1. Kāohi i ka hoʻonāukiuki ʻana o ka pae keleawe

Maʻalahi ke keleawe i ka hoʻoheheʻe i ka lewa, me ka hopena i ka PCB ʻAʻohe conductive a hoʻēmi paha ka padder i ka weldability, ma ke kau ʻana i ka tin ma ka pae keleawe, hiki ke hoʻokaʻawale pono ʻia ka papa keleawe mai ke kinoea, e mālama ana i ka conductivity a me ka paʻa o ka PCB.

2, e mālama i ka solder

ʻO nā ʻano hana ʻē aʻe e pili pū ana me: hoʻoheheʻe wela, ʻoniʻoni pale ʻoniʻoni ʻo OSP, kēpau piʻina, kālā kala, pōʻaiapili nickel gula, electroplating nickel gula a pēlā aku; Akā i mea e kāpīpī ai i ka papa piʻo ke kumu kūʻai maikaʻi loa o ka papa PCB papa hana o ke ʻano o ka ʻehu ʻāpana pā me ke keleawe piʻina ʻelua mau metala hiki ke hoʻopili i nā kūlana maikaʻi ʻole a ʻoi aku ka maikaʻi o ka hana solder i ke kiʻekiʻe wela a ʻoi aku ka maikaʻi o ke kaiapopo. Hoʻohana ākea kēia papa hana i nā huahana kamaʻilio hana pono hana a me nā huahana pono pūʻali koa PC-maikaʻi i hoʻomaikaʻi ʻia: ma ka hoʻomaʻamaʻa maʻamau PCB, ua ʻike ʻia ke kaʻina hana kāpīpī ʻo ia ka solderability ʻoi loa, no ka mea aia ka ipu ma ka pad, ke hoʻoheheʻe piʻo , me ka pā gula a i ʻole ka rosin a me ke kaʻina OSP, ʻoi aku ka maʻalahi. Maʻalahi loa kēia iā mākou e hoʻopaʻa lima me ka lima, ʻaʻole maʻalahi ka wili.