PCB ukukopisha kwaziwa nangokuthi i-PCB yokukopisha, i-PCB cloning, i-PCB yokukopisha, i-PCB cloning, i-PCB reverse design noma i-PCB reverse development. That is, on the premise of having physical electronic products and circuit boards, reverse analysis of circuit boards is carried out by means of reverse research and development technology, and technical documents such as PCB files, BOM files, schematic diagram files and PCB silkscreen production files of original products are carried out 1: 1, bese usebenzisa le mibhalo yezobuchwepheshe nemibhalo yokukhiqiza ekwenzeni ibhodi le-PCB, ukuwelda ingxenye, ukuhlolwa kwenaliti endizayo, ukulungisa iphutha kwebhodi lesifunda, qedela ikhophi lesampula lesifunda lokuqala.

Ngebhodi lokukopisha le-PCB, abantu abaningi abaqondi, yini ibhodi yokukopisha ye-PCB, abanye abantu bacabanga ukuthi ibhodi yokukopisha ye-PCB yi-copycat. Ekuqondeni kwawo wonke umuntu, i-shanzhai isho ukulingiswa, kepha ukukopisha kwe-PCB nakanjani akulingisi. Inhloso yokukopisha kwe-PCB ukufunda ubuchwepheshe bamuva bokuklanywa kwesekethe yakwamanye amazwe, bese ubamba izikimu ezinhle kakhulu zedizayini, bese uzisebenzisela ukuthuthukisa nokuklama imikhiqizo engcono.

With the continuous development and deepening of the board copying industry, today’s PCB board copying concept has been extended in a wider range, no longer limited to simple circuit board copying and cloning, but also involves the secondary development of products and the research and development of new products. , ngokwesibonelo, ngokuhlaziywa kwemibhalo yezobuchwepheshe yomkhiqizo, ukucabanga kokuklanywa, izici zesakhiwo nobuchwepheshe bokuqonda nokuxoxisana, kunganikeza ukuhlaziywa kokungenzeka kocwaningo nokwakhiwa kwemikhiqizo emisha nemininingwane yokuncintisana, ukusiza amayunithi ocwaningo nokwakhiwa ukulandela ngesikhathi esifanele izindlela zokuthuthuka kwezobuchwepheshe, ukulungiswa okufika ngesikhathi ukwenza ngcono ukuklanywa kwemikhiqizo, ucwaningo nentuthuko kakhulu kunemakethe imikhiqizo emisha yokuncintisana.

Inqubo yokukopisha ibhodi le-PCB ingaqaphela ukuvuselelwa okusheshayo, ukukhuphula izinga nokuthuthuka kwezinhlobo ezahlukahlukene zemikhiqizo ye-elekthronikhi ngokukhipha nokuguqulwa okuyingxenye yamafayela wedatha yobuchwepheshe. Ngokusho komdwebo wedokhumenti nomdwebo ohleliwe okhishwe ekukopisheni kwe-PCB, abaklami abangochwepheshe nabo bangaqhakambisa ukuklama futhi bashintshe i-PCB ngokuya ngezifiso zekhasimende. Ngalesi sizathu, ingangeza nemisebenzi emisha yomkhiqizo noma ihlele kabusha izici ezisebenzayo, ukuze umkhiqizo onemisebenzi emisha uvele ngejubane elisheshayo futhi nokuma okusha, hhayi nje kuphela ukuthi kunamalungelo ayo empahla yengqondo, kepha futhi kuwina ithuba lokuqala emakethe, liletha izinzuzo eziphindwe kabili kumakhasimende.

Noma ngabe isetshenziselwa ukuhlaziya imigomo yebhodi lesifunda kanye nezimpawu zokusebenza zomkhiqizo ocwaningweni olubuyela emuva, noma isetshenziswe njengesisekelo sokwakhiwa kwe-PCB ekuklanyeni phambili, i-PCB schematic inendima ekhethekile. Ngakho-ke, ngokwedokhumenti noma into, ungawufeza kanjani umdwebo wesikimu we-PCB emuva, yini inqubo ebuyela emuva? Yimiphi imininingwane okufanele uyinake?

