The interconnect of circuit board system includes chip-to-circuit board, interconnect within PCB and interconnect between PCB and external devices. Amin’ny famolavolana RF, ny toetra elektromagnetika amin’ny teboka ifaneraserana dia iray amin’ireo olana lehibe atrehin’ny famolavolana injeniera. Ity taratasy ity dia manolotra teknika isan-karazany amin’ireo endrika telo nifaneraserana tetsy ambony, ao anatin’izany ny fomba fametrahana fitaovana, ny fitokanana ny tariby ary ny fepetra hampihenana ny fidiran’ny firaka.

Misy famantarana fa ny tabilao vita pirinty dia natao ho an’ny fitomboan’ny fahita matetika. Rehefa mitombo hatrany ny tahan’ny angon-drakitra, ny fantsom-pifandraisana ilaina amin’ny fampitana data dia manosika ny valindrihana matetika ho 1GHz na avo kokoa. Ity haitao haingam-pandeha haingam-pandeha ity, na dia mihoatra ny teknolojia onjampeo (30GHz) aza, dia misy ny teknolojia microwave sy ny mikraoba ambany.

Ny fomba famolavolana injeniera RF dia tsy maintsy afaka mitantana ny effets electromagnetic matanjaka matanjaka izay vokarina matetika amin’ny ambaratonga avo kokoa. Ireo saha elektromagnetika ireo dia mety hitaona famantarana amin’ny tsipika famantarana mifanila na tsipika PCB, ka miteraka crosstalk (fanelingelenana sy tabataba tanteraka) ary manimba ny fahombiazan’ny rafitra. Ny backloss dia matetika miteraka tsy fitoviana tsy fitoviana, izay misy fiatraikany amin’ny famantarana toy ny tabataba sy fanelingelenana.

Ny fatiantoka avo lenta dia misy vokany ratsy roa: 1. Ny fambara taratra miverina amin’ny loharano famantarana dia hampitombo ny tabataban’ny rafitra, ka ho sarotra kokoa ho an’ny mpandray ny manavaka ny tabataba amin’ny signal; 2. 2. Izay famantarana hita taratra dia hanimba ny kalitaon’ny fambara satria miova ny endrik’ireo fambara fampidirana.

Na dia mandefitra be aza ny rafitra nomerika satria tsy miatrika afa-tsy famantarana 1 sy 0 izy ireo, ny firindrana ateraky ny fiakaran’ny haingam-pandeha dia mahatonga ny famantarana ho malemy kokoa amin’ny haavo avo kokoa. Na dia afaka manala ny sasany amin’ireo vokadratsiny aza ny fanitsiana ny lesoka mialoha, ny ampahany amin’ny fantsom-pifandraisana dia ampiasaina handefasana tahirin-kevitra miverimberina, ka miteraka fahasimban’ny asa. Vahaolana tsara kokoa ny fananana effets RF izay manampy fa tsy mampihena ny tsy fivadihan’ny signal. Soso-kevitra ny fahaverezan’ny totalin’ny fihoaram-pefy amin’ny avo indrindra amin’ny rafitra nomerika (mazàna teboka angon-drakitra ratsy) dia -25dB, mitovy amin’ny VSWR an’ny 1.1.

Ny famolavolana PCB dia mikendry ny ho kely kokoa, haingana kokoa ary tsy handany vola firy. For RF PCBS, high-speed signals sometimes limit the miniaturization of PCB designs. At present, the main method to solve the problem of cross-talk is ground management, spacing between wiring and reducing lead inductance. Ny fomba lehibe hampihenana ny fatiantoka miverina dia ny fampifangaroana ny impedance. Ity fomba ity dia misy ny fitantanana mahomby ny fitaovana insulation sy ny fitokanana ireo tsipika famantarana mavitrika sy ny tsipika an-tanety, indrindra eo anelanelan’ny fanjakan’ny tsipika famantarana sy ny tany.

Satria ny fifandraisana dia ny rohy malemy indrindra amin’ny rojom-pifamoivoizana, amin’ny famolavolana RF, ny toetra elektromagnetika ny teboka ifaneraserana no olana lehibe atrehana amin’ny famolavolana injeniera, ny teboka ifandraisan’ny tsirairay dia tokony hohadihadiana ary hamahana ireo olana efa misy. Ny fifandraisan’ny birao boribory dia misy fifandraisana amin’ny chip-to-circuit board, ny fifandraisana PCB ary ny fifandraisana / fampidirana signal eo amin’ny PCB sy ny fitaovana ivelany.

Interconnection between chip and PCB board

The PenTIum IV and high-speed chips containing a large number of input/output interconnects are already available. As for the chip itself, its performance is reliable, and the processing rate has been able to reach 1GHz. One of the most exciting aspects of the recent GHz Interconnect symposium (www.az.ww. Com) is that approaches to dealing with the ever-increasing volume and frequency of I/O are well known. The main problem of interconnect between chip and PCB is that the density of interconnect is too high. An innovative solution was presented that uses a local wireless transmitter inside the chip to transmit data to a nearby circuit board.

Na mandeha io vahaolana io na tsia, dia nazava tamin’ny mpanatrika fa ny teknolojia famolavolana IC dia mialoha lavitra ny teknolojia famolavolana PCB ho an’ny fampiharana hf.

Mifandraisa PCB

Ireto ny teknika sy ny fomba famolavolana hf PCB:

1. Ny zoro 45 ° dia tokony hampiasaina amin’ny zoro fandefasana mba hampihenana ny fatiantoka miverina (sary 1);

2 insulation lanjany tsy miovaova arakaraka ny haavon’ny voafehy mafy-fampisehoana insulate circuit board. Ity fomba ity dia mahasoa amin’ny fitantanana mahomby ny saha elektromagnetika eo anelanelan’ny fitaovana insulate sy ny tariby mifanila aminy.

3. Tokony hatsaraina ny famaritana ny famolavolana PCB ho an’ny etching avo lenta. Hevero ny mamaritra ny hadisoan’ny tsipika totalin’ny +/- 0.0007 santimetatra, fitantanana ny fizarana miiba sy ny hazo fijaliana amin’ny endriny tariby ary farito ny toe-javatra misy ny rindrina eo amin’ny rindrina. Ny fitantanana ankapobeny ny tontolon’ny geometrika (tariby) sy ny fonosana dia zava-dehibe amin’ny fiatrehana ny fiatraikan’ny hoditra mifandraika amin’ny refesin’ny microwave ary hampiharana ireo masontsivana ireo.

4. Misy fidirana amin’ny paompy mitarika. Aza mampiasa singa miaraka amina firaka. Ho an’ny tontolon’ny haavo avo lenta, tsara kokoa ny mampiasa singa miorina ambony.

5. Ho an’ny fambara amin’ny alàlan’ny lavaka, aza araraoty ny fampiasana ny fizotran’ny PTH amin’ny takelaka mora tohina, satria ity dingana ity dia mety hiteraka inductance firaka amin’ny loaka.

6. Omeo sosona an-tany be dia be. Ny lavaka mihorona dia ampiasaina hampifandraisina ireo sosona ifotony ireo mba hisorohana ny sahan’ny electromagnetic 3d tsy hisy fiantraikany amin’ny tabilao mihodina.

7. Mba hisafidianana plating nikela tsy alikaola na fizotry ny firavaka volamena miroboka, dia aza mampiasa fomba plating HASL. Ity velaran-tany elektrôlika ity dia manome vokatra hoditra tsara kokoa ho an’ny onjam-peo avo lenta (sary 2). Ho fanampin’izany, ity firakotra azo averina lasitra ity dia mitaky fitarihana vitsy kokoa, manampy amin’ny fampihenana ny fahalotoan’ny tontolo iainana.

8. Ny sosona fanoherana solder dia afaka misoroka ny fandosiran’ny solder. Na izany aza, noho ny tsy fahazoana antoka ny hateviny sy ny fiasan’ny insulation tsy fantatra, ny firakofana ny tontolon’ny takelaka manontolo amin’ny fitaovana fanoherana solder dia hitarika fiovana lehibe amin’ny angovo elektromagnetika amin’ny famolavolana microstrip. Generally, solder dam is used as solder resistance layer.

Raha tsy fantatrao ireo fomba ireo dia mankanisa amina injenieran’ny famolavolana efa za-draharaha izay niasa tamin’ny takelaka boribory microwave ho an’ny tafika. Azonao atao koa ny mifanakalo hevitra amin’izy ireo ny vidin’ny vidiny azonao atao. For example, it is more economical to use a copper-backed coplanar microstrip design than a strip design. Discuss this with them to get a better idea. Mety tsy zatra mieritreritra momba ny vidiny ny injeniera tsara, fa mety tena manampy kosa ny torohevitr’izy ireo. Asa maharitra izany hampiofanana injeniera tanora tsy mahalala ny vokatry ny RF sy tsy manana traikefa amin’ny fiatrehana ny vokan’ny RF.

Ho fanampin’izany, ny vahaolana hafa dia azo raisina, toy ny fanatsarana ny maodelin’ny solosaina hahafahana miatrika ny vokan’ny RF.

Mifandray amin’ny fitaovana ivelany ny PCB

Azontsika atao izao ny mieritreritra fa efa namaha ny olan’ny fitantanana signal rehetra eny amin’ny solaitrabe sy amin’ny fifandraisana amin’ny singa tsy mitovy izahay. Ka ahoana no hamahanao ny olan’ny fidirana / ny fivoahan’ny signal avy amin’ny tabilao mankany amin’ny tariby mampifandray ilay fitaovana lavitra? Trompeter Electronics, an innovator in coaxial cable technology, is working on this problem and has made some important progress (Figure 3). Jereo ihany koa ny saha elektromagnetika aseho amin’ny sary 4 etsy ambany. Amin’ity tranga ity dia mitantana ny fiovam-po avy amin’ny microstrip mankany cable coaxial izahay. Amin’ny tariby coaxial, ny sosona amin’ny tany dia mifangaro ao anaty peratra ary misy elanelana mitovy. Ao amin’ny microbelts, ny sosona ifotony dia eo ambanin’ny tsipika mavitrika. Ity dia manolotra vokarin’ny sisiny izay mila takarina, vinavina ary hodinihina amin’ny fotoanan’ny famolavolana. Mazava ho azy, io tsy fitoviana io koa dia mety hitarika any aoriam-bahoaka ary tsy maintsy hahena kely mba hialana amin’ny tabataba sy ny fanelingelenana ataon’ny signal.

Ny fitantanana ny olan’ny impedance anatiny dia tsy olana famolavolana azo tsinontsinoavina. Ny impedance dia manomboka eo ambonin’ny vata boribory, mandalo amin’ny mpiraikitra amin’ny mpiray, ary mifarana amin’ny tariby coaxial. Satria miovaova arakaraka ny fahita matetika ny impedance, arakaraky ny habetsaky ny matetika no miha sarotra ny fitantanana ny impedance. Ny olan’ny fampiasana matetika kokoa hampitana signal amin’ny alàlan’ny broadband dia toa ny olana amin’ny famolavolana lehibe.

This paper summarizes

PCB platform technology needs continuous improvement to meet the requirements of IC designers. Hf signal management in PCB design and signal input/output management on PCB board need continuous improvement. Whatever exciting innovations are coming, I think bandwidth is going to get higher and higher, and using high frequency signals is going to be a prerequisite for that growth.