1. Thintela igcwala lobhedu obungenanto

Ubhedu kulula ukwenza ioksijini emoyeni, nto leyo ikhokelela kwisiphumo se PCB I-solder pad ayihambisi okanye inciphise ukungabinamandla, ngokubeka i-tin kumphezulu wobhedu, umphezulu wobhedu unokuhlukaniswa ngokufanelekileyo kwi-gesi, kugcinwe ukuqhuba kunye ne-weldability ye-PCB.

2, gcina i-solder

Ezinye iindlela zonyango lomphezulu zibandakanya: ukunyibilika okushushu, ifilimu ekhuselayo ye-organic, i-tin tin, imichiza yesilivere, igolide ye-nickel yegolide, i-electroplating nickel yegolide njalo njalo; Kodwa ukuze ukutshiza inkonkxa ipleyiti iindleko-olusebenzayo zokutshiza tin ibhodi inkqubo ipleyiti yokutshiza tin tin ipleyiti kuquka itoti yobhedu ezimbini maleko zentsimbi uyakwazi ukuziqhelanisa neemeko zokusingqongileyo ezihlwempuzekileyo kunye nokusebenza solder kungcono kubushushu obuphezulu kunye bume bako kufanelekile. Le bhodi isetyenziswa ngokubanzi kwimveliso yolawulo lweemveliso zonxibelelwano kunye nemveliso yezixhobo zomkhosi iingenelo ze-tin-sprayed kwi-PCB yonyango yesiqhelo, inkqubo ye-tin-sprayed yaziwa ngokuba yi-solderability efanelekileyo, kuba kukho i-tin kwi-pad, xa i-soldering tin , Ngepleyiti yegolide okanye i-rosin kunye nenkqubo ye-OSP, kulula. Oku kulula kakhulu kuthi xa sithengiswa ngesandla, i-welding ayilula kakhulu.