The ibhodi yesekethe eprintiweyo iqulathe i-substrate yokugquma, ibhodi yesekethe uqobo, kunye neengcingo eziprintiweyo okanye umkhondo wobhedu obonelela ngombane ohamba ngawo umbane kwisekethe. Izinto zeendawana ikwasetyenziswa njenge-PCB yokugquma ukubonelela ngombane phakathi kwamacandelo aqhubayo. Ibhodi ye-multilayer iya kuba ne-substrate engaphezulu kwesinye eyahlula iileya. Yintoni eqhelekileyo zeendawana eyenziwe PCB?

Izinto ze-PCB ze-substrate

Izinto ze-substrate ze-PCB kufuneka zenziwe ngezinto ezingahambisiyo kuba oku kuphazamisa umendo wangoku kwisekethe eprintiweyo. Ngapha koko, izinto zeendawana ze-insulator ye-PCB, esebenza njenge-piezoelectric insulator yesekethe yebhodi. Xa uqhagamshela iingcingo kwiileya ezichaseneyo, umaleko ngamnye wesekethe uqhagamshelwe kwimingxunya ebotshelelwe ebhodini.

Izinto ezinokusetyenziswa njengeziqendwana ezisebenzayo zibandakanya i-fiberglass, i-teflon, iiceramics kunye nezinye iipolymers. Eyona ndawo ithandwayo namhlanje yeyona FR-4. UFr-4 yi-fiberglass epoxy laminate engabizi kakhulu, ebonelela ngesixhobo esihle sombane kwaye ine-flame ephezulu kune-fiberglass yodwa.

Uhlobo zeendawana PCB

Uya kufumana ezintlanu eziphambili ze-PCB substrate kwiibhodi zesekethe eziprintiweyo. Luluphi uhlobo lwe-substrate oluya kusetyenziselwa ibhodi yesekethe eshicilelweyo ngqo kuxhomekeke kumenzi wakho wePCB kunye nohlobo lwesicelo. Iindidi ze-PCB substrate zezi zilandelayo:

UFr-2: I-FR-2 lelona banga liphantsi le-substrate oza kulisebenzisa, ngaphandle kwepropathi yedangatye, njengoko kubonisiwe ligama le-FR. Yenziwe kwinto ebizwa ngokuba yi-phenolic, iphepha elikhulelweyo elifakwe ngemicu yeglasi. Ixabiso eliphantsi elektroniki yabathengi lihlala lisebenzisa iibhodi zesekethe eziprintiweyo ezineefreyimu ze-FR-2.

Fr-4: Enye yezihluzi zePCB eziqhelekileyo yi-fiberglass eboshwe i-substrate ene-flame retardant. Nangona kunjalo, yomelele kune-FR-2 kwaye ayiqhekezi okanye yaphuke ngokulula, yiyo loo nto isetyenziselwa iimveliso ezinesiphelo esiphakamileyo. Ukubhola imingxunya okanye ukuhambisa iifayibha zeglasi, abavelisi bePCB basebenzisa izixhobo ze-tungsten carbide ngokuxhomekeke kubume bezinto.

I-RF: I-RF okanye i-RF substrate yeebhodi zesekethe eziprintiweyo ezilungiselelwe ukusetyenziswa kwizicelo zamandla eziphezulu zeRF. Izinto ze-substrate zenziwe ngeplastiki ye-dielectric ephantsi. Le nto ikunika iipropathi zombane ezinamandla kakhulu, kodwa zibuthathaka kakhulu iipropathi zoomatshini, ke kubalulekile ukuba ubambe ibhodi ye-RF kuhlobo olufanelekileyo lwesicelo.

Ukuba bhetyebhetye: Nangona iibhodi ze-FR kunye nezinye iintlobo ze-substrates zihlala ziqinile, ezinye izicelo zinokufuna ukusetyenziswa kweebhodi eziguqukayo. Ezi setyhula ziguquguqukayo zisebenzisa iiplastikhi ezibhityileyo, eziguqukayo okanye ifilimu njenge-substrate. Nangona iipleyiti eziguqukayo zinzima ukwenza, zinezibonelelo ezithile. Umzekelo, unokugoba ibhodi eguqukayo ukuze ulingane nesithuba ibhodi yesiqhelo engenakho.

Isinyithi: Xa isicelo sakho sibandakanya i-electronics yamandla, kufuneka ibe ne-conductivity efanelekileyo yokuqhuba.Oku kuthetha ukuba ii-substrates ezinokuxhathisa okuphantsi kwe-thermal (ezinje ngeeseramiki) okanye isinyithi esinokuphatha imisinga ephezulu yamandla iibhodi zesekethe eziprintiweyo ezinokusetyenziswa.