ka papa kaapuni i paʻi ʻia aia i loko o kahi mea hoʻopili insulate, ka papa kaapuni ponoʻī, a me nā kaula i paʻi ʻia a i ʻole nā ​​keleawe keleawe e hāʻawi ai i ka mea waena e kahe ai ka uila ma waena o ke kaapuni. Hoʻohana ʻia ka mea substrate e like me ka hoʻonani PCB e hāʻawi i ka pale uila ma waena o nā ʻaoʻao conductive. E loaʻa i kahi papa multilayer ma mua o hoʻokahi substrate e hoʻokaʻawale i nā papa. He aha kahi ʻano substrate PCB hana ʻia?

Mea hana substrate PCB

Pono e hana i ka mea substrate PCB i kahi mea hana ʻole no ka mea keakea kēia i ke ala o kēia manawa ma o ka kaapuni paʻi. I ka ʻoiaʻiʻo, ʻo ka mea substrate ka PCB insulator, e hana nei ma ke ʻano he insulator piezoelectric layer no ka pōʻai papa. Ke hoʻohui nei i nā kaula ma nā papa ʻē aʻe, hoʻohui kēlā me kēia papa o ke kaapuni ma o nā puka i uhi ʻia ma ka papa.

Hiki ke hoʻohana ʻia nā mea e like me nā substrates pono me fiberglass, teflon, ceramics a me kekahi polymers. ʻO ka substrate kaulana loa i kēia lā ʻo FR-4 paha. Fr-4 kahi laminate epoxy laminate fiberglass i mea kūʻai ʻole, hāʻawi i kahi insulator uila maikaʻi a ʻoi aku ka nui o ka pale ahi ma mua o ka fiberglass wale nō.

ʻAno substrate PCB

E ʻike ʻoe i ʻelima mau ʻano substrate PCB nui ma nā papa kaapuni i paʻi ʻia. ʻO ka ʻano substrate e hoʻohana ʻia no ka papa kaapuni paʻi kikoʻī e pili ana i kāu mea hana PCB a me ke ʻano o ka noi. ʻO nā ʻano substrate PCB penei:

Fr-2: FR-2 paha ka papa haʻahaʻa o substrate āu e hoʻohana ai, ʻoiai ʻo kāna mau pale retardant ahi, e like me ka mea i hōʻike ʻia e ka inoa FR. Hana ʻia ia mai kahi mea i kapa ʻia phenolic, kahi pepa impregnated impregnated me nā aniani olona. Hoʻohana ka uila uila mea kūʻai aku e hoʻohana i nā papa kaapuni me nā substrates FR-2.

Fr-4: ʻO kekahi o nā substrates PCB maʻa mau he substrate i ulana ʻia i fiberglass i hoʻopaʻa ʻia me kahi mea pale ahi. Eia naʻe, ʻoi aku ka ikaika ma mua o ka FR-2 a ʻaʻole haki a haki maʻalahi paha, ʻo ia ke kumu e hoʻohana ʻia ai i nā huahana kiʻekiʻe. E ʻeli i nā lua a i ʻole hana i nā olonā aniani, hoʻohana nā mea hana PCB i nā pono hana tungsten carbide ma muli o ke ʻano o ka mea.

RF: RF a i ʻole RF substrate no nā papa kaapuni i pai ʻia no ka hoʻohana ʻana i nā noi RF kiʻekiʻe. Hoʻokomo ʻia nā mea substrate i nā plastics dielectric haʻahaʻa. Hāʻawi kēia mea iā ʻoe i nā pono uila ikaika loa, akā nā waiwai mechanical nāwaliwali loa, no laila he mea nui e hoʻopilikino i ka papa RF no ke ʻano pono o ka noi.

Ka maʻalahi: ʻOiai ʻo nā papa FR a me nā ʻano o nā substrates e ʻoʻoleʻa loa, pono i kekahi mau noi e hoʻohana i nā papa maʻalahi. Hoʻohana kēia mau kaapuni maʻalahi i ka ea lahilahi, palima a i ʻole ke kiʻi ʻoniʻoni e like me ka substrate. ʻOiai paʻakikī nā papa maʻalahi i ka hana ʻana, loaʻa iā lākou kahi pono kūpono. ʻO kahi laʻana, hiki iā ʻoe ke pelu i kahi papa maʻalahi e hoʻopili i kahi i hiki ʻole i ka papa maʻamau.

Metal: Ke pili nei kāu noi i nā uila uila, pono ia i ka maikaʻi o ka conductivity mehana.ʻO kēia ka mea e hiki ai ke hoʻohana i nā substrates me nā kūpana wela haʻahaʻa (e like me ka ceramics) a i ʻole nā ​​metala e hiki ke lawelawe i nā kahe kiʻekiʻe ma nā mana uila i pai ʻia i nā papa kaapuni.