1. Vimbela i-oxidation yendawo engenalutho yethusi

Ithusi kulula ukwenza i-oxidize emoyeni, okuholela ekutheni PCB i-solder pad ayihambisi noma inciphisa i-weldability, ngokubeka ithini ebusweni bethusi, indawo yethusi ingahlukaniswa ngempumelelo negesi, igcine ukuqhutshwa nokusebenza kahle kwe-PCB.

2, gcina i-solder

Ezinye izindlela zokwelashwa komhlaba zifaka phakathi: ukuncibilika okushisayo, ifilimu evikelayo ye-organic, i-chemical tin, isiliva lamakhemikhali, i-nickel yamakhemikhali yegolide, i-electroplating nickel igolide njalonjalo; Kepha ukuze ufafaze i-tin plate engabizi kakhulu ye-tin tin PCB board process features of spray tin plate kufaka ne-tin tin izingqimba ezimbili zensimbi zingakwazi ukuzivumelanisa nezimo zemvelo ezingezinhle futhi ukusebenza kwe-solder kungcono ekushiseni okuphezulu futhi imvelo esonakalisayo ifaneleka kakhulu. Leli bhodi lisetshenziswa kakhulu emikhiqizweni yokuxhumana yemishini yezimboni nemikhiqizo yezinsiza zempi izinzuzo ze-tin-sprayed: ekwelashweni kwendawo ejwayelekile ye-PCB, inqubo ye-tin-sprayed yaziwa njenge-solderability enhle kakhulu, ngoba kukhona i-tin pad, lapho i-soldering tin , ngepuleti legolide noma i-rosin nenqubo ye-OSP, kulula. Lokhu kulula kakhulu kithi uku-solder ngesandla, i-welding ayilula kakhulu.