The interconnect of circuit board system includes chip-to-circuit board, interconnect within PCB and interconnect between PCB and external devices. I ka hoʻolālā RF, nā ʻano electromagnetic ma ka piko waena kekahi o nā pilikia nui i kū ʻia e ka hoʻolālā ʻenekinia. Hoʻolauna kēia pepa i nā ʻano hana like ʻole o nā ʻano ʻekolu ma luna o ka hoʻolālā interconnect, me nā ʻano hoʻonohonoho hoʻonohonoho ponoʻī, ka hoʻokaʻawale ʻana i nā uea a me nā ana e hōʻemi ai i ka inductance kēpau.

Aia kekahi mau hōʻailona e hoʻolālā ʻia nā papa kaapuni me ka hoʻonui pinepine ʻana. Ke hoʻomau nei e hoʻonui i ka helu o ka ʻikepili, ʻo ka bandwidth i koi ʻia no ka lawe ʻana i ka ʻikepili pū kekahi e pahu i ka palena o ke alapine hōʻailona i 1GHz a ʻoi paha. ʻO kēia ʻenehana hōʻailona pinepine pinepine, ʻoiai ʻoi aku ma mua o ka ʻenehana millimeter nalu (30GHz), pili iā RF a me ka ʻenehana microwave haʻahaʻa haʻahaʻa.

Pono e hiki i nā hana hoʻolālā ʻenehana RF ke lawelawe i nā hopena o ka electromagnetic ʻoi aku ka ikaika i hana ʻia ma nā alapine ʻoi. Hiki i kēia mau māla electromagnetic ke hoʻokomo i nā hōʻailona ma nā laina hōʻailona pili a i ʻole nā ​​laina PCB, e hoʻoulu ai i ka crosstalk makemake ʻole (keakea a me ka walaʻau holoʻokoʻa) a hōʻino i ka hana ʻōnaehana. Hoʻokumu nui ʻia ʻo Backloss e ka impedance mismatch, ka mea like ka hopena ma ka hōʻailona me ke kani a me ke ākea.

Loaʻa nā hopena maikaʻi ʻelua i ka pohō hoʻihoʻi kiʻekiʻe: 1. Hoʻohālikelike ka hōʻailona i ke kumu hōʻailona e hoʻonui i ka walaʻau o ka ʻōnaehana, e lilo ana i mea paʻakikī no ka mea loaʻa ke hoʻokaʻawale i ka leo mai ka hōʻailona; 2. 2. E hoʻohaʻahaʻa nui kēlā me kēia hōʻailona i ka maikaʻi o ka hōʻailona no ka mea ua loli ke ʻano o ka hōʻailona hoʻokomo.

ʻOiai ʻoluʻolu loa nā ʻōnaehana uila no ka mea pili wale lākou i nā hōʻailona 1 a me 0, hana nā mele like ke piʻi nei ka pā i ka wikiwiki e hoʻonāwaliwali ka hōʻailona ma nā alapine kiʻekiʻe. ʻOiai hiki i ka hoʻoponopono hewa ʻana i mua ke hoʻopau i kekahi o nā hopena maikaʻi ʻole, hoʻohana ʻia kahi ʻāpana o ka bandwidth band e hoʻoili i nā ʻikepili redundant, e hopena ana i ka hana degradation. ʻO kahi hopena ʻoi aku ka maikaʻi e loaʻa nā hopena RF e kōkua ai ma mua o ka haʻalele ʻana i ka pono o ka hōʻailona. Paipai ʻia ka huina hoʻi hoʻihoʻi ma ke alapine kiʻekiʻe loa o kahi ʻōnaehana uila (ʻo ka maʻa mau kahi ʻikepili ʻilihuna) e -25dB, e like me ka VSWR o 1.1.

Hoʻolālā ka hoʻolālā PCB i ka liʻiliʻi, wikiwiki a me ke kumu kūʻai. For RF PCBS, high-speed signals sometimes limit the miniaturization of PCB designs. At present, the main method to solve the problem of cross-talk is ground management, spacing between wiring and reducing lead inductance. ʻO ke ala nui e hōʻemi i ka nalo o ka hoʻihoʻi ʻana. Hoʻopili kēia hana i ka mālama pono ʻana i nā mea hoʻīpī a me ka hoʻokaʻawale ʻana i nā laina hōʻailona hana a me nā laina honua, keu hoʻi ma waena o ka mokuʻāina o ka laina hōʻailona a me ka honua.

Ma muli o ka pilina o ka loulou nāwaliwali loa i ke kaulahao kaapuni, i ka hoʻolālā RF, ʻo nā pono electromagnetic o ka helu interconnect ka pilikia nui e kū pono ana i ka hoʻolālā ʻenekini, pono e hoʻokolokolo ʻia kēlā me kēia kiko interconnect a hoʻoponopono ʻia nā pilikia e kū nei. Hoʻopili ka pilina kaapuni me ka pili o ka papa chip-to-circuit, ka pilina PCB a me ka hoʻopili hoʻokomo / huina hoʻohui ma waena o PCB a me nā hāmeʻa kūwaho.

Interconnection between chip and PCB board

The PenTIum IV and high-speed chips containing a large number of input/output interconnects are already available. As for the chip itself, its performance is reliable, and the processing rate has been able to reach 1GHz. One of the most exciting aspects of the recent GHz Interconnect symposium (www.az.ww. Com) is that approaches to dealing with the ever-increasing volume and frequency of I/O are well known. The main problem of interconnect between chip and PCB is that the density of interconnect is too high. An innovative solution was presented that uses a local wireless transmitter inside the chip to transmit data to a nearby circuit board.

Inā paha e holo kēia hopena, ua maopopo i ka poʻe i hele ma mua o ka ʻenehana hoʻolālā IC ma mua o ka ʻenehana hoʻolālā PCB no nā noi hf.

Hoʻohui PCB

ʻO nā ʻenehana a me nā ʻano hana no ka hf PCB hoʻolālā penei:

1. Pono e hoʻohana i kahi kihi 45 ° no ke kihi laina hoʻoili e hoʻemi ai i ka nalo hoʻihoʻi (FIG. 1);

2 insulation mau waiwai e like me ka pae o ka ikaika kaohi kiʻekiʻe-hana insulate kaapuni papa. He kūpono kēia hana no ka mālama pono ʻana i ka māla electromagnetic ma waena o nā mea insulate a me nā uea pili.

3. E hoʻomaikaʻi i nā kikoʻī hoʻolālā PCB no ka hoʻopaʻa pono ʻana i ka etching. E noʻonoʻo e hōʻike i ka hewa o ka laulā laina o +/- 0.0007 ʻīniha, ka mālama ʻana i nā ʻāpana undercut a me nā keʻa o nā ʻano pilina a e kuhikuhi ana i nā kūlana plating pā o ka pili. He mea nui ka mālama holoʻokoʻa ʻana o ka uea (uea) a me ka uhi ʻana i ka ʻili i nā hopena ʻili e pili ana i nā alapine hawewe a e hoʻokō i kēia mau kikoʻī.

4. Aia ka inductance piula wai i nā alakaʻi e protruding ana. Hōʻalo i ka hoʻohana ʻana i nā mea me nā kēpau. No nā wahi kiʻekiʻe pinepine, ʻoi aku ka maikaʻi o ka hoʻohana ʻana i nā ʻāpana i kau ʻia ma luna.

5. No ka hōʻailona ma o nā puka, e hōʻalo i ka hoʻohana ʻana i ke kaʻina PTH ma ka pā pili, no ka mea hiki i kēia hana ke hoʻoulu i ka inductance alakaʻi ma ka puka ma.

6. E hoʻolako i nā papa honua he nui. Hoʻohana ʻia nā lua i hamo ʻia e hoʻohui i kēia mau papa honua e pale ai i nā kahua electromagnetic 3d mai ka hoʻopili ʻana i ka papa kaapuni.

7. No ke koho ʻana i ka plating nickel non-electrolysis a i ʻole ke kaʻina plating gula immersion, mai hoʻohana i ke ʻano plating HASL. Hāʻawi kēia ʻili electroplated i kahi hopena ʻili maikaʻi aʻe no nā kahe alapine kiʻekiʻe (Kiʻi 2). Eia hou, koi ʻia kēia uhi welable loa i nā alakaʻi liʻiliʻi, e kōkua ana e hōʻemi i ka haumia o ka nohona.

