Ugesi ongaguquguquki ovela emzimbeni womuntu, imvelo ngisho nangaphakathi kwamadivayisi we-elekthronikhi kungadala ukulimala okuhlukahlukene kuma-chip semiconductor chips, njengokungena ungqimba oluncane lokufakwa ngaphakathi ezintweni; Ukulimala kwamasango wezinto ze-MOSFET ne-CMOS; Qalisa ukukhiya kudivayisi ye-CMOS; I-junction ye-PN yesikhashana esifushane; Ukuhlangana kwe-PN kwesikhashana esifushane; Ncibilikisa i-weld wire noma i-aluminium wire ngaphakathi kwensiza esebenzayo. Ukuze kuqedwe ukuphazamiseka nokonakala kokukhishwa kwe-electrostatic (ESD) ezintweni zikagesi, kuyadingeka ukuthatha izinyathelo ezahlukahlukene zobuchwepheshe ukuvimbela.

Ngesikhathi PCB ibhodi ukuklama, ukumelana kwe-ESD kwe-PCB kungabonakala ngokubeka, ukwakheka okufanele nokufakwa. Ngesikhathi senqubo yokuklama, izinguquko eziningi zedizayini zingakhawulelwa ekungezeni noma ekususeni izinto ngokubikezela. Ngokulungisa ukwakheka kwe-PCB nezintambo, i-ESD ingavinjelwa kahle. Nazi ezinye izindlela zokuzivikela ezivamile.

Ungayibona kanjani indlela yokumelana ne-ESD ye-PCB

1. Sebenzisa i-PCB enezingqimba eziningi ngangokunokwenzeka. Uma kuqhathaniswa ne-PCB emaceleni amabili, indiza yaphansi namandla endiza, kanye nesikhala esiseduze phakathi kocingo lwesiginali nocingo lomhlabathi kunganciphisa impedance yemodi ejwayelekile nokuhlangana okunamandla, futhi kuyenze ifinyelele ku-1/10 kuye ku-1/100 we PCB emaceleni Zama ukubeka ungqimba wesiginali ngamunye eduze kongqimba lwamandla noma lomhlabathi. Kuma-PCBS amakhulu kakhulu anezinto kuzo zombili izindawo eziphezulu nezingezansi, ukuxhumana okufushane kakhulu, nokugcwaliswa okuningi komhlaba, cabanga ukusebenzisa imigqa yangaphakathi.

2. Kwi-PCB emaceleni omabili, kufanele kusetshenziswe ugesi ohlanganiswe ngokuqinile kanye negridi yomhlaba. Intambo yamandla iseduze nomhlabathi futhi kufanele ixhunywe ngangokunokwenzeka phakathi kwemigqa emi mpo futhi ivundlile noma iziza zokugcwalisa. Usayizi wegridi wohlangothi olulodwa uzoba ngaphansi noma ulingane no-60mm, noma ube ngaphansi kuka-13mm uma kungenzeka.

3. Qiniseka ukuthi isifunda ngasinye sihlangene ngokusemandleni.

4. Beka zonke izixhumi eceleni ngangokunokwenzeka.

5. Uma kungenzeka, hola intambo yamandla ukusuka maphakathi nekhadi kude nezindawo ezisengozini yokuqondisa umonakalo we-ESD.

6, kuzo zonke izingqimba ze-PCB ezingezansi kwesixhumi esiphuma kuleli cala (okulula ukulishaya ngqo yi-ESD), beka i-chassis ebanzi noma i-polygon egcwele umhlaba, bese uwaxhuma kanye nezimbobo ngezikhathi ezibalelwa ku-13mm.

7. Beka izimbobo zokufaka onqenqemeni lwekhadi, namaphayiphu aphezulu nangaphansi wokugeleza okuvulekile axhunywe emhlabathini weshaisi ezungeze izimbobo ezikhuphukayo.

8, inhlangano ye-PCB, ungasebenzisi noma iyiphi i-solder phezulu noma phansi. Sebenzisa izikulufo ngama-washer akhelwe ngaphakathi ukuhlinzeka ukuxhumana okuqinile phakathi kwe-PCB nensimbi chassis / isihlangu noma ukwesekwa ebusweni bomhlaba.

