Ukuxhumeka kohlelo lwebhodi lesifunda kufaka ibhodi le-chip-to-circuit, ukuxhumana ngaphakathi PCB nokuxhumana phakathi kwe-PCB namadivayisi angaphandle. Kumklamo we-RF, izici ze-electromagnetic endaweni yokuxhumana kungenye yezinkinga ezinkulu ezibhekene nokwakhiwa kobunjiniyela. Leli phepha lethula amasu ahlukahlukene ezinhlotsheni ezintathu ezingenhla zedizayini yokuxhumeka, kufaka phakathi izindlela zokufaka zedivayisi, ukuhlukaniswa kwentambo nezindlela zokunciphisa ukwehluleka kokuhola.

Kunezimpawu zokuthi amabhodi wesifunda aphrintiwe aklanywa ngemvamisa ekhulayo. Njengoba amanani wedatha aqhubeka nokwanda, umkhawulokudonsa odingekayo wokudluliswa kwedatha uphinde ucindezele ukufakwa kwemvamisa yesiginali kuye ku-1GHz noma ngaphezulu. Lobu buchwepheshe besiginali yemvamisa ephezulu, yize budlula ubuchwepheshe be-millimeter wave (30GHz), bubandakanya i-RF nobuchwepheshe obusezingeni eliphansi be-microwave.

Izindlela zokwakhiwa kobunjiniyela be-RF kumele zikwazi ukusingatha imiphumela enamandla yensimu ye-electromagnetic evame ukwenziwa kumaza aphezulu. Lezi zinkambu zikagesi zingadala amasignali kolayini besiginali abaseduze noma olayini be-PCB, kubangele i-crosstalk engathandeki (ukuphazamiseka nomsindo ophelele) nokulimaza ukusebenza kohlelo. I-Backloss ibangelwa kakhulu ukungafani kahle kwe-impedance, okunomphumela ofanayo kusiginali njengomsindo wokungezelela nokuphazamiseka.

Ukulahleka okuphezulu kokubuyisa kunemiphumela emibili emibi: 1. Isiginali eboniswe emuva emthonjeni wesiginali izokwandisa umsindo wohlelo, kwenze kube nzima kakhulu kulowo owamukelayo ukuhlukanisa umsindo kusuka kusiginali; 2. 2. Noma isiphi isinali esiboniswayo empeleni sizolulaza ikhwalithi yesignali ngoba ukuma kwesiginali yokufaka kuyashintsha.

Yize izinhlelo zedijithali zibekezelela amaphutha kakhulu ngoba zibhekana kuphela nezimpawu ezi-1 nezingu-0, ama-harmoniki akhiqizwa lapho i-pulse ikhuphuka ngejubane eliphezulu ibanga ukuthi isignali ibe buthakathaka kumaza aphezulu. Yize ukulungiswa kwephutha lokuya phambili kungasusa eminye yemiphumela emibi, ingxenye ye-bandwidth yesistimu isetshenziselwa ukudlulisa idatha engafuneki, okuholela ekwehleni kokusebenza. Isixazululo esingcono ukuthi sibe nemiphumela ye-RF esiza kunokunciphisa ubuqotho besiginali. Kunconywa ukuthi ukulahlekelwa okuphelele kokubuyisa kumvamisa ophakeme kakhulu wohlelo lwedijithali (imvamisa iphuzu ledatha elibi) kube -25dB, okulingana ne-VSWR ka-1.1.

Ukwakhiwa kwe-PCB kuhlose ukuba kuncane, kusheshe futhi kungabizi kakhulu. Okwe-RF PCBS, amasiginali wejubane kwesinye isikhathi anciphisa ukusebenza nge-miniaturization kwemiklamo ye-PCB. Njengamanje, indlela eyinhloko yokuxazulula inkinga yezinkulumo ezixubene nokuphathwa komhlaba, izikhala phakathi kwezintambo nokunciphisa ukungeniswa komthofu. Indlela esemqoka yokwehlisa ukulahleka kokubuyisa ukufana kwe-impedance. Le ndlela ifaka ukuphathwa okusebenzayo kwezinto zokwambathisa kanye nokuhlukaniswa kolayini besiginali osebenzayo nolayini bomhlaba, ikakhulukazi phakathi kwesimo sentambo yesiginali nomhlabathi.

Ngoba ukuxhumana kuyisixhumanisi esibuthakathaka kunketango yesekethe, ekwakhiweni kwe-RF, amandla kagesi ephoyinti lokuