-weldability;

2. Ngokuzenzakalelayo, umgodi uzovula iwindi ekwakhiweni kwe-PCB (OVERRIDE: 0.1016mm), okungukuthi, umgodi uzoveza ucwecwe lwethusi, wandise u-0.1016mm, futhi kuzofakwa ithini ngesikhathi sokushiswa kwegagasi. Uma umklamo ukuvimbela ithini ukuthi lingangeni emgodini nethusi lingaphumi, kufanele uhlole inketho ye-PENTING kwimfanelo eyengeziwe yomgodi ku-SOLDER MASK ukuvala imbobo.

3, ngaphezu kwalokho, lolu ungqimba lungazimela ngaphandle kwezintambo zikagesi, ukumelana nokushisela uwoyela oluhlaza oluhambisana nokuvulwa kwewindi. Uma ikucingo lwe-foil wire, lusetshenziselwa ukuthuthukisa amandla wamanje wocingo, futhi kwenziwa nge-tin processing lapho kushiselwa khona; Uma ikucingo lwe-foil non-copper, ngokuvamile lwenzelwe i-logo nokuphrinta kwesikrini somlingiswa okhethekile, futhi ungqimba wokuphrinta wesikrini sohlamvu lungashiywa.