The interconnect of circuit board system includes chip-to-circuit board, interconnect within PCB and interconnect between PCB and external devices. I le RF design, o le electromagnetic uiga i le fesoʻotaʻiga manatu o se tasi o le autu faʻafitauli feagai ma inisinia mamanu. O lenei pepa o loʻo faʻailoa mai ai metotia eseese o loʻo i luga atu o ituaiga e tolu o fesoʻotaʻiga fesoʻotaʻiga, e aofia ai metotia faʻapipiʻi metotia, tuʻua o laina faʻapipiʻi ma fua e faʻaititia ai le faʻauluina o le lead.

E i ai faʻailoga o loʻo lolomi laupapa faʻataʻitaʻi o loʻo fuafuaina ma faʻateleina taimi. Aʻo faʻaauau pea le faʻateleina o fua faʻamatalaga, o le bandwidth manaʻomia mo faʻasalalauga faʻamatalaga faʻasolosolo foi tuleia le faʻailoga masani o faʻalo i le 1GHz pe maualuga atu. O lenei tekonolosi maualuga faailo taimi, e ui lava i tala atu o le millimeter galu tekonolosi (30GHz), e aofia ai RF ma maualalo-faaiuga microwave tekonolosi.

RF inisinia metotia fuafuaina metotia tatau ona mafai ona taulimaina le sili atu malosi electromagnetic fanua aafiaga e masani ona gaosia i maualuga maualuga. Nei electromagnetic fanua mafai ona faʻaoso faʻailo luga vavalalata laina faʻailo poʻo PCB laina, mafua ai le manaʻomia crosstalk (faʻalavelave ma le aofaʻi leo) ma faʻaleagaina faiga faʻagaioiga. Backloss e mafua mai i le le fetaui lelei, lea ei ai le tutusa aafiaga i luga o le faailo pei o le faʻaopoopo leo ma faalavelave.

Maualuga le toe faʻafoʻiga maua lua leaga faʻaletonu: 1. O le faʻailoga atagia i tua i le faʻailo mafuaʻaga o le a faʻateleina le pisapisao o le tino, ma atili ai ona faigata mo le tagata faʻatupeina ona vaʻaia leo mai faʻailo; 2. 2. Soʻo se atagia faailo o le a matua faʻaleagaina le tulaga lelei o le faʻailoga ona o le foliga o le faʻauluina faʻailo suiga.

E ui lava o polokalame faʻafuainumera e matua faʻatagaina lava aua naʻo fefaʻatauaiga ma 1 ma le 0 faʻailo, o le fealofani na tupu a o oso le fatu i le saoasaoa maualuga mafuaʻaga o le faʻailoga e sili atu ona vaivai ile maualuga maualuga. E ui lava o le faʻasaʻo o mea sese i luma e mafai ona aveʻesea nisi o le le lelei aʻafiaga, o se vaega o le system bandwidth e faʻaaogaina e lafoina redundant faʻamaumauga, e mafua ai le faʻaleagaina o galuega. O se fofo sili atu o le i ai o RF aafiaga e fesoasoani nai lo le toʻesea mai faʻailoga faʻamaoni. E fautuaina o le aofaʻi o tupe toe faʻafoi i le maualuga taimi masani o se numera numera (masani lava o se le lelei faʻamaumauga tulaga) avea -25dB, tutusa ma le VSWR o le 1.1.

O le mamanu a le PCB e faʻamoemoe e laʻititi, vave ma laʻititi le tau. For RF PCBS, high-speed signals sometimes limit the miniaturization of PCB designs. At present, the main method to solve the problem of cross-talk is ground management, spacing between wiring and reducing lead inductance. O le auala autu e faʻaititia ai le toe faʻafoi o le impedance tutusa. Lenei metotia aofia ai lelei le faʻatonutonuina o mea faʻaʻeseʻese ma tuʻusaʻoina o gaioiga faʻailo laina ma eleele laina, aemaise lava i le va o le setete o le faʻailoga laina ma le eleele.

Talu ai o le fesoʻotaʻiga o le sili ona vaivai soʻotaga i le matagaluega filifili, i le RF mamanu, o le eletise elemeni o le fesoʻotaʻiga manatu o le autu faafitauli o loʻo feagai ma inisinia, o soʻotaga fesoʻotaʻiga manatu e tatau ona suʻesuʻeina ma o loʻo i ai faʻafitauli foia. Fesoʻotaʻiga laupapa matagaluega e aofia ai fesoʻotaʻiga vaʻavaʻa-i-matagaluega, fesoʻotaʻiga PCB ma faʻailoga faʻaulufaleina / faʻatulaʻiga fesoʻotaʻiga i le va o PCB ma fafo masini.

Interconnection between chip and PCB board

The PenTIum IV and high-speed chips containing a large number of input/output interconnects are already available. As for the chip itself, its performance is reliable, and the processing rate has been able to reach 1GHz. One of the most exciting aspects of the recent GHz Interconnect symposium (www.az.ww. Com) is that approaches to dealing with the ever-increasing volume and frequency of I/O are well known. The main problem of interconnect between chip and PCB is that the density of interconnect is too high. An innovative solution was presented that uses a local wireless transmitter inside the chip to transmit data to a nearby circuit board.

Pe aoga le vaifofo pe leai, na manino i le au auai, o le IC design tekinolosi e mamao mamao atu PCB tisaini tisainiina mo hf apalai.

Fesoʻotaʻi PCB

O metotia ma metotia mo hf PCB tisaini e faʻapea:

1. O le 45 ° Angle e tatau ona faʻaaogaina mo le tulimanu laina laina e faʻaititia ai le toe faʻafoʻi (ATA. 1);

2 faʻaʻesega tumau taua tusa ai ma le tulaga o le matua pulea maualuga-faatinoga insulated laupapa matagaluega. O lenei metotia e aoga mo lelei faʻatonutonuina o le electromagnetic fanua i le va o mea faʻamamaina ma laina fesoʻotaʻi.

3. PCB tisaini faʻapitoa mo maualuga le saʻo etching tatau ona faʻaleleia. Mafaufau faʻapitoa e faʻatonu se aofaʻiga o le lautele laina sese o +/- 0.0007 inisi, faʻatonutonu undercut ma koluse vaega o uaea foliga ma faʻamaoti tuʻuga pa puipui pa puipui tulaga. Ole pulega atoa ole uaea (uaea) geometry ma ufiufi luga e taua e faʻatonutonu ai paʻu o aʻafiaga e fesoʻotaʻi ma microwave frequency ma ia faʻatinoina nei faʻamatalaga.

4. E i ai le tap inductance i protruding auala. Aloʻese mai le faʻaaogaina o vaega ma lead. Mo maualuga siʻosiʻomaga siʻosiʻomaga, e sili ona faʻaaoga luga tiʻetiʻe vaega.

5. Mo faʻailo e ala i pu, aloese mai le faʻaaogaina o le PTH gaioiga i luga o le maaleale ipu, aua o lenei gaioiga mafai mafua mafua inductance taʻimua i le ala pu.

6. Tuʻuina tele faʻaputuga eleele. O faʻaputuga pu e faʻaaogaina e faʻafesoʻotaʻi ai nei laupepa faʻavae e puipuia ai 3d electromagnetic fanua mai le aʻafia o le laupapa matagaluega.

7. Ina ia filifili eletise eletise e leai se eletise poʻo le faʻatofuina o ufiufi auro, aua le faʻaogaina le metotia plating HASL. Lenei electroplated luga maua ai se sili paʻu lelei aafiaga mo maualuga-taimi feʻaveaʻi (Ata 2). I se faʻaopopoga, o lenei sili ueloina ufiufi manaʻomia ni nai taʻitaʻiga, fesoasoani e faʻaititia le siʻosiʻomaga filogia.

8. Solder tetee vaega mafai ona puipuia solder faapipii mai le tafe. Ae ui i lea, ona o le le mautinoa o le mafiafia ma le le mautinoa faʻaaogaina faʻamamaina, ufiufi le atoa ipu luga ma solder tetee mea o le a taʻitaʻia ai se tele suiga i le electromagnetic malosi i microstrip mamanu. Generally, solder dam is used as solder resistance layer.

Afai e te le masani i nei metotia, faʻafesoʻotaʻi le poto masani tisaini inisinia na galue i luga o le microwave circuit laupapa mo le militeli. E mafai foi ona e talanoa ma latou poʻo le a le tau e mafai ona e gafatia. For example, it is more economical to use a copper-backed coplanar microstrip design than a strip design. Discuss this with them to get a better idea. Lelei inisinia ono le masani i le mafaufau e uiga i tau, ae oa latou fautuaga e mafai ona fai lava fesoasoani. O le a avea ma se taimi umi galuega e toleni talavou inisinia oe le masani i RF aafiaga ma leai se poto masani i le feagai ai ma RF aafiaga.

I se faʻaopopoga, o isi fofo e mafai ona taliaina, e pei o le faʻaleleia o le komepiuta faʻataʻitaʻiga ina ia mafai ai ona faʻatautaia RF aafiaga.

PCB fesoʻotaʻi ma fafo masini

E mafai nei ona tatou faʻapea ua uma ona tatou foʻia uma faʻailoilo faʻafitauli faafitauli i luga o le laupapa ma luga o fesoʻotaʻiga o vavaeʻese vaega. Ia faʻafefea la ona e fofoina le faʻailoga ulufale / faʻafitauli faafitauli mai le matagaluega laupapa i le uaea fesoʻotaʻi le masini taumamao? Trompeter Electronics, an innovator in coaxial cable technology, is working on this problem and has made some important progress (Figure 3). Ma leisi mea, vaʻai i le electromagnetic fanua faʻaalia i le Ata 4 i lalo. I lenei tulaga, matou te puleaina le liua mai le microstrip i le coaxial cable. I uaea coaxial, o le eleele faaputuga e fesoʻotaʻi i mama ma tutusa avanoa. I totonu o microbelts, o le grounding layer o loʻo i lalo ifo o le laina ola. Lenei faʻalauiloaina nisi pito aʻafiaga e manaʻomia ia malamalama, valoʻia, ma iloiloina i le taimi fuafuaina. Ioe, o lenei le tutusa fetaui mafai foi ona taitai atu ai i backloss ma tatau ona faʻaititia e aloese ai mai le pisa ma faʻalavelave faʻalavelave.

Ole faʻatautaia ole faʻafitauli i totonu ole fale e leʻose faʻafitauli e mafai ona le amanaʻia. O le impedance amata i luga o le matagaluega laupapa, pasi i totonu o le soʻoga soʻoga i le soʻoga, ma faʻaiʻu i le uaea coaxial. Ona o le impedance e fesuisuiaʻi ma le tele o taimi, o le maualuga o le alualu i luma, o le sili atu ona faigata o le puleaina o faʻafitauli. O le faʻafitauli o le faʻaaogaina o alaleo maualuga e lafo ai faailo i luga o broadband foliga mai o le autu autu faʻafitauli.

This paper summarizes

PCB platform technology needs continuous improvement to meet the requirements of IC designers. Hf signal management in PCB design and signal input/output management on PCB board need continuous improvement. Whatever exciting innovations are coming, I think bandwidth is going to get higher and higher, and using high frequency signals is going to be a prerequisite for that growth.