Ntawm lub khoos phis tawj nco daim npav thiab daim npav duab, peb tuaj yeem pom kab ntawm cov xim kub coj los kov, uas hu ua “ntiv tes kub”. In PCB tsim thiab tsim khoom lag luam, Cov Ntiv Tes Kub, lossis Ntug Txuas, yog siv los ua lub qhov hluav taws xob ntawm lub rooj tsavxwm los ntawm Cov Txuas Txuas Txuas. Next, let’s understand the processing method and some details of the gold finger in PCB.

Goldfinger PCB kho qhov chaw

1, electroplating nickel gold: thickness up to 3-50U “, because of its excellent conductivity, oxidation resistance and wear resistance, is widely used in the need to often plug and pull out of the goldfinger PCB or need to often carry out mechanical friction ON the PCB board, but because of the high cost of gold plating, only used in the local gold plating process such as goldfinger.

2, heavy metal, thickness of conventional 1 u “, up to 3 u “because of its superior electrical conductivity, smoothness and weldability, are widely used in such as buttons, binding IC, BGA design of high precision PCB, goldfinger PCB for wear-resisting performance requirements is not high, also can choose the whole plate zedoary process, and the process cost is electric gold process cost is much lower. Cov xim ntawm dab dej kub yog xim daj.

PCB kub ntiv tes cov ntsiab lus ua

1) Txhawm rau txhawm rau txhawm rau txhawm rau tiv thaiv cov ntiv tes kub, cov ntiv tes kub feem ntau yuav tsum tau plated nrog cov tawv tawv.

2) Cov ntiv tes kub xav tau chamfering, feem ntau yog 45 °, lwm cov ces kaum xws li 20 °, 30 °, thiab lwm yam. Yog tias tsis muaj chamfering hauv qhov tsim, muaj teeb meem; Lub 45 ° chamfering hauv PCB tau qhia hauv qab no:

3) Cov ntiv tes Golden yuav tsum tau ua tag nrho qhov thaiv qhov vuam qhov qhib qhov txheej txheem, tus lej PIN tsis tas yuav qhib cov hlau nqa;

4) Qhov tsawg kawg nkaus nrug nruab nrab ntawm cov phom-dab dej thiab cov dab dej-dab dej thiab sab saum toj ntawm tus ntiv tes yog 14mil; It is recommended that the pad should be more than 1mm away from the finger, including the through-hole pad;

5) Do not lay copper on the surface of the finger;

6) All layers of the inner layer of gold finger need to be coppered, usually with a width of 3mm; Muaj peev xwm ua tau ib nrab ntiv tes ntiv tes thiab tag nrho cov ntiv tes ntiv tes.

D: Puas yog “kub” ntawm goldfinger kub?

Ua ntej, cia peb nkag siab ob lub ntsiab lus: kub muag thiab kub tawv. Cov mos mos kub, feem ntau yog cov ntaub mos muag. Nyuaj kub, feem ntau yog sib xyaw ntawm cov tawv tawv.

The main role of gold finger is to connect, so it must have good electrical conductivity, wear resistance, oxidation resistance, corrosion resistance.

Because pure gold (gold) is relatively soft, gold fingers generally do not use gold, but just a layer of “hard gold (gold compound)”, which can not only get good electrical conductivity of gold, but also can make it wear resistance, oxidation resistance.

Yog li PCB tsis tau siv “muag kub”? Cov lus teb yog tau siv, xws li kev sib cuag ntawm qee lub xov tooj ntawm tes, cov hlau txhuas nyob ntawm THE COB (Chip On Board). Kev siv cov mos mos mos yog feem ntau npib tsib xee kub nag hauv electroplating ntawm lub rooj tsav xwm hauv Circuit Court, nws txoj kev tswj kom tuab yog ntau dua.