Umbane ongagungqiyo ovela emzimbeni womntu, okusingqongileyo kwaye nangaphakathi kwizixhobo ze-elektroniki kunokubangela ukonakala okungafaniyo kwiichips ze-semiconductor ezichanekileyo, ezinje ngokungena kumaleko amancinci okugquma ngaphakathi kwezinto; Ukonakala kwamasango eMOSFET kunye nezinto zeCMOS; Ukucofa ukuvala isixhobo seCMOS; Umjikelo wesekethe ojika-jika kwi-PN; Ukujikeleza okufutshane kwe-PN; Nyibilikisa ucingo lwe weld okanye ucingo lwealuminium ngaphakathi kwesixhobo. Ukuphelisa ukuphazamiseka kunye nokonakaliswa kokukhutshelwa ngombane (i-ESD) kwizixhobo ze-elektroniki, kuyafuneka ukuba uthathe amanyathelo ngeendlela zokuthintela.

Ngexesha Ibhodi PCB uyilo, uxhathiso lwe-ESD lwe-PCB lunokufezekiswa ngokubeka, ubeko olufanelekileyo kunye nofakelo. Ngexesha lenkqubo yoyilo, uninzi lotshintsho kuyilo lunokulinganiselwa ekongezeni okanye ekususeni izinto ngokubikezela. Ngokuhlengahlengisa ubeko lwePCB kunye nokufaka iintambo, i-ESD inokuthintelwa kakuhle. Nazi ezinye iindlela zokuthintela.

Ungaluqonda njani uyilo lokuchasana ne-ESD yePCB

1. Sebenzisa i-PCB eyahlukeneyo kangangoko. Xa kuthelekiswa ne-PCB enamacala amabini, inqwelomoya yomhlaba kunye nenqwelomoya yamandla, kunye nokushiya kufutshane phakathi kocingo lwesiginali kunye nocingo lomhlaba kunokunciphisa ukungqubana kwendlela eqhelekileyo kunye nokudibana okungahambelaniyo, kwaye kuyenze ifikelele kwi-1/10 ukuya kwi-1/100 ye kabini-emacaleni PCB. Zama ukubeka umaleko ngamnye wesiginali kufutshane namandla okanye umaleko womhlaba. Kwii-PCBS ezixineneyo ezinamacandelo kwindawo ephezulu kunye nezantsi, unxibelelwano olufutshane kakhulu, kunye nokuzaliswa komhlaba okuninzi, cinga ngokusebenzisa imigca yangaphakathi.

2. Kwi-PCB enamacala amabini, kufuneka kusetyenziswe umbane odityanisiweyo kunye negridi yomhlaba. Intambo yamandla ikufutshane nomhlaba kwaye kufuneka idityaniswe kangangoko phakathi kwemigca ethe nkqo kunye ethe tye okanye imimandla yokugcwalisa. Ubungakanani begridi yecala elinye buya kuba ngaphantsi okanye bulingane nama-60mm, okanye bungaphantsi kwe-13mm ukuba kunokwenzeka.

3. Qinisekisa ukuba isekethe nganye icofeke kangangoko.

4. Beka zonke izihlanganisi ecaleni kangangoko kunokwenzeka.

5. Ukuba kunokwenzeka, khokela intambo yombane ukusuka embindini wekhadi kude neendawo ezisemngciphekweni wokonakalisa ngqo i-ESD.

6, kuwo onke amacwecwe e-PCB angezantsi kwesinxibelelanisi esikhokelela ngaphandle kwetyala (kulula ukubethwa ngqo yi-ESD), beka i-chassis ebanzi okanye ipoligoni ezaliswe ngumhlaba, kwaye uzidibanise kunye nemingxunya ngamakhefu ali-13mm.

7. Beka imingxuma yokunyuka kumda wekhadi, kwaye iiphedi ezingaphezulu nezisezantsi zokuhamba okuvulekileyo zidityaniswe nomhlaba we-chassis ejikeleze imingxunya enyukayo.

8, indibano ye-PCB, musa ukusebenzisa nayiphi na i-solder phezulu okanye ezantsi. Sebenzisa izikhonkwane kunye neawashi eyakhelweyo ukubonelela ngonxibelelwano oluqinileyo phakathi kwe-PCB kunye ne-chassis yesinyithi / ikhaka okanye inkxaso kwinkalo yomhlaba.

9, kulwahlulo ngalunye phakathi kwesisu kunye nomhlaba wesekethe, ukuseta “indawo yokuzahlula” efanayo; Ukuba kunokwenzeka, gcina isithuba kwi-0.64mm.

10, ngaphezulu nasezantsi kwekhadi kufutshane nendawo yokufaka umngxunya, yonke i-100mm ecaleni komhlaba we-chassis kunye nomhlaba wesekethe kunye nomgca obanzi we-1.27mm kunye. Ecaleni kwezi ndawo zonxibelelwano, iphedi okanye umngxunya wokufaka ufakelo lubekwe phakathi komhlaba we-chassis kunye nomhlaba wesekethe. Olu nxibelelwano lomhlaba lunokunqunyulwa ngebhley ukuba luhlale luvulekile, okanye utsibe ngamaso emagnethi / ii-capacitors ezihamba rhoqo.

11, ukuba ibhodi yesekethe ayizukufakwa kwibhokisi yesinyithi okanye isixhobo esikhuselayo, umphezulu kunye nezantsi kwibhodi yesekethe chassis yocingo lomhlaba ayinakudityaniswa nokumelana ne-solder, ukuze isetyenziswe njenge-ESD arc ibeke i-electrode.

12. Beka iringi ejikeleze isekethe ngale ndlela ilandelayo:

(1) Ukongeza kwisinxibelelanisi somda kunye ne-chassis, wonke umda wokufikelela kweringi.

(2) Qinisekisa ukuba ububanzi bazo zonke izaleko bungaphezulu kwe-2.5mm.

(3) Imingxunya idityaniswe kwisangqa rhoqo nge-13mm.

(4) Dibanisa umhlaba ojikelezayo kunye nomhlaba oqhelekileyo wesekethe eyahlukeneyo kunye.

(5) Iipaneli eziphindwe kabini ezifakwe kwityala okanye izixhobo ezikhuselayo, umhlaba weringi uya kuqhagamshelwa kumhlaba oqhelekileyo wesekethe. Isiphaluka esinamacala amabini esingabanjwanga kufuneka sidityaniswe kumhlaba weringi, umhlaba weringi akufuneki uthanjiswe ngumsinga, ukuze umhlaba weringi ukwazi ukusebenza njengesixhobo sokukhupha i-ESD, ubuncinci isithuba esisi-0.5mm ububanzi kumhlaba weringi (konke maleko), ukuze kuthintelwe iluphu enkulu. Ukufakelwa kweentambo zombane akufuneki kubengaphantsi kwe-0.5mm kude kumhlaba weringi.

Kwindawo enokuthi ibethwe ngokuthe ngqo yi-ESD, ucingo lomhlaba kufuneka lubekwe ecaleni komgca ngamnye wesiginali.

Isekethe ye-I / O kufuneka ibe kufutshane nesinxibelelanisi esihambelanayo kangangoko kunokwenzeka.

15. Isekethe echaphazeleka kwi-ESD kufuneka ibekwe kufutshane neziko lesekethe, ukwenzela ukuba ezinye iisekethe zibonelele ngendlela ethile yokuzikhusela.

I-16, ihlala ibekwa kuthotho lwe-resistor kunye ne-magnetic beads kwisiphelo sokufumana, kwaye abo baqhubi beentambo abasesichengeni se-ESD, banokuthathela ingqalelo ukubeka uthotho lwesixhathisi okanye ubuhlalu bemagnethi kumqhubi.

17. Isikhuseli sethutyana sihlala sibekwa ekupheleni kokufumana. Sebenzisa iingcingo ezimfutshane ezingqindilili (ngaphantsi kwe-5x ububanzi, ekukhethwa ukuba ibe ngaphantsi kwe-3x ububanzi) ukunxibelelana nomgangatho we-chassis. Isiginali kunye nemigca yomhlaba evela kwisinxibelelanisi kufuneka idityaniswe ngqo kumkhuseli odlulileyo ngaphambi kokuba isekethe iphela inokudityaniswa.

18. Beka isixhobo sokucoca ulwelo kwisinxibelelanisi okanye ngaphakathi kwe-25mm yesekethe yokufumana.

(1) Sebenzisa ucingo olufutshane nolungqingqwa ukudibanisa i-chassis okanye isekethe yokufumana (ubude obungaphantsi kwamaxesha ama-5 ububanzi, ngokukhethekileyo ngaphantsi kwamaxesha ama-3 ububanzi).

