Ngophuhliso lwetekhnoloji yonxibelelwano, unomathotholo ophathwayo ibhodi yesekethe ephezulu Itekhnoloji isetyenziswa ngakumbi nangakumbi, njenge: i-pager engenazingcingo, iselfowuni, i-PDA engenazingcingo, njl. Olunye lweempawu eziphambili zeemveliso ezigcinwe ngesandla yi-miniaturization, kwaye i-miniaturization ithetha ukuba uxinizelelo lwezinto luphezulu kakhulu, olwenza ukuba izinto (kubandakanya i-SMD, i-SMC, i-chip engenanto, njl.) Ziphazamisane. Ukuba isiginali yokuphazamiseka yombane ayiphathwanga kakuhle, yonke inkqubo yesekethe isenokungasebenzi kakuhle. Ke ngoko, indlela yokuthintela kunye nokucinezela ukuphazamiseka kwe-electromagnetic kunye nokuphucula ukuhambelana kwe-electromagnetic kuye kwaba sisihloko esibaluleke kakhulu kuyilo lwe-PCB yesekethe ye-PCB. Isekethe efanayo, uyilo lwePCB eyahlukileyo, isalathiso sayo sokwenza siya kwahluka kakhulu. Eli phepha lixoxa ngendlela yokwandisa ukusebenza kwesekethe ukufezekisa iimfuno zokuhambelana ngombane xa usebenzisa isoftware yeProtel99 SE ukuyila i-rf yesekethe ye-PCB yeemveliso zesundu.

1. Ukukhethwa kweplate

I-substrate yebhodi yesekethe eprintiweyo ibandakanya iindidi zezinto eziphilayo nezingaphiliyo. Ezona mpawu zibalulekileyo ze-substrate zi-dielectric engagungqiyo ε R, into yokusasaza (okanye ilahleko le-dielectric) Tan δ, ukwanda komlingani we-CET kunye nokufakwa kokufuma. I-R ichaphazela ukungahambelani kwesekethe kunye nenqanaba lokuhambisa umqondiso. Kwimijikelezo ephezulu yokuhamba, ukunyamezeleka kokuvumela into yokuqala kunye neyona nto ibaluleke kakhulu ukuba iqwalaselwe, kwaye kufuneka i-substrate enokuthotyelwa kokunyamezeleka okuphantsi kufuneka.

2. Inkqubo yoyilo ye-PCB

Ngenxa yokuba isoftware yeProtel99 SE yahlukile kwiProtel 98 kunye nenye isoftware, inkqubo yoyilo lwePCB yiProtel99 SE software ixoxwa ngokufutshane.

Kungenxa yokuba iProtel99 SE yamkela iprojekhthi yolawulo lwendlela yedatha, ebekiwe kwiWindows 99, ke kuya kufuneka kuqala simisele ifayile yedatha ukulawula umzobo wesekethe kunye noyilo lwePCB.

② Uyilo lomzobo wesikimu. Ukuze uqonde unxibelelwano lwenethiwekhi, zonke izinto ezisetyenzisiweyo kufuneka zibekhona kwilayibrari yecandelo ngaphambi koyilo lomgaqo; Ngaphandle koko, izinto ezifunekayo kufuneka zenziwe kwi-SCHLIB kwaye zigcinwe kwifayile yethala leencwadi. Emva koko, ubiza ngokulula izinto ezifunekayo kwilayibrari yecandelo kwaye uzidibanise ngokomzobo wesekethe eyenziweyo.

③ Emva kokuba uyilo lwesikim lugqityiwe, itafile yenethiwekhi inokwenziwa ukuze isetyenziswe kuyilo lwePCB.

Uyilo lwe-BPCB. A. Ubume be-CB kunye nokuzimisela kwesayizi. Ubume kunye nobungakanani be-PCB zichongiwe ngokwemeko ye-PCB kwimveliso, ubungakanani kunye nokuma kwendawo kunye nokusebenzisana namanye amalungu. Zoba imilo ye-PCB usebenzisa i-PLACE TRACK command kwi-LANGER ye-MECHANICAL. B. Yenza imingxunya yokuma, amehlo kunye neendawo ekubhekiswa kuzo kwi-PCB ngokweemfuno ze-SMT. C. Ukuveliswa kwezinto. Ukuba ufuna ukusebenzisa izinto ezithile ezingekhoyo kwilayibrari yecandelo, kuya kufuneka wenze izinto ngaphambi koyilo. Inkqubo yokwenza izinto kwiProtel99 SE ilula ngokulula. Khetha umyalelo “WENZA ILayibrari” kwi “DESIGN” imenyu yokungena kwi- COMPONENT yokwenza iwindow, emva koko ukhethe i- “NEW COMPONENT” command kwi “TOOL” menu ukuya DESIGN components. Ngeli xesha, zoba i-PAD ehambelana nayo kwindawo ethile kwaye uyihlele kwi-PAD efunekayo (kubandakanya imilo, ubungakanani, ububanzi bangaphakathi kunye neAngle yePAD, njl. ISIQULATHO ESIPHAKAMILEYO ngomyalelo we-PLACE PAD njalo-njalo ngokobume kunye nobungakanani beyona nto ikhoyo. Emva koko sebenzisa i-PLACE TRACK ukuyalela ukuvela okuphezulu kwecandelo kwi-TOP OVERLAYER, khetha igama lecandelo kwaye uligcine kwilayibrari yecandelo. D. Emva kokuba kwenziwe izinto, uyilo kunye nokufaka iintambo kuya kwenziwa. La macandelo mabini aya kuxutyushwa ngokweenkcukacha apha ngezantsi. E. Jonga emva kokuba inkqubo engentla igqityiwe. Kwelinye icala, oku kubandakanya ukuhlolwa komgaqo wesekethe, kwelinye icala, kufuneka ujonge ukuhambelana kunye nokudibana komnye nomnye. Umgaqo wesekethe ungatshekishwa ngesandla okanye ngokuzenzekelayo ngenethiwekhi (inethiwekhi eyenziwe ngumzobo wesikimu unokuthelekiswa nenethiwekhi eyenziwe yi-PCB). F. Emva kokujonga, ukugcina indawo yokugcina kunye nokuvelisa ifayile. KwiProtel99 SE, kuya kufuneka usebenze i-EXPORT command kwi-FILE ukhetho lokugcina i-FILE kwindlela echaziweyo kunye ne-FILE (umyalelo wokungenisa ukungenisa i-FILE ukuya kwi-Protel99 SE). Qaphela: Kwi-Protel99 SE “FILE” ukhetho “SAVE COPY AS…” Emva kokuba ukwenziwa komyalelo, igama lefayile elikhethiweyo lingabonakali kwiWindows 98, ke ifayile ayinakubonwa kuMphathi weZibonelelo. Oku kwahlukile ku- “SAVE AS…” kwiProtel 98. Ayisebenzi ngokufanayo.

3. Uluhlu lwezinto

Ngenxa yokuba i-SMT ngokubanzi isebenzisa ubushushu be-infrared welding flow welding to welding components, ubeko lwamacandelo luchaphazela umgangatho wamalungu adibeneyo, emva koko luchaphazele imveliso. Uyilo lwe-PCB yesekethe ye-rf, ukungqinelana kombane kufuna ukuba imodyuli nganye yesekethe ayivelisi imitha ye-electromagnetic kangangoko kunokwenzeka, kwaye inesakhono esithile sokumelana nokuphazamiseka kwe-electromagnetic. Ke ngoko, ubeko lwamacandelo luchaphazela ngokuthe ngqo ukuphazamiseka kunye namandla okuchasana nesiphaluka ngokwawo, esihambelana ngqo nokusebenza kwesekethe eyiliweyo. Ke ngoko, kuyilo lwe-PCB yesekethe ye-RF, ukongeza kubeko loyilo oluqhelekileyo lwePCB, kufanelekile ukuba siqwalasele indlela yokunciphisa uphazamiseko phakathi kwezahlulo ezahlukeneyo zesekethe yeRF, indlela yokunciphisa ukuphazamiseka kwesekethe ngokwayo kwezinye iisekethe kwaye isakhono sokulwa nokuphazamiseka kwesekethe ngokwayo. Ngokwamava, umphumo wesekethe ye-rf ayixhomekekanga kuphela kwisalathiso sokusebenza kwebhodi yesekethe ye-RF uqobo, kodwa nakwindlela yokusebenzisana nebhodi yokuqhubekeka kwe-CPU ubukhulu becala. Ke ngoko, kuyilo lwe-PCB, uyilo olusengqiqweni lubaluleke ngokukodwa.

