Muaj ntau txoj hauv kev faib rau tooj liab clad ntawv ci. Feem ntau raws li cov khoom siv phaj txhawb nqa sib txawv, tuaj yeem faib ua: ntawv hauv paus, iav iav ntaub ntaub puag,

Composite puag (CEM series), multilayer PCB puag thiab cov khoom siv tshwj xeeb hauv paus (ceramic, hlau tub ntxhais puag, thiab lwm yam). Yog siv los ntawm pawg thawj coj.

Cov nplaum nplaum tau muab cais ua qhov sib txawv, ntau daim ntawv raws CCI. Muaj: phenolic resin (XPc, XxxPC, FR-1, FR.

A 2, thiab lwm yam), epoxy resin (FE 3), polyester cob thiab lwm yam. Hom iav fiber ntau hauv paus CCL muaj epoxy resin (FR-4, FR-5), tam sim no nws yog qhov dav tshaj plaws siv hom iav fiber ntau puag. Ib qho ntxiv, muaj lwm yam tshwj xeeb cob (nrog iav ntaub ntaub, polyamide fiber, ntaub tsis-ntaub raws li cov ntaub ntawv ntxiv): bismaleimide hloov pauv triazine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), txiv neej anhydride imide – styrene resin (MS), polycyanate ester resin, polyolefin resin, thiab lwm yam.

Raws li cov nplaim hluav taws ua tau zoo ntawm CCL, nws tuaj yeem faib ua hom nplaim hluav taws (UL94 VO, UL94 V1 chav kawm) thiab hom tsis nplaim hluav taws (UL94 HB chav kawm) ob hom phaj. Tsis ntev los no ib rau ob xyoos, nrog rau kev saib xyuas ntau ntxiv rau kev tiv thaiv ib puag ncig, ib yam tshiab ntawm CCL yam tsis muaj bromine tau tsim hauv nplaim hluav taws CCL, uas tuaj yeem hu ua “nplaim hluav taws kub nyhiab CCL”. Nrog kev txhim kho nrawm ntawm cov khoom siv tshuab thev naus laus zis, cCL muaj qhov ua tau zoo dua. Yog li ntawd, los ntawm kev faib tawm qhov ua tau zoo ntawm CCL, nws tuaj yeem faib ua qhov kev ua tau zoo CCL, qis dielectric tsis tu ncua CCL, siab kub tsis kam tiv thaiv CCL (dav phaj L saum 150 ℃), tsis tshua muaj thermal nthuav coefficient CCL (feem ntau siv rau ntim txheej) thiab lwm yam hom.

Nrog kev txhim kho thiab txuas ntxiv mus tas li ntawm cov tshuab hluav taws xob, cov tseev kom muaj tshiab rau PCB cov khoom siv tau txuas ntxiv mus tas li, yog li txhawb txoj kev txhim kho txuas ntxiv ntawm tooj liab clad foil board cov qauv. Tam sim no, cov txheej txheem tseem ceeb rau cov khoom siv substrate yog raws li hauv qab no.

② Cov txheej txheem tseem ceeb ntawm lwm cov qauv hauv tebchaws yog: Japanese JIS tus qauv, ASTM, NEMA, MIL, IPc, ANSI, UL tus qauv, Askiv Bs tus qauv, German DIN, VDE tus qauv, Fabkis NFC, UTE txuj, Canadian CSA tus qauv, Australian AS tus qauv, yav dhau los Soviet Union FOCT tus qauv, Tam sim no, lub teb chaws tus qauv ntawm cov khoom siv substrate hauv Suav teb yog GB/T4721-47221992 thiab GB4723-4725-1992. Cov tooj liab npog cov txheej txheem phaj hauv Taiwan cheeb tsam ntawm Tuam Tshoj yog CNS tus qauv, uas yog raws li Japanese JIs tus qauv thiab tso tawm xyoo 1983.