Ngokuthuthukiswa kobuchwepheshe bezokuxhumana, umsakazo ophathwayo imvamisa yesifunda ibhodi ubuchwepheshe busetshenziswa kakhulu, njenge: i-pager engenantambo, iselula, i-PDA engenantambo, njll. Esinye sezici ezinkulu zale mikhiqizo ephathwa ngesandla yi-miniaturization, futhi i-miniaturization isho ukuthi ukuminyana kwezinto kuphakeme kakhulu, okwenza izingxenye (kufaka phakathi i-SMD, i-SMC, i-chip engenalutho, njll.) Ziphazamisane kakhulu. Uma isignali yokuphazanyiswa ngogesi ingaphathwa kahle, lonke uhlelo lwesifunda kungenzeka lungasebenzi kahle. Ngakho-ke, ukuthi ungavimba kanjani futhi ucindezele ukuphazanyiswa kwamandla kagesi futhi uthuthukise ukuhambisana kwe-electromagnetic sekuyisihloko esibaluleke kakhulu ekwakhiweni kwe-PCB yesifunda se-PCB. Isifunda esifanayo, isakhiwo se-PCB esihlukile, inkomba yokusebenza kwayo izohluka kakhulu. Leli phepha likhuluma ngendlela yokukhulisa ukusebenza kwesekethe ukufeza izidingo zokuhambisana kagesi lapho usebenzisa isoftware yeProtel99 SE ukuklama i-PCB yesifunda ye-PCB yemikhiqizo yesundu.

1. Ukukhethwa kwepuleti

I-substrate yebhodi lesifunda eliphrintiwe lifaka imikhakha yemvelo nezinto ezingaphili. Izici ezibaluleke kakhulu ze-substrate yi-dielectric njalo ε R, isici sokuqothula (noma ukulahleka kwe-dielectric) iTan δ, i-CET coefficient coefficient coefficient kanye nokumuncwa komswakama. ε R ithinta impedance yesifunda kanye nesilinganiso sokudluliswa kwesiginali. Kumasekethe amvamisa kakhulu, ukubekezelelana kokuvunyelwa yisici sokuqala nesibucayi kakhulu okufanele usicabangele, futhi kufanele kukhethwe i-substrate enokubekezelelana kokuvumela okuphansi.

2. inqubo PCB design

Ngoba isoftware ye-Protel99 SE yehlukile kwi-Protel 98 kanye nenye i-software, inqubo yokwakhiwa kwe-PCB yi-Protel99 SE software ixoxwa kafushane.

① Ngoba iProtel99 SE yamukela ukuphathwa kwemodi yedatha yePROJECT, efakwe kuWindows 99, ngakho-ke kufanele siqale ukusetha ifayili ledatha ukuphatha umdwebo wesifunda wesakhiwo nokuhlelwa kwe-PCB okwenzelwe.

② Idizayini yomdwebo wesikimu. Ukuze ubone ukuxhumeka kwenethiwekhi, zonke izinto ezisetshenzisiwe kumele zibe khona kulabhulali yezakhi ngaphambi kokuklanywa komthetho; ngaphandle kwalokho, izinto ezidingekayo kufanele zenziwe nge-SCHLIB futhi zigcinwe kufayela lomtapo wolwazi. Ngemuva kwalokho, umane ushayele izinto ezidingekayo kusuka kumtapo wezincwadi bese uzixhuma ngokomdwebo wesekethe owenzelwe.

③ Ngemuva kokuthi ukwakheka okuhlelekile sekuqediwe, kungakhiwa itafula lenethiwekhi ukuze lisetshenziswe ekwakhiweni kwe-PCB.

Idizayini ye-BPCB. A. Ukuma kwe-CB nokuzimisela kosayizi. Ukuma nosayizi we-PCB kunqunywa ngokuya ngesikhundla se-PCB kumkhiqizo, ubukhulu nobukhulu besikhala nokubambisana nezinye izingxenye. Dweba ukwakheka kwe-PCB usebenzisa umyalo we-PLACE TRACK ku-LAYER MECHANICAL. B. Yenza izimbobo zokubeka, amehlo nezindawo zokubhekisela ku-PCB ngokuya ngezidingo ze-SMT. C. Ukukhiqizwa kwezingxenye. Uma udinga ukusebenzisa ezinye izinto ezikhethekile ezingekho kulabhulali yento, udinga ukwenza izinto ngaphambi kokuhlelwa. Inqubo yokwenza izinto ku-Protel99 SE ilula kakhulu. Khetha umyalo othi “MAKE LIBRARY” kumenyu ye- “DESIGN” ukuze ufake iwindi LOKWENZA, bese ukhetha umyalo we- “NEW COMPONENT” kumenyu ye- “TOOL” YOKUDALULA izingxenye. Ngalesi sikhathi, vele udwebe i-PAD ehambisanayo endaweni ethile bese uyihlela ku-PAD edingekayo (kufaka phakathi ukuma, usayizi, ububanzi bangaphakathi ne-Angle ye-PAD, njll., Bese umaka igama lephini elihambisanayo le-PAD) ku Isendlalelo esiphakeme ngomyalo we-PLACE PAD njalonjalo ngokuya ngesimo nosayizi wento yangempela. Ngemuva kwalokho sebenzisa umyalo we-PLACE TRACK ukudweba ukubonakala okuphezulu kwengxenye ku-TOP OVERLAYER, khetha igama lengxenye bese uligcina kumtapo wezincwadi. D. Ngemuva kokuthi izinto zenziwe, ukwakheka nentambo kuzokwenziwa. Lezi zingxenye ezimbili kuzoxoxwa ngazo ngokuningiliziwe ngezansi. E. Hlola ngemuva kokuthi inqubo engenhla isiqediwe. Ngakolunye uhlangothi, lokhu kufaka ukuhlolwa komgomo wesifunda, ngakolunye uhlangothi, kuyadingeka ukuhlola ukufana nokuhlangana komunye nomunye. Isimiso sesifunda singahlolwa ngesandla noma nge-othomathikhi ngenethiwekhi (inethiwekhi eyakhiwe ngomdwebo wesikimu ingaqhathaniswa nenethiwekhi eyakhiwe yi-PCB). F. Ngemuva kokubheka, gcina umlando bese ukhipha ifayili. Ku-Protel99 SE, kufanele usebenzise umyalo we-EXPORT kunketho ye-FILE ukusindisa i-FILE kundlela ebekiwe kanye ne-FILE (umyalo we-IMPORT ukungenisa i-FILE ku-Protel99 SE). Qaphela: Kukhetho lwe-Protel99 SE “FILE” “LONDOLOZA AMAKHOPHI AS…” Ngemuva kokuthi umyalo usetshenzisiwe, igama lefayela elikhethiwe alibonakali ku-Windows 98, ngakho-ke ifayela alikwazi ukubonwa kuMphathi Wezinsizakusebenza. Lokhu kwehlukile ku- “SAVE AS…” kuProtel 98. Akusebenzi ngokufana ncamashi.

3. Izakhiwo zezakhiwo

Ngenxa yokuthi i-SMT ngokuvamile isebenzisa ukushisela kwesithando sokushisa kokushisa kwe-infrared kwizakhi ze-weld, ukwakheka kwezingxenye kuthinta ikhwalithi yamajoyini we-solder, bese kuthinta isivuno semikhiqizo. Ngokuklanywa kwe-PCB kwesifunda se-rf, ukuhambelana kwe-electromagnetic kudinga ukuthi imodyuli ngayinye yesekethe ayikhiqizi imisebe kagesi ngangokunokwenzeka, futhi inamandla athile okumelana nokuphazamiseka kwe-electromagnetic. Ngakho-ke, ukwakheka kwezingxenye nakho kuthinta ngqo ukuphazamiseka namandla okulwa nokuphazamiseka wesekethe uqobo, nakho okuhlobene ngqo nokusebenza kwesekethe eyenzelwe. Ngakho-ke, ekwakhiweni kwe-PCB yesifunda i-PCB, ngaphezu kokuhlelwa kokuklanywa kwe-PCB ejwayelekile, kufanele futhi sicabangele ukuthi singakunciphisa kanjani ukuphazanyiswa phakathi kwezingxenye ezahlukahlukene zesekethe le-RF, ukuthi ungakunciphisa kanjani ukuphazanyiswa kwesifunda uqobo kwamanye amasekethe futhi ikhono lokulwa nokuphazamiseka kwesekethe uqobo. Ngokwesipiliyoni, umphumela wesifunda se-rf awuxhomekile kuphela kunkomba yokusebenza yebhodi lesifunda le-RF uqobo, kepha nasekusebenzisaneni nebhodi lokucubungula le-CPU ngezinga elikhulu. Ngakho-ke, ekwakhiweni kwe-PCB, ukwakheka okunengqondo kubaluleke kakhulu.

Jikelele isakhiwo isimiso: izingxenye kufanele ihlelwe ohlangothini olufanayo ngangokunokwenzeka, futhi okubi Welding mkhuba kungancishiswa noma ngisho kugwenywe ngokukhetha isiqondiso PCB kokungena tin melt uhlelo; Ngokwesipiliyoni, isikhala esiphakathi kwezinto kufanele okungenani sibe ngu-0.5mm ukuhlangabezana nezidingo zezinto zokuncibilikisa ithini. Uma isikhala sebhodi le-PCB livumela, isikhala esiphakathi kwezinto kufanele sibe sikhulu ngangokunokwenzeka. Kumaphaneli aphindwe kabili, uhlangothi olulodwa kufanele lwenzelwe izingxenye ze-SMD ne-SMC, kanti olunye uhlangothi luyizinto ezihlukile.

Qaphela kusakhiwo:

* Okokuqala thola isikhundla sezinto zesixhumi esibonakalayo ku-PCB namanye amabhodi we-PCB noma amasistimu, futhi unake ukuhlanganiswa kwezingxenye zesikhombimsebenzisi (njengokuma kwezinto, njll.).

* Ngenxa yomthamo omncane wemikhiqizo ephathwa ngesandla, izingxenye zihlelwe ngendlela ehambisanayo, ngakho-ke ezintweni ezinkulu, kufanele kubekwe kuqala ukunquma indawo efanelekile, futhi kubhekwe nenkinga yokusebenzisana phakathi komunye nomunye.

* Ukuhlaziywa ngokucophelela kwesekethe, ukwenziwa kwebhulokhi yesekethe (njenge-high frequency amplifier circuit, isifunda sokuxuba nesekethe lokwehlisa amazinga, njll.), ngangokunokwenzeka ukwahlukanisa isignali yamanje esindayo nesiginali yamanje ebuthakathaka, isekethe yesiginali yedijithali ehlukile nesiginali ye-analog isekethe, uqedele umsebenzi ofanayo wesifunda kufanele uhlelwe ebangeni elithile, ngaleyo ndlela unciphise indawo yeluphu yesiginali; Inethiwekhi yokuhlunga yengxenye ngayinye yesifunda kufanele ixhunywe eduze, ukuze kungancishiswa imisebe kuphela, kepha futhi namathuba okuphazamiseka anciphiswe, ngokusho kwekhono lokulwa nokuphazamiseka kwesifunda.

* Amaqoqo amasekeli weseli ngokuya ngozwelo lwawo ekusebenzisaneni kagesi okusetshenziswayo. Izinto zesekethe ezisengozini yokuphazamiseka kufanele futhi zigweme imithombo yokuphazamiseka (njengokuphazamiseka okuvela kwi-CPU ebhodini lokucubungula idatha).

4. Ukuxhuma

Ngemuva kokuthi izingxenye zibekiwe, izintambo zingaqala. Umgomo oyisisekelo wokuhlanganisa izintambo uthi: ngaphansi kwesimo sokuminyana, ukwakheka kwentambo esezingeni eliphansi kufanele kukhethwe ngangokunokwenzeka, futhi ukuxhuma izintambo kufanele kube kukhulu futhi kube mncane ngangokunokwenzeka, okulungele ukufaniswa kwe-impedance.

Okwesekethe ye-rf, ukwakheka okungenangqondo kokuqondiswa komugqa wesiginali, ububanzi nokuhlukaniswa kwemigqa kungadala ukuphazamiseka phakathi kolayini bokudlulisa isignali; Ngaphezu kwalokho, amandla kagesi uqobo nawo akhona ukuphazanyiswa komsindo, ngakho-ke ekwakhiweni kwe-PCB yesifunda i-PCB kufanele kubhekwe njengokuqondakalayo, wiring enengqondo.

Lapho kuhlanganiswa izintambo, yonke i-wiring kufanele ibe kude nomngcele webhodi le-PCB (cishe u-2mm), ukuze ingabangeli noma ibe nengozi efihliwe yokwephuka kocingo ngesikhathi sokukhiqizwa kwebhodi le-PCB. Intambo yamandla kufanele ibe banzi ngangokunokwenzeka ukunciphisa ukumelana kweluphu. Ngasikhathi sinye, ukuqondiswa kolayini wamandla nolayini womhlabathi kufanele kuhambisane nesiqondiso sokudluliswa kwedatha ukuthuthukisa ikhono lokulwa nokuphazamiseka. Olayini bezimpawu kufanele babe mfushane ngangokunokwenzeka futhi nenani lezimbobo kufanele lehliswe ngangokunokwenzeka. Uma kufushane ukuxhumana phakathi kwezinto, kungcono, ukunciphisa ukusatshalaliswa kwemingcele nokuphazamiseka kwe-electromagnetic phakathi komunye nomunye; Olayini besiginali abangahambelani kufanele babe kude komunye nomunye, futhi bazame ukugwema imigqa efanayo, nasezinhlangothini ezimbili ezinhle zokusetshenziswa kwemigqa yesiginali emi mpo; Izintambo ezidinga ikheli lekona kufanele zibe yi-135 ° Angle njengoba kufanele, gwema ukujika ama-engeli angakwesokudla.

Ulayini oxhumene ngqo nephedi akufanele ube banzi kakhulu, futhi ulayini kufanele ube kude nezinto ezinqanyuliwe ngangokunokwenzeka ukugwema isekhethi elifushane; Imigodi akufanele idonswe ezintweni, futhi kufanele ibe kude nezinto ezinqanyuliwe ngangokunokwenzeka ukugwema ukufakwa kwe-virtual, i-welding eqhubekayo, isifunda esifushane nezinye izinto ekukhiqizeni.

Ekuklanyweni kwe-PCB kwesifunda se-rf, i-wiring efanele yamandla kagesi nentambo yomhlabathi ibaluleke kakhulu, futhi ukwakheka okunengqondo kuyindlela ebaluleke kakhulu yokunqoba ukuphazanyiswa ngogesi. Imithombo eminingi yokuphazamiseka kwi-PCB yenziwa ngamandla kagesi nangocingo lomhlabathi, phakathi kwalapho ucingo lomhlabathi lubangela ukuphazamiseka komsindo kakhulu.

Isizathu esiyinhloko sokuthi kungani ucingo oluphansi kulula ukudala ukuphazanyiswa kwamandla kagesi yi-impedance yocingo lomhlabathi. Lapho i-current igeleza phansi, kuzokhiqizwa i-voltage emhlabathini, okuholele ekutheni kube khona i-loop yomhlaba manje, yenze ukuphazanyiswa kwe-loop komhlaba. Lapho amasekethe amaningi abelana ngocezu olulodwa lwentambo yomhlabathi, ukuhlangana kwe-impedance okuvamile kwenzeka, okuholela kulokho okwaziwa njengomsindo womhlabathi. Ngakho-ke, lapho ubeka izintambo zocingo lomhlabathi we-PCB wesifunda se-RF, yenza:

* Okokuqala, isekethe lihlukaniswe ngamabhulokhi, isifunda se-rf singahlukaniswa ngokulingene sibe yi-high frequency amplification, ukuxuba, ukunciphisa amandla omzimba, ukudlidliza kwasendaweni nezinye izingxenye, ukuhlinzeka ngendawo okuvame ukubhekiswa kuyo esifundeni ngasinye sesifunda, ukuze isignali ingadluliselwa phakathi kwamamojula wesifunda ahlukile. Ngemuva kwalokho kufingqwa endaweni lapho i-RF yesifunda i-PCB ixhunywe khona emhlabathini, okusho ukufingqwa emhlabathini omkhulu. Njengoba kunephuzu elilodwa kuphela, akukho ukuhlangana kwe-impedance okuvamile ngakho-ke ayikho inkinga yokuphazanyiswa mutual.

* Indawo yedijithali nendawo ye-analog kuze kufike lapho kungahlukaniswa khona ngocingo lomhlabathi, nomhlabathi wedijithali nomhlabathi we-analog ukuhlukanisa, ekugcineni kuxhunywe endaweni yokuphakelwa kwamandla.

* Intambo yomhlabathi engxenyeni ngayinye yesifunda kufanele futhi inake umgomo owodwa wokubeka iphuzu, inciphise indawo yeluphu yesiginali, nekheli lesifunda lokuhlunga elihambisanayo eliseduze.

* Uma isikhala sivuma, kungcono ukuhlukanisa imodyuli ngayinye ngocingo lomhlabathi ukuvimbela umphumela wokuhlangana kwesiginali phakathi komunye nomunye.

5. Isiphetho

Ukhiye wedizayini ye-RF PCB ilele ekutheni ungawanciphisa kanjani amandla emisebe nokuthi ungalithuthukisa kanjani ikhono lokulwa nokuphazamiseka. Ukuhlelwa okunengqondo nokuxhuma izintambo kuyisiqinisekiso SOKWENZA I-RF PCB. Indlela echazwe kuleli phepha iyasiza ekuthuthukiseni ukwethembeka kokuklanywa kwe-PCB yesekethe ye-PCB, ukuxazulula inkinga yokuphazanyiswa kwe-electromagnetic, nokufeza injongo yokuhambisana kwe-electromagnetic.