(2) Umgca wesiginali kunye nocingo lomhlaba kuqala zixhunywe kwi-capacitor zaze zadityaniswa kwisekethe yokufumana.

19. Qiniseka ukuba umgca womqondiso ufutshane kangangoko.

20. Xa ubude beentambo zomqondiso bungaphezulu kwe-300mm, intambo yomhlaba kufuneka ibekwe ngaxeshanye.

21. Qinisekisa ukuba indawo yeluphu phakathi komgca wesiginali kunye nelogo ehambelana nayo incinci kangangoko. Imigca emide yesiginali, isikhundla somgca wesiginali kunye nomgca womhlaba kufuneka utshintshwe zonke iisentimitha ezimbalwa ukunciphisa indawo yokujikeleza.

22. Qhuba imiqondiso esuka embindini womnatha ukuya kwiisekethi ezininzi zokufumana.

23. Qinisekisa ukuba indawo yeluphu phakathi konikezelo lwamandla kunye nomhlaba incinci kangangoko. Beka i-capacitor yamaxesha aphezulu kufutshane nepini yamandla nganye ye-chip ye-IC.

24. Beka i-frequency ephezulu ngokudlula kwi-capacitor ngaphakathi kwe-80mm yesinxibelelanisi ngasinye.

25. Apho kunokwenzeka, gcwalisa umhlaba ongasetyenziswanga, uqhagamshele zonke iingqimba zokugcwalisa ngamatyeli angama-60mm.

26. Qinisekisa ukuba umhlaba uqhagamshelwe kwiziphelo ezibini ezichaseneyo zayo nayiphina indawo enkulu yokuzalisa umhlaba (malunga nomkhulu kunama-25mm * 6mm).

27. Xa ubude bokuvula kunikezelo lwamandla okanye inqwelomoya yomhlaba ingaphezulu kwe-8mm, qhagamshela amacala amabini okuvula ngomgca omxinwa.

Ukusetha kwakhona umgca, ukuphazamisa umgca wesiginali okanye umgca wesiginali wesiginali kufuneka ungabekwa ecaleni komphetho wePCB.

29. Qhagamshela imingxunya enyukayo nomhlaba oqhelekileyo, okanye uwahlule.

(1) Xa isibiyeli sesinyithi kufuneka sisetyenziswe ngesixhobo esikhuselayo sesinyithi okanye kwi-chassis, ukumelana ne-zero ohm kufuneka kusetyenziselwe ukuqonda unxibelelwano.

(2) ukumisela ubungakanani bomngxunya onyusiweyo ukufezekisa ukufakelwa okuthembekileyo kwesinyithi okanye inkxaso yeplastiki, phezulu nasezantsi komngxunya wokunyusa ukusebenzisa iphedi enkulu, iphedi engezantsi ayinakho ukusebenzisa ukuxhathisa, kwaye uqinisekise ukuba ezantsi Iphedi ayisebenzisi inkqubo yokuwelda amaza iwelding.

30. Iintambo zemiqondiso ekhuselweyo kunye neentambo zesiginali ezingakhuselekanga azinakulungiswa ngokuhambelana.

Ingqwalasela ekhethekileyo kufuneka ihlawulwe kwi-wiring yokusetha kwakhona, ukuphazamisa nokulawula imigca yesiginali.

(1) Ukucoca rhoqo okuhamba rhoqo kufuneka kusetyenziswe.

(2) Hlala kude kwigalelo kunye nemijikelezo yemveliso.

(3) Gcina kude kumda webhodi yesekethe.

I-32, i-PCB kufuneka ifakwe kwi-chassis, musa ukufaka kwindawo yokuvula okanye kumalungu angaphakathi.

Nika ingqalelo kwi-wiring yomgca wesiginali phantsi kwe-magnetic bead, phakathi kweepads kwaye unokuqhagamshelana ne-magnetic bead. Ezinye iintlobo ziqhuba umbane kakuhle kwaye zinokuvelisa iindlela ezingalindelekanga zokuhamba.

Ukuba imeko okanye ibhodi yomama yokufaka iibhodi zesekethe ezininzi, kufuneka ibe yeyona inomdla kwibhodi yesekethe yombane emileyo embindini.