Nā kūpale maʻamau i ka kope ʻana a ka papa PCB

1. PCB poepoe pōkole ma muli o ka holo ʻana o ka piʻina

1. Holo ke Tin i hana ʻia e ka hana kūpono ʻole i ka pahu lāʻau ʻoniʻoni e hoʻi hou ana;

2. Hoʻopili pū ʻia ka pā i hope i ke kiʻi ʻoniʻoni i mea e holo ai ka piʻina.

ʻO ka lua, pōkole pōkole PCB i hoʻokumu ʻia e ka etching haumia

1. ʻO ka maikaʻi o ka kaohi ʻana o ka palena o ka palena kaila e pili pono i ka maikaʻi etching.

3. Kaapuni PCB microshort ʻike ʻia

1. ʻO ke kaapuni Micro-pōkole i hoʻokumu ʻia e Myra kiʻi ʻoniʻoni ma ka mīkini hōʻike;

2, pā palahalaha ma nā kaha aniani i hoʻokumu ʻia e ka laina anakahi pōkole.

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ʻEhā, pōkole kiʻi ʻoniʻoni PCB pōʻai pōkole

1. Ka lahilahi ka pale pale pale. Ke plating, ʻoi aku ka uhi ma mua o ka mānoanoa o ke kiʻi ʻoniʻoni, e hana ana i ke kiʻi ʻoniʻoni, keu hoʻi i ka liʻiliʻi o ka laina laina, ʻoi aku ka maʻalahi o ke kumu o ke kaapuni pōkole o ke kiʻi ʻoniʻoni.

2. Hoʻokaʻawale kūpono ʻole o nā kiʻi paʻi. I ke kaʻina hana o ka electroplating kiʻi, ʻo ka uhi ʻana o nā laina kaʻawale i ʻoi aku ka mānoanoa o ke kiʻi ma muli o ke kiʻekiʻe, hiki i ka pōkole ke kumu o ka hoʻopaʻa ʻia ʻana o ke kiʻi ʻoniʻoni.

ʻElima, pōʻaiapuni PCB microshort ʻike ʻole ʻia

ʻO ka puni pōkole pōkole ʻike ʻole ʻia ka pilikia pilikia loa no kā mākou ʻoihana no kahi manawa lōʻihi a ʻo ia ka pilikia paʻakikī e hoʻoponopono. Ma kahi o 50% o nā papa i pau me nā pilikia i ka hoʻāʻo ʻana ʻo ia nā pilikia kaapuni micro-pōkole. ʻO ke kumu nui aia kekahi mau uea hao a i ʻole nā ​​huna kila i ʻike maka ʻole ʻia e ka maka o ka laina.

ʻEono, kūmau pōkole PCB paʻa

ʻO ke kumu nui ka scratched o ka laina kiʻiʻoniʻoni a i ʻole ke kuhi ʻana o nā ʻōpala i ka papa pale i uhi ʻia, a ʻo ke kapa pale anti-uhi uhi ʻia i hōʻike ʻia i ke keleawe e alakaʻi i ke kaapuni pōkole.

ʻEhiku, pōʻai pōkole pōkole PCB

1, ka pena ʻana o ke kiʻi maʻa ma hope o ka wili ʻana, ka hana kūpono ʻole i hoʻokumu ʻia e ka ʻili ʻili ʻoniʻoni.

2. ʻOi aku ka hana o ka papa puka mīkini e hoʻolālā nei i ka huikau a me ka ʻili ma waena o ka pā a me ka pā.

3. Hoʻokumu ʻia nā ʻōpala e ka lawe pono ʻole ʻana o ka papa i ka wā electroplating, hana kūpono ʻole i ka wā o ke kau ʻana i ka splint, hana kūpono ʻole i ka lawelawe ʻana o ka pā ma mua o ka laina laina.