PCB koho substrate

ʻO nā manaʻo mua no ke koho ʻana i nā mea substrates ka mahana (welding and working), nā pono uila, nā pilina (nā mea hoʻohui, nā mea hoʻopili), ka ikaika o ka hanana a me ka nui o ke kaapuni, a pēlā aku, a ukali ʻia e nā kumukūʻai waiwai a me nā koina. E nānā i kēia helu no nā kikoʻī:

▲ Kuhi koho substrate (kumuwaiwai: kumuwaiwai “GJB 4057-2000 Koi ʻia nā Mana Mana Mana Kaapuni no nā pono uila uila”)

Wehewehe inoa

FR-4-AE

ʻO Fr-4 kahi code class material flame kūpale, e hōʻike ana i ke ʻano o nā mea resin ma hope o ka hiki ʻana i ka mokuā ʻana ke kinai ponoʻī i kahi kikoʻī kikoʻī, ʻaʻole ia he inoa waiwai, akā he papa papa.

Tg / aniani hoʻohuli wela

ʻO Tg waiwai e pili ana i ka mahana ma kahi e loli ai nā mea mai ke aniani ʻoi aku ka paʻakikī i ka moku ʻoi aku ka maʻalahi a maʻalahi. Hoʻomaopopo e loli nā waiwai waiwai ma luna o Tg.

CTI

CTI: Papa Kuhikuhi Hoʻohālikelike Hoʻohālikelike, hoʻopōkole ʻana i ka papa kuhikuhi kuhikuhi hoʻohālikelike.

ʻO ke ʻano: ʻo ia ka hōʻailona o ke kūpaʻa kūiki. I ka mokuʻāina o ka hoʻopili ʻana i ka uila i ka ʻili o nā mea hoʻoheheʻe, e hāʻule nā ​​droplets electrolytic ma luna o ka huahana i hoʻoheheʻe ʻia ma waena o nā electrodes, a loiloi i ka uila a hiki i ka hōʻino ʻole ʻana o ka liu.

Papa CTI: pae ka pae CTI mai 0 a 5. ʻO ka liʻiliʻi ka helu, ʻo ke kiʻekiʻe ke kūpaʻa kūpaʻa.

PI

ʻO Polyimide (PI) kekahi o nā mea pono polymer meaola me ka hana ʻoi loa o ka pono.ʻO ke kūpaʻa wela kiʻekiʻe a hiki i 400 ℃ ma luna, hoʻohana lōʻihi lōʻihi o -200 ~ 300 ℃, ʻāpana o kahi kiko ʻole o ka hoʻoheheʻe ʻana, hana hoʻokiʻoki kiʻekiʻe, 103 hz dielectric paʻa 4.0, nalowale dielectric wale nō 0.004 ~ 0.007, na F iā H.

CE

(1) CE cyanate resin kahi ʻano hou o nā mea uila a me nā mea hoʻoheheʻe, ʻo ia kekahi o nā mea waiwai nui i ke kula o nā mīkini uila a me ka ʻenehana kamaʻilio microwave. He mea kūpono resin matrix mea no ka radome. Ma muli o kona kūpaʻa wela maikaʻi a me ke kūpaʻa wela, haʻahaʻa coefficient linear hoʻonui a me nā mea maikaʻi ʻē aʻe, ua lilo ʻo CE resin i mea matrix maikaʻi loa no ka hana ʻana i ke alapine kiʻekiʻe, hana kiʻekiʻe, nā papa uila huakaʻi paʻi uila kiʻekiʻe. Hoʻohui ʻia, he kēpau ʻōpala maikaʻi ʻo CE.

(2) hiki ke hoʻohana ʻia ke kēpau CE no ka hana ʻana i ka pūʻali koa, mokulele, mokulele mokulele, nā ʻāpana hoʻokele hoʻokele, e like me nā ʻēheu, nā pūpū moku, a pēlā aku, akā hiki nō hoʻi ke hana ʻia i nā mea kūkulu aerobace foam sandwich i hoʻohana mau ʻia.

(3) maikaʻi ka resin CE, a me ka resin epoxy, polyester unsaturated a me nā copolymerization ʻē aʻe hiki ke hoʻomaikaʻi i ke kūpaʻa wela a me nā pono mechanical o nā mea, hiki ke hoʻohana ʻia no ka hoʻololi ʻana i nā resins ʻē aʻe, hoʻohana ʻia e like me nā mea hoʻopili, nā pale, nā plastics foam, hana nā mea pāpāho, a pēlā aku.

(4) CE kahi mea transmittance maikaʻi me ka transmittance kiʻekiʻe a me ka transparency maikaʻi.

PTFE

ʻO Poly Tetra fluoroethylene (PTFE), ʻike ʻia ma ke ʻano he “uhi lāʻau ʻole” a i ʻole “maʻalahi e hoʻomaʻemaʻe i nā mea”. ʻO kēia mea i nā ʻano o ka acid a me ka alkali kūʻē, kūʻē ʻana i nā mea solvents ʻokanika a me ke ana wela kiʻekiʻe.

Kūlana wela kiʻekiʻe: hoʻohana lōʻihi ka lōʻihi o 200 ~ 260 kekelē;

Ke kūpaʻa wela haʻahaʻa: palupalu naʻe ma -100 kekelē;

Kūpaʻa kūpaʻa: hiki iā aqua regia a me nā mea hoʻoheheʻe kūlohelohe a pau;

Kūlana ʻino: ke ola ʻelemakule ʻoi loa o nā plastics;

ʻO ka lubrication kiʻekiʻe: ka coefficient ʻoi loa o nā plastics (0.04);

Nonviscous: ka loaʻa ʻana o ka liʻiliʻi o ka ʻilikai o kahi mea paʻa me ka pili ʻole i kekahi mea.

Pākuʻi ʻole: kino ʻole; ʻO ka hana uila maikaʻi loa, ʻo ia ka papa insulation papa C kūpono, hiki i kahi papa mānoanoa o ka nūpepa ke pale i ka voltage voltage kiʻekiʻe 1500V; Mālamalama ia ma mua o ka hau.

Inā he hoʻolālā PCB maʻamau, a i ʻole alapine kiʻekiʻe, hoʻolālā PCB wikiwiki kiʻekiʻe, ʻo ke koho o ka substrate kahi ʻike nui, pono mākou e haku. (PCB hoʻohui pū).