9, kusendlalelo ngasinye phakathi kwe-chassis nenhlabathi yesifunda, ukusetha “indawo yokuhlukanisa” efanayo; Uma kungenzeka, gcina isikhala ku-0.64mm.

10, phezulu nangaphansi kwekhadi eliseduze nendawo yomgodi wokufaka, yonke i-100mm eceleni komhlaba we-chassis kanye nomhlabathi wesifunda onolayini obubanzi be-1.27mm ndawonye. Eduze kwalezi zindawo zokuxhuma, kubekwa iphedi noma imbobo yokufaka phakathi kwendawo yomgibeli kanye nomhlabathi wesifunda. Lezi zixhumanisi zomhlaba zingasikwa ngensimbi ukuze ihlale ivulekile, noma igxume ngobuhlalu kazibuthe / ama-capacitors aphezulu.

11, uma ibhodi lesifunda lingenakufakwa ebhokisini lensimbi noma kudivayisi yokuvikela, phezulu nangaphansi kwebhodi lesifunda chassis wire wire ayikwazi ukufakwa ukumelana kwe-solder, ukuze isetshenziswe njenge-ESD arc ifaka i-electrode.

12. Beka iringi ezungeze isifunda ngale ndlela elandelayo:

(1) Ngokungeziwe kusixhumi esinqenqemeni ne-chassis, yonke imingcele yokufinyelela kweringi.

(2) Qinisekisa ukuthi ububanzi bazo zonke izingqimba bukhulu kune-2.5mm.

(3) Izimbobo zixhunywe eringini njalo nge-13mm.

(4) Xhuma umhlabathi owejwelayo kanye nendawo evamile yesekethe lezingqimba eziningi ndawonye.

(5) Kumapaneli aphindwe kabili afakwe ezimeni zensimbi noma kumadivayisi okuvikela, indawo eyiringi izoxhunywa endaweni evamile yesekethe. Isifunda esinamacala amabili esingavikelekile kufanele sixhunywe emhlabathini wendandatho, umugqa wendandatho akufanele ugcotshwe ukugeleza, ukuze umhlaba oyindandatho ube yinduku yokukhipha i-ESD, okungenani igebe elingu-0.5mm ububanzi enhlabathini yendandatho (konke izingqimba), ukuze kugwenywe iluphu enkulu. Ukuxhunywa kwesiginali akufanele kube ngaphansi kuka-0.5mm kude nomhlabathi wendandatho.

Endaweni engashaywa ngqo yi-ESD, kufanele kubekwe ucingo lwaphansi eduze kolayini ngamunye wesiginali.

14. Isifunda se-I / O kufanele sisondele kusixhumi esihambisanayo ngangokunokwenzeka.

15. Isifunda esingenwa yi-ESD kufanele sibekwe eduze nendawo yesekethe, ukuze amanye amasekethe akwazi ukuhlinzeka ngomphumela othile wokuzivikela kuwo.

16, evame ukufakwa ochungechungeni lwe-resistor kanye nobuhlalu kazibuthe ekugcineni kokuthola, futhi kulabo abashayeli bekhebula abasengozini ye-ESD, bangacabanga nokubeka uchungechunge lwe-resistor noma ubuhlalu bamagnetic ekugcineni komshayeli.

17. Umvikeli wesikhashana uvame ukubekwa ekugcineni okwamukelwayo. Sebenzisa izintambo ezimfushane ezijiyile (ngaphansi kobubanzi obungu-5x, okungcono ngaphansi kobubanzi obungu-3x) ukuxhuma kuphansi chassis. Imigqa yesiginali nomhlabathi ovela kusixhumi kufanele ixhunywe ngqo kumvikeli wesikhashana ngaphambi kokuba yonke isekethe ixhumeke.

18. Beka i-capacitor yesihlungi kusixhumi noma ngaphakathi kwama-25mm wesekeli owamukelayo.

(1) Sebenzisa ucingo olufushane nolugqinsi ukuxhuma i-chassis noma isekhethi eyamukelayo (ubude obungaphansi kwezikhathi ezi-5 ububanzi, okungcono ngaphansi kwezikhathi ezi-3 ububanzi).

