Zininzi iindlela zokuhlelwa kobhedu ovalwe ngefoyile. Ngokubanzi, ngezinto zokuqinisa ipleyiti yahlukile, inokwahlulwa: isiseko sephepha, iglasi ifayibha yesiseko selaphu,

Isiseko sokudityaniswa (uthotho lweCEM), multilayer PCB isiseko kunye nesiseko sezinto ezizodwa (i-ceramic, isiseko sesinyithi, njl.njl.). Ukuba isetyenziswe yibhodi.

Izinto zokuncamathelisa zentlaka zihlelwe ngokwahlukeneyo, iphepha eliqhelekileyo elisekwe kwiCCI. Kukho: i-phenolic resin (XPc, XxxPC, FR-1, FR.

I-2, njl.), I-epoxy resin (FE 3), i-resin ye-polyester kunye nezinye iintlobo. Isiseko seglasi esiqhelekileyo se-fiber ye-CCL ine-epoxy resin (FR-4, FR-5), okwangoku lolona hlobo lusetyenziswa kakhulu kwisiseko seglasi yefayibha. Ukongeza, kukho ezinye ii-resin ezikhethekileyo (ezineglasi yefayibha yelaphu, ifayibha ye-polyamide, ilaphu elingalukwanga njengezinto ezongezelelweyo): i-bismaleimide modified triazine resin (BT), polyimide resin (PI), diphenyl ether resin (PPO), maleic anhydride imide – I-resyrene resin (MS), i-polycyanate ester resin, i-polyolefin resin, njl.

Ngokutsho nelangatye nekudodobalisa yokusebenza CCL, oko lungohlulwa lube uhlobo nekudodobalisa idangatye (UL94 VO, ul94 V1 iklasi) kunye non-nelangatye uhlobo nekudodobalisa (iklasi UL94 HB) ezimbini iindidi ipleyiti. Kutshanje unyaka omnye ukuya kwiminyaka emibini, kuthathelwe ingqalelo engakumbi kukhuseleko lokusingqongileyo, uhlobo olutsha lweCCL ngaphandle kwebromine lwaphuhliswa kwilangatye elidodobalisa i-CCL, elinokuthiwa yi “green flame retardant CCL”. Ngophuhliso olukhawulezayo lwetekhnoloji yemveliso ye-elektroniki, i-cCL ineemfuno zokusebenza eziphakamileyo. Ke ngoko, ukusuka kulwahlulo lwentsebenzo lweCCL, inokwahlulwa ibe yi-CCL yokusebenza ngokubanzi, i-CCL engapheliyo ye-dielectric, ukumelana nobushushu obuphezulu CCL (ipleyiti ngokubanzi L ngaphezulu kwe-150 ℃), i-coefficient yokwanda kwe-thermal ephantsi yeCCL (esetyenziselwa ukupakisha i-substrate) kunye nezinye iintlobo.

Ngophuhliso kunye nenkqubela eqhubekayo yetekhnoloji ye-elektroniki, iimfuno ezintsha zezixhobo ze-PCB ze-substrate zihlala zibekwa phambili, oko ke kukhuthaza ukukhula okuqhubekayo kwemigangatho yebhodi ye-foil egqoke ubhedu. Okwangoku, eyona migangatho iphambili yezixhobo ze-substrate zezi zilandelayo.

Eyona migangatho iphambili yeminye imigangatho yesizwe yile: Umgangatho waseJapan we-JIS, i-ASTM, i-NEMA, i-MIL, i-IPc, i-ANSI, imigangatho ye-UL, imigangatho ye-B yaseBritane, i-DIN yaseJamani, umgangatho we-VDE, umgangatho we-French NFC, umgangatho we-UTE, umgangatho weCanada waseCanada, umgangatho wase-Australia AS, umgangatho wangaphambili we-Soviet Union FOCT, Okwangoku, imigangatho yesizwe yezixhobo ze-substrate e-China zii-GB / T4721-47221992 kunye ne-GB4723-4725-1992. Umgangatho ogqunywe ngefoyile yeplastikhi ogqityiweyo kumgangatho weTaiwan wase China ngumgangatho we-CNS, osekwe kwimigangatho yeJapan yamaJapan kwaye ikhutshwe ngo-1983.