1. If there are many פּקב ground, SGND, AGND, GND, etc., it is necessary to use the most important “ground” as the reference to coat copper independently according to the different PCB board position. It is easy to say that digital ground and analog ground are used separately for copper coating. 5.0V, 3.3V, etc. In this way, multiple deformation structures of different shapes are formed.

2, for different single point connection, the way is through 0 ohms resistance or magnetic beads or inductance connection;

3, the crystal oscillator near the copper coating, the crystal oscillator in the circuit is a high frequency emission source, the way is to surround the crystal oscillator copper coating, and then the crystal oscillator shell separately grounded.

4, the island (dead zone) problem, if feel very big, then define a hole to add it is not much trouble.

5, in the beginning of the wiring, should be equal ground grounding, when the wire should be good, can not rely on copper coating by adding holes to eliminate the connection of the pin, this effect is very bad.

6, in the board had better not have sharp Angle (=180 degrees), because from the point of view of electromagnetism, this constitutes a transmitting antenna!

7, multi-layer middle layer of the wiring open area, do not apply copper. Because it’s very hard to make this copper pack “well grounded.”

8, the metal inside the equipment, such as metal radiator, metal reinforcement strip, must achieve “good grounding”.

9, three terminal regulator of the heat dissipation metal block, must be good grounding. The grounding isolation belt near the crystal oscillator must be well grounded. In short: the copper coating on PCB, if the grounding problem is well dealt with, it is certainly “more good than bad”, it can reduce the backflow area of the signal line, reduce the signal external electromagnetic interference.