Amagqabantshintshi ngokuthembeka kwe-thermal PCB

Ngokubanzi, ukuhanjiswa kwefoyile yobhedu kwiibhodi ze-PCB kunzima kakhulu kwaye kunzima ukwenza imodeli ngokuchanekileyo. Ke ngoko, kubalulekile ukwenza ubume beentambo ngexesha lokumodareyitha, kwaye uzame ukwenza imodeli ye-ANSYS kufutshane nebhodi yesekethe eyiyo. Izinto ze-elektroniki kwibhodi yesekethe nazo zinokufaniswa nemodeli eyenziwe lula, enje nge-tube ye-MOS kunye nebhloko yesekethe edityanisiweyo.

1. Uhlalutyo lobushushu
Uhlalutyo lwe-Thermal ngexesha lokulungiswa kwe-SMT linceda abaqulunqi ekumiseleni iipropathi zombane zezinto ezikwi-PCB nasekuqinisekiseni ukuba izinto okanye iibhodi zesekethe ziya kutsha ngenxa yamaqondo obushushu aphezulu. Uhlalutyo olulula lwe-thermal lubala kuphela iqondo lobushushu bebhodi yesekethe, ngelixa imodeli entsonkothileyo yokudlula isekeliselwe izixhobo zombane ezineebhodi zesekethe ezininzi. Ukuchaneka kohlalutyo lwe-thermal ekugqibeleni kuxhomekeke kukuchaneka kokusetyenziswa kwamandla kwezinto ezinikezelwa ngumyili webhodi yesekethe.
Kwizicelo ezininzi apho ubunzima kunye nobungakanani bomzimba zibaluleke kakhulu, ukuba ukusetyenziswa kwamandla kwecandelo kuncinci kakhulu, into yokhuselo loyilo inokuba phezulu kakhulu, kwaye uyilo lwebhodi yesekethe lusekwe kuhlalutyo lobushushu ixabiso lamandla elingahambelaniyo nelona okanye lilondolozo kakhulu. Okuchaseneyo (kunye nokubi kakhulu) kuyilo lokhuseleko olushushu olushushu, apho icandelo lisebenza khona kubushushu obuphezulu kunokuba umhlalutyi waxela kwangaphambili. Le ngxaki ihlala isonjululwa ngokufaka irediyetha okanye ifeni ukupholisa ibhodi yesekethe. Ezi zongezo zongeza iindleko kwaye zikhokelela ekwandeni kwexesha lokuphumla, kwaye ukongezwa kwabalandeli kuyilo kukwakudala ukungazinzi ekuthembekeni, okusebenzayo endaweni yeendlela zokupholisa (ezifana nokuhanjiswa kwendalo, ukuhanjiswa, kunye nemitha) zisetyenziselwa iibhodi.
2. Ukwenza umzekelo kube lula ibhodi yesekethe
Ngaphambi kokumodareyitha, hlalutya izixhobo eziphambili zokufudumeza kwibhodi yesekethe, ezinje ngemibhobho ye-MOS kunye neebhloko zesekethe ezihlanganisiweyo, eziguqula uninzi lwamandla alahlekileyo kubushushu ngexesha lokusebenza. Ke ngoko, eyona nto iphambili ekuqwalaselweni kwemodeli zezi zixhobo.
Ukongeza, cinga ngefoyile ye yobhedu njengoko ucingo ukutyabeka kwi zeendawana PCB. Abadlala nje kuphela indima ekuyileni, kodwa badlala indima kuhanjiso lobushushu, ukuqhuba kobushushu bayo kunye nendawo yokuhambisa ubushushu zinkulu kakhulu kwibhodi yesekethe yinxalenye yesekethe ye-elektroniki, ubume bayo benziwe nge-epoxy resin substrate kwaye ngefoyile ye yobhedu camera njengoko ucingo. Ubungakanani be-epoxy substrate yi-4mm, kwaye ubukhulu be-foil ye-copper yi-0.1mm. ICopper ine-thermal conductivity ye-400W / (m ℃), ngelixa i-epoxy ine-thermal conductivity ye-0.276W / (m ℃) kuphela. Nangona ifoyile yobhedu eyongeziweyo icekeceke kakhulu, inefuthe elomeleleyo lokukhokela kubushushu, ngenxa yoko ayinakungahoywa kwimodeli.