Umgaqo wobeko ngokubanzi: izinto kufuneka zicwangciswe kwicala elifanayo kangangoko kunokwenzeka, kwaye imeko ye-welding embi inokuncitshiswa okanye ithintelwe ngokukhetha ulwalathiso lwe-PCB engena kwinkqubo ye-tin melt; Ngokwamava, isithuba esiphakathi kwezinto kufuneka sibe yi-0.5mm ubuncinci ukuhlangabezana neemfuno zento yokunyibilika kwitin. Ukuba isithuba sebhodi ye-PCB siyakuvumela, isithuba phakathi kwezinto kufuneka sibanzi kangangoko kunokwenzeka. Iipaneli eziphindwe kabini, icala elinye kufuneka lenzelwe izinto ze-SMD kunye ne-SMC, kwaye elinye icala linamacandelo ahlukeneyo.

Qaphela kubume:

* Kuqala chonga indawo yamacandelo e-interface kwi-PCB kunye nezinye iibhodi ze-PCB okanye iinkqubo, kwaye unike ingqalelo kulungelelwaniso lwezinto ezibonakalayo (njengokuqhelaniswa kwezinto, njlnjl.).

* Ngenxa yomthamo omncinci weemveliso ezigcinwe ngesandla, izinto ezilungelelanisiweyo zilungelelaniswe ngendlela ehambelanayo, ke kwizinto ezinkulu, kufuneka kubekwe phambili ukumisela indawo efanelekileyo, kwaye kuthathelwe ingqalelo ingxaki yolungelelwaniso phakathi komnye nomnye.

* Uqwalaselo loqwalaselo lobume besekethe, ukuqhubekiswa kwebhloko yesekethe (njengokujikeleza kwesekethe ephezulu, ukujikeleza kwesekethe kunye nokususwa kwesekethe, njl. isekethe, gqibezela umsebenzi ofanayo wesekethe kufuneka ucwangciswe kuluhlu oluthile, ngaloo ndlela kuncitshiswe indawo yeluphu yomqondiso; Uthungelwano lokucoca indawo nganye yesekethe kufuneka luqhagamshelwe kufutshane, ukuze kungancitshiswa imitha kuphela, kodwa kunye nethuba lokuphazanyiswa kungancitshiswa, ngokokuchasana nokuphazamiseka kwesekethe.

* Isekethe yeeseli yeqela ngokobuntununtunu bayo kukuhambelana kwe-electromagnetic ekusebenziseni. Izinto zesekethe ezisemngciphekweni wokuphazamiseka kufuneka zithintele imithombo yokuphazamiseka (njengokuphazamiseka okuvela kwi-CPU kwibhodi yokulungisa idatha).

4. Iingcingo

Emva kokubekwa kwezinto, i-wiring ingaqala. Umgaqo osisiseko we-wiring ngulo: phantsi kwemeko yokuxinana kwendibano, uyilo lwe-wiring-low-density kufuneka lukhethwe kangangoko kunokwenzeka, kwaye umqondiso we-wiring kufuneka ubengqindilili kwaye ube mncinci ngangokunokwenzeka, olungele ukungqinelana kwe-impedance.

Kwisekethe ye-rf, uyilo olungenangqondo lwendlela yomgca wesiginali, ububanzi kunye nokushiyana kwemigca kunokubangela uphazamiseko phakathi kwemigca yokuhambisa isiginali; Ukongeza, inkqubo yombane ngokwayo ikwanakho nokuphazamiseka kwengxolo, ke kuyilo lwe-PCB yesekethe ye-PCB kufuneka ithathelwe ingqalelo ngokubanzi, intambo efanelekileyo.

Xa iintambo, zonke iintambo kufuneka zikude nomda weBhodi ye-PCB (malunga ne-2mm), ukuze ingabangeli okanye ibenengozi efihliweyo yokuqhekeka kweengcingo ngexesha lokuveliswa kwebhodi ye-PCB. Umtya wombane kufuneka ubanzi kangangoko kunokwenzeka ukunciphisa ukunganyangeki kweluphu. Kwangelo xesha, ulwalathiso lwelayini yamandla kunye nomgca womhlaba kufuneka uhambelane nolwalathiso lokuhambisa idatha ukuphucula amandla okuphikisana nokuphazamiseka. Imigca yesiginali kufuneka ibe mfutshane kangangoko kwaye inani lemingxunya kufuneka lincitshiswe kangangoko kunokwenzeka. Unxibelelwano olufutshane phakathi kwamacandelo, ngcono, ukunciphisa ukuhanjiswa kweeparameter kunye nokuphazamiseka kwe-electromagnetic phakathi komnye nomnye; Imigca yesiginali engahambelaniyo kufuneka ikude kude enye kwenye, kwaye uzame ukunqanda imigca efanayo, kwaye kumacala amabini aqinisekileyo okusetyenziswa kwemigca yomqondiso ethe nkqo; Iingcingo ezifuna idilesi yekona kufuneka zibe yi-135 ° ye-Angle ngokufanelekileyo, thintela ukujika ii-engile zangasekunene.

Umgca odityaniswe ngokuthe ngqo nephedi akufuneki ubanzi kakhulu, kwaye umgca kufuneka ube kude kumacandelo aqhawuliweyo kangangoko ukuphepha ukujikeleza okufutshane; Imingxunya akufuneki itsalwe kumacandelo, kwaye kufanele ukuba ikude kude nezinto ezinqanyuliweyo kangangoko kunokwenzeka ukunqanda ukuwelda okuqinisekileyo, ukuqhubekeka ngokuqhubekayo, isekethe emfutshane kunye nezinye izinto kwimveliso.

Kuyilo lwe-PCB yesekethe ye-rf, i-wiring echanekileyo yamandla ombane kunye nocingo lomhlaba lubaluleke ngokukodwa, kwaye uyilo olululo zezona ndlela zibalulekileyo zokoyisa ukuphazamiseka kombane. Imithombo emininzi yokuphazamiseka kwi-PCB iveliswa ngumbane kunye nocingo lomhlaba, phakathi kwawo ucingo lomhlaba lubangela ukuphazamiseka kwengxolo.

Esona sizathu siphambili sokuba ucingo lomhlaba kulula ukubangela ukuphazamiseka kwe-electromagnetic kukuphazamiseka kocingo lomhlaba. Xa umbane uqukuqela emhlabeni, umbane uya kwenziwa emhlabeni, okukhokelela kumphakamo womhlaba okhoyo ngoku, wenze ukuphazamiseka kweluphu emhlabeni. Xa iisekethe ezininzi zabelana ngesiqwenga esinye sentsimbi yomhlaba, ukuhlangana kwe-impedance eqhelekileyo kwenzeka, kukhokelela kwinto eyaziwa ngokuba yingxolo yomhlaba. Ke ngoko, xa ucwangcisa ucingo lwe-PCB yesekethe ye-RF, yenza:

* Okokuqala, isekethe sahlulwe ngeebhloko, i-rf yesekethe inokwahlulahlulwa ngokwandiswa kokuphindaphindeka, ukuxubana, ukuhanjiswa, ukungcangcazela kwendawo kunye nezinye iindawo, ukubonelela ngendawo ekubhekiswa kuyo kwindawo nganye yesekethe, ukuze uphawu lunokudluliselwa phakathi kweemodyuli ezahlukeneyo zesekethe. Ishwankathelwe kwindawo apho i-PCB yesekethe ye-RF idityaniswe khona emhlabeni, okt kushwankathelwe kumhlaba ophambili. Kuba inye kuphela indawo ekubhekiswa kuyo, akukho siqhelo sidibanisa i-impedance kwaye ke akukho ngxaki iphazamisana.

Indawo yedijithali kunye nendawo ye-analog kude kangangoko kunokwenzeka ngocingo lomhlaba bodwa, kunye nomhlaba wedijithali kunye nomhlaba we-analog ukwahlula, ekugqibeleni uqhagamshelwe kumhlaba wokuhambisa umbane.

* Ucingo lomhlaba kwinxalenye nganye yesekethe kufuneka luqwalasele umgaqo omnye wokunciphisa isiseko, ukunciphisa indawo yeluphu yomqondiso, kunye nedilesi yesekethe ehambelana nayo.

* Ukuba indawo iyavuma, kubhetele ukwahlula imodyuli nganye ngocingo lomhlaba ukunqanda ukusebenza komqondiso wokudibanisa phakathi komnye nomnye.

5. Isiphelo

Isitshixo loyilo lwe-PCB ye-RF silele kwindlela yokunciphisa amandla emitha kunye nendlela yokuphucula amandla okuphazamisa ukuphazamiseka. Uyilo olusengqiqweni kunye nokufaka iintambo sisiqinisekiso sokwenza i-PCB ye-RF. Indlela echazwe kweli phepha iluncedo ekuphuculeni ukuthembeka koyilo lwe-PCB yesekethe, ukusombulula ingxaki yokuphazamiseka kwe-electromagnetic, kunye nokufezekisa injongo yokuhambelana kombane.