8. Hiki i ka pale keakea ke pale i ke kahe o ka solder. Eia nō naʻe, no ka maopopo ʻole o ka mānoanoa a me ka hana hoʻowalewale ʻike ʻole ʻia, e uhi ana i ka pā o ka papa āpau me nā mea kūpale solder e alakaʻi i kahi hoʻololi nui o ka ikehu electromagnetic i ka hoʻolālā microstrip. Generally, solder dam is used as solder resistance layer.

Inā ʻaʻole ʻoe kamaʻāina i kēia mau hana, e nīnau i kahi ʻenekinia hoʻolālā ʻike i hana ma nā papa kaapuni hawewe no ka pūʻali koa. Hiki iā ʻoe ke kūkākūkā pū me lākou i ke kumu kūʻai e hiki ai ke kūʻai. For example, it is more economical to use a copper-backed coplanar microstrip design than a strip design. Discuss this with them to get a better idea. ʻAʻole paha e hoʻohana ʻia nā ʻenekini maikaʻi e noʻonoʻo e pili ana i ke kumukūʻai, akā hiki ke kōkua maikaʻi i kā lākou ʻōlelo aʻoaʻo. He hana lōʻihi loa ia e hoʻomaʻamaʻa i nā ʻenekini ʻōpio i ʻike ʻole i nā hopena RF a nele i ka ʻike i ka hana ʻana me nā hopena RF.

Hoʻohui ʻia, hiki ke lawe ʻia nā hopena ʻē aʻe, e like me ka hoʻomaikaʻi ʻana i ke k computerkohu kamepiula e hiki ai ke lawelawe i nā hopena RF.

Hoʻohui PCB me nā hāmeʻa kūwaho

Hiki iā mākou ke noʻonoʻo ua hoʻoponopono mākou i nā pilikia hoʻokele hōʻailona ma ka papa a me nā pilina o nā mea discrete. No laila pehea ʻoe e hoʻoponopono ai i ka pilikia hoʻokomo / hōʻailona mai ka papa kaapuni i ka uea e hoʻopili ana i ka hāmeʻa mamao? Trompeter Electronics, an innovator in coaxial cable technology, is working on this problem and has made some important progress (Figure 3). Eia kekahi, e nānā i ka māla electromagnetic i hōʻike ʻia ma ke kiʻi 4 ma lalo. I kēia hihia, mālama mākou i ka hoʻololi mai ka microstrip i ke kaula coaxial. I nā kaula coaxial, hoʻopili ʻia nā papa o ka honua i nā apo a kaulike kaulike ʻia. I nā microbelts, aia ka papa honua lalo o ka laina hana. Hōʻike kēia i kekahi hopena hopena e pono e hoʻomaopopo, wānana ʻia, a noʻonoʻo ʻia i ka manawa hoʻolālā. ʻOiaʻiʻo, hiki i kēia kuhi hewa ʻole ke alakaʻi i backloss a pono e hoʻemi ʻia e hōʻalo ai i ka halulu a me ka hōʻailona hōʻailona.

ʻO ka hoʻokele o ka pilikia impedance kūloko ʻaʻole ia he pilikia hoʻolālā hiki ke nānā ʻole ʻia. Hoʻomaka ka impedance ma ka papa o ka papa kaapuni, hele ma waena o kahi hui solder i ka ami, a hoʻopau ma ke kaula coaxial. No ka mea ʻokoʻa ka impedance me ke alapine, ʻo ke kiʻekiʻe ke alapine, ʻo ka ʻoi aku ka paʻakikī o ka hoʻokele impedance. ʻO ka pilikia o ka hoʻohana ʻana i nā alapine ʻoi aku i luna e lawe i nā hōʻailona ma luna o broadband ke kumu o ka pilikia hoʻolālā nui.

This paper summarizes

PCB platform technology needs continuous improvement to meet the requirements of IC designers. Hf signal management in PCB design and signal input/output management on PCB board need continuous improvement. Whatever exciting innovations are coming, I think bandwidth is going to get higher and higher, and using high frequency signals is going to be a prerequisite for that growth.