Sibutsetelo sokwethembeka okushisayo kwe PCB

Ngokuvamile, zethusi ucwecwe ukusatshalaliswa on PCB amabhodi kuyinkimbinkimbi kakhulu futhi kunzima ukumodela ngokunembile. Ngakho-ke, kuyadingeka ukwenza lula ukwakheka kwezintambo ngesikhathi sokumodela, bese uzama ukwenza imodeli ye-ANSYS eduze nebhodi lesifunda langempela. Izinto ze-elekthronikhi ebhodini lesifunda nazo zingalingiswa ngokumodela okwenziwe lula, okufana nethubhu le-MOS kanye nebhulokhi yesifunda ehlanganisiwe.

1. Ukuhlaziywa kwe-Thermal
Ukuhlaziywa kwe-Thermal ngesikhathi sokucubungula kwe-SMT kusiza abaklami ekunqumeni izakhiwo zikagesi zezinto ezikwi-PCB nasekunqumeni ukuthi izingxenye noma amabhodi wesifunda azosha ngenxa yamazinga okushisa aphezulu. Ukuhlaziywa okulula okushisayo kubala kuphela izinga lokushisa elijwayelekile lebhodi lesifunda, kuyilapho imodeli eyinkimbinkimbi yokudlula isungulelwa imishini ye-elekthronikhi enamabhodi wesifunda amaningi. Ukunemba kokuhlaziywa okushisayo ekugcineni kuya ngokunemba kokusetshenziswa kwamandla kwezinto okuhlinzekwa ngumklami webhodi lesifunda.
Kuzinhlelo eziningi lapho isisindo nosayizi womzimba kubaluleke kakhulu, uma ukusetshenziswa kwangempela kwento kuncane kakhulu, ukuphepha komklamo kungaba phezulu kakhulu, futhi ukwakhiwa kwebhodi lesifunda kungahle kusekelwe ekuhlaziyweni okushisayo inani lamandla ento elingahambisani nangempela noma okunamandla kakhulu. Okuphambene (futhi okubucayi kakhulu) ukuklanywa kokuphepha okushisayo okuphansi, lapho ingxenye empeleni isebenza ngokushisa okuphezulu kunalokho umhlaziyi abikezela. Le nkinga ivame ukuxazululwa ngokufaka i-radiator noma ifeni ukupholisa ibhodi lesifunda. Lezi zengezo zengeza izindleko futhi ziholela ekwehliseni isikhathi sokuphumula, futhi ukufakwa kwabalandeli ekwakhiweni nakho kudala ukungazinzi ekuthembekeni, ngakho-ke kusebenza izindlela zokupholisa ezingenzi lutho (njengokuhanjiswa kwemvelo kwemvelo, ukuqhutshwa kwemisebe kanye nemisebe) kusetshenziselwa amabhodi.
2. Ukwenza imodeli okwenziwe lula kwe- ibhodi yesifunda
Ngaphambi kokumodela, hlaziya amadivayisi amakhulu wokushisa ebhodini lesifunda, njengamashubhu we-MOS namabhulokhi wesifunda ahlanganisiwe, aguqula amandla amaningi alahlekile abe ukushisa ngesikhathi sokusebenza. Ngakho-ke, ukucatshangelwa okuyinhloko kokumodela yilawa madivayisi.
Ngaphezu kwalokho, cabanga ucwecwe lwethusi njengoba wire enamathela substrate PCB. Abagcini ngokudlala indima ekuqhubekeni kokuklama, kepha futhi badlala indima ekuqhubeni ukushisa, ukuqhutshwa kwayo okushisayo nendawo yokudlulisa ukushisa kunamabhodi wesifunda amakhulu kakhulu kuyingxenye ebaluleke kakhulu yesifunda se-elekthronikhi, isakhiwo sayo sakhiwe nge-epoxy resin substrate futhi ucwecwe lwethusi camera njengocingo. Ubukhulu be-epoxy substrate bungu-4mm, futhi ukushuba kocwecwe lwethusi kungu-0.1mm. I-Copper ine-conductivity ezishisayo ka-400W / (m ℃), kuyilapho i-epoxy inokushisa okushisayo okungu-0.276W / (m ℃) kuphela. Yize ucwecwe lwethusi olungeziwe luncane kakhulu, lunomphumela oqinile wokuqondisa ukushisa, ngakho-ke alunakunakwa ekumodeleni.