There are many classification methods for copper clad foil. Generally according to the plate reinforcement material is different, can be divided into: paper base, glass fiber cloth base,

Composite base (CEM series), multilayer PCB base and special material base (ceramic, metal core base, etc.). If used by the board.

The resin adhesives are classified differently, common paper based CCI. There are: phenolic resin (XPc, XxxPC, FR-1, FR.

A 2, etc.), epoxy resin (FE 3), polyester resin and other types. Common glass fiber base CCL has epoxy resin (FR-4, FR-5), it is currently the most widely used type of glass fiber base. In addition, there are other special resins (with glass fiber cloth, polyamide fiber, non-woven fabric as additional materials) : bismaleimide modified triazine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), maleic anhydride imide – styrene resin (MS), polycyanate ester resin, polyolefin resin, etc.

According to the flame retardant performance of CCL, it can be divided into flame retardant type (UL94 VO, UL94 V1 class) and non-flame retardant type (UL94 HB class) two types of plate. In recent one to two years, with more attention paid to environmental protection, a new type of CCL without bromine was developed in the flame retardant CCL, which can be called “green flame retardant CCL”. With the rapid development of electronic product technology, cCL has higher performance requirements. Therefore, from the performance classification of CCL, it can be divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL(general plate L above 150℃), low thermal expansion coefficient CCL(generally used for packaging substrate) and other types.

With the development and continuous progress of electronic technology, new requirements for PCB substrate materials are constantly put forward, thus promoting the continuous development of copper clad foil board standards. At present, the main standards for substrate materials are as follows.

② The main standards of other national standards are: Japanese JIS standard, ASTM, NEMA, MIL, IPc, ANSI, UL standard, British Bs standard, German DIN, VDE standard, French NFC, UTE standard, Canadian CSA standard, Australian AS standard, the former Soviet Union FOCT standard, At present, the national standards of substrate materials in China are GB/T4721-47221992 and GB4723-4725-1992. The copper clad foil plate standard in Taiwan area of China is CNS standard, which is based on Japanese JIs standard and released in 1983.