(2) Ulayini wesiginali nocingo lomhlabathi kuqala kuxhunywe kwi-capacitor bese kuxhunyaniswa nesekeli elitholayo.

19. Qiniseka ukuthi ulayini wesiginali mfushane ngangokunokwenzeka.

20. Lapho ubude bezintambo zesiginali bukhulu kuno-300mm, ikhebuli lomhlabathi kufanele libekwe ngokufana.

21. Qiniseka ukuthi indawo yeluphu phakathi kolayini wesiginali kanye neluphu ehambisanayo incane ngangokunokwenzeka. Olayini besiginali abade, isikhundla selayini yesiginali nolayini womhlabathi kufanele kushintshwe njalo ngamasentimitha ambalwa ukunciphisa indawo yeluphu.

22. Shayela amasiginali asuka enkabeni yenethiwekhi abe amasekethe amaningi athola.

23. Qinisekisa ukuthi indawo yeluphu phakathi kokuphakelwa kukagesi nomhlabathi incane ngangokunokwenzeka. Beka imvamisa capacitor eduze kwephini ngalinye lamandla we-chip chip.

24. Beka i-capacitor eyeqa imvamisa ephezulu ngaphakathi kwe-80mm yesixhumi ngasinye.

25. Uma kungenzeka, gcwalisa umhlaba ongasetshenziswanga, uhlanganise zonke izingqimba zokugcwaliswa ngezikhathi ezingama-60mm.

26. Qiniseka ukuthi inhlabathi ixhunywe emaphethelweni amabili aphikisanayo anoma iyiphi indawo enkulu yokugcwalisa umhlaba (cishe enkulu ukwedlula 25mm * 6mm).

27. Lapho ubude bokuvulwa kokuphakelwa kwamandla noma indiza yaphansi kweqa u-8mm, xhuma izinhlangothi zombili zokuvula ngomugqa omncane.

28. Setha kabusha umugqa, uphazamise umugqa wesiginali noma ulayini wesiginali onqenqemeni lwesiginali akufanele ubekwe eduze komphetho we-PCB.

29. Xhuma izimbobo ezikhuphukayo nendawo ovumelana ngayo nesifunda, noma uzihlukanise.

(1) Lapho ubakaki wensimbi kufanele usetshenziswe nensimbi yokuvikela insimbi noma i-chassis, ukumelana ne-zero ohm kufanele kusetshenziselwe ukubona ukuxhumana.

(2) ukunquma usayizi umgodi obandayo ukufeza ukufakwa okuthembekile kwensimbi noma ukwesekwa kwepulasitiki, phezulu nangaphansi komgodi wokufaka ukuze usebenzise iphedi enkulu, iphedi engezansi ayikwazi ukusebenzisa ukumelana nokugeleza, futhi iqinisekise ukuthi phansi iphedi ayisebenzisi inqubo ye-wave welding yokushisela.

30. Izintambo zesiginali ezivikelekile nezintambo zesiginali ezingavikelekile azikwazi ukuhlelwa ngokufana.

Ukunakekelwa okukhethekile kufanele kunikezwe ezintanjeni zokusetha kabusha, ukuphazamisa nokulawula imigqa yesiginali.

(1) Ukuhlunga okuvama kakhulu kufanele kusetshenziswe.

(2) Hlala kude namasekhethi wokufaka nawokukhipha.

(3) Gcina kude nonqenqema lwebhodi lesifunda.

32, i-PCB kufanele ifakwe ku-chassis, ungafaki endaweni yokuvula noma amalunga angaphakathi.

Nakani izintambo zomugqa wesiginali ngaphansi kobuhlalu bukazibuthe, phakathi kwamapayipi futhi ungaxhumana nobuhlalu bukazibuthe. Obunye ubuhlalu buqhuba ugesi kahle futhi bungaveza izindlela ezingalindelekile zokuhamba.

Uma ikesi noma ibhodi yomama yokufaka amabhodi wesekethe amaningana, kufanele kube ezwela kakhulu ebhodini lesifunda likagesi eliphakathi nendawo.