Izinyathelo ezibuyela emuva:

1. Record PCB details

Thola i-PCB, okokuqala ephepheni ukurekhoda zonke izinto zemodeli, imingcele nendawo, ikakhulukazi idayode, ukuqondiswa kwethubhu enezitezi ezintathu, isiqondisi se-IC notch. Kungcono ukuthatha izithombe ezimbili zendawo yezakhi ngekhamera yedijithali. Amabhodi amaningi e-PCB enza okuthuthuke kakhulu ngaphezu kwe-diode triode amanye awanaki ukuvele abone.

2. Scanned images

Susa zonke izinto bese ususa ithini emigodini ye-PAD. Hlanza i-PCB ngotshwala bese uyifaka kuskena eskena amaphikseli aphakeme kancane ukuthola isithombe esibukhali. Bese, pholisha izingqimba ezingenhla nezingezansi kancane ngephepha lentambo yamanzi kuze kube yilapho ifilimu yethusi icwebezela. Bafake kuskena, qala i-PHOTOSHOP, bese uxubha izingqimba zombili ngokwehlukana ngombala. Note that PCB must be placed horizontally and vertically in the scanner, otherwise the scanned image can not be used.

3. Adjust and correct the image

Lungisa ukungafani nokukhanya kwetende, ukuze ingxenye enefilimu yethusi nengxenye ngaphandle kokuqhathaniswa kwefilimu yethusi ngokuqinile, bese uphendulela isigatshana kokumnyama nokumhlophe, hlola ukuthi ngabe imigqa icacile, uma kungenjalo, phinda lesi sinyathelo. Uma sicacile, isithombe sizogcinwa njengamafomethi we-BMP amnyama nomhlophe we-TOP BMP ne-BOT BMP, uma isibalo kutholakala ukuthi sinezinkinga singalungiswa futhi silungiswe nge-PHOTOSHOP.

4. Qinisekisa isikhundla se-PAD ne-VIA

Guqula amafayela amabili we-BMP abe amafayela we-PROTEL ngokulandelana, bese udlulisa izingqimba ezimbili ku-PROTEL. Isibonelo, izikhundla ze-PAD ne-VIA ngemuva kwezendlalelo ezimbili ziyahlangana ngokuyisisekelo, okukhombisa ukuthi izinyathelo zangaphambili zenziwe kahle. Uma kukhona ukuphambuka, phinda isinyathelo sesithathu. Ngakho-ke, ukukopishwa kwebhodi le-PCB kungumsebenzi onesineke kakhulu, ngoba inkinga encane izothinta ikhwalithi kanye nezinga elifanayo ngemuva kokukopisha kwebhodi.

5. Draw the layer

Convert TOP layer BMP to TOP PCB, make sure to convert SILK layer, the yellow layer, then you trace the line on TOP layer, and place the device according to the drawing in step 2. Susa ungqimba lwe-SILK ngemuva kokupenda. Repeat until you have drawn all the layers.

6. Ukuhlanganiswa kwe-TOP PCB ne-BOT PCB

Add TOP PCB and BOT PCB in PROTEL and combine them into one figure.

7. I-Laser phrinta i-TOP LAYER, i-BOTTOM LAYER

Sebenzisa iphrinta ye-laser ukuphrinta i-TOP LAYER ne-BOTTOM LAYER kwifilimu esobala (1: 1 ratio), faka ifilimu kuleyo PCB bese uqhathanisa uma ingalungile, uma ilungile, usuqedile.

Isivivinyo 8.

Hlola ukusebenza kwe-elekthronikhi lebhodi yamakhophi akufani nebhodi lasekuqaleni. If it’s the same then it’s really done.

Okwesibili, naka imininingwane

1. Hlukanisa ngokufanele izindawo zokusebenza

When reverse designing the schematic diagram of an intact PCB, reasonable division of functional areas can help engineers reduce some unnecessary trouble and improve the efficiency of drawing. Generally speaking, components with the same function on a PCB board will be arranged centrally, so that the functional division of areas can provide a convenient and accurate basis for reverting the schematic diagram.

Kodwa-ke, ukuhlukaniswa kwale ndawo esebenzayo akuyona into engqubuzanayo. Kudinga onjiniyela ukuthi babe nokuqonda okuthile kolwazi oluhlobene nesekethe lwe-elekthronikhi. Okokuqala, thola izingxenye eziyinhloko zophiko olusebenzayo, bese ngokuya ngokuxhumeka kwentambo kungalandelwa ukuthola ezinye izingxenye zophiko olufanayo, ukwakheka kwesahlulelo esisebenzayo. Ukwakheka kokuhlukaniswa okusebenzayo kuyisisekelo somdwebo wesikimu. Ngaphezu kwalokho, ungakhohlwa ukusebenzisa inombolo yento ebhodini lesifunda ukukusiza ukwahlukanisa imisebenzi ngokushesha.

2. Thola isiqeshana sesisekelo esifanele

Le ngcezu yesethenjwa kungashiwo ukuthi iyidolobha eliyinethiwekhi ye-PCB eyinhloko ekuqaleni komdwebo wesikimu. Ngemuva kokunquma izingcezu zokubhekisela, ukudweba ngokuya ngezikhonkwane zalezi zingcezu zezethenjwa kungaqinisekisa ukunemba komdwebo wesikimu ngezinga elikhulu.

Ibhentshimakhi yonjiniyela, isiqiniseko asizona izinto eziyinkimbinkimbi kakhulu, ngokujwayelekile, zingakhetha ukudlala indima ehamba phambili kuzinto zesekethe njengebhentshimakhi, ngokuvamile zinkulu, zikhomba ngaphezulu, ukudweba okulula, okufana nesekethe ehlanganisiwe, isiguquli, isiguquli, njll. ., zifanele njengebhentshimakhi.

3. Hlukanisa kahle imigqa bese udweba izintambo ezifanele

Ngokuhlukaniswa kocingo lwasemhlabathini, intambo yamandla nolayini wesiginali, onjiniyela futhi kudingeka babe nolwazi olufanele lokuphakelwa kwamandla, ukuxhumeka kwesifunda, i-PCB wiring nokunye. Ukuhlukaniswa kwala masekethe kungahlaziywa kusukela ekuxhumaneni kwezakhi, ububanzi bocingo lwethusi kanye nezimpawu zemikhiqizo kagesi uqobo.

Emdwebeni wezintambo, ukuvikela ukweqa ulayini nokungena ngaphakathi, umhlabathi ungasebenzisa inani elikhulu lezimpawu zokubeka phansi, zonke izinhlobo zemigqa zingasebenzisa imibala ehlukene yemigqa ehlukene ukuqinisekisa ukucace bha, ngoba zonke izinhlobo zezinto zingasebenzisa futhi okhethekile izimpawu, futhi angahlukanisa ngisho nomdwebo wesifunda, bese kuhlanganiswa.

4. Yazi kahle uhlaka oluyisisekelo bese ubheka imidwebo efanayo yesikimu

Kwindlela ethile eyisisekelo yokwakheka kohlaka lwe-elekthronikhi kanye nendlela yokudweba yenqubo, onjiniyela kudingeka bazi kahle, hhayi nje kuphela ukuthi bakwazi ukudweba ukwakheka okulula, okuyisisekelo okuyisisekelo kweseyunithi yeyunithi ngqo, kodwa futhi nokwakha uhlaka oluphelele lwesekethe kagesi.

Ngakolunye uhlangothi, unganaki ukuthi uhlobo olufanayo lwemikhiqizo ye-elekthronikhi inokufana okuthile kumdwebo wesikimu wedolobha lenethiwekhi le-PCB, onjiniyela bangakwazi ngokusho kokuqongelela kwesipiliyoni, badwebe ngokuphelele kumdwebo wesifunda ofanayo ukwenza okuphambene nalokho okusha umdwebo wesikimu womkhiqizo.

5. Hlola nokwandisa

Ngemuva kokuthi umdwebo ohleliwe usuphothuliwe, ukwakheka okuphambene nomdwebo wesikimu we-PCB kungaphethwa kuphela ngemuva kokuhlolwa nokuhlolwa. The nominal values of components sensitive to PCB distribution parameters need to be checked and optimized. According to the PCB file diagram, the schematic diagram is compared, analyzed and checked to ensure that the schematic diagram is completely consistent with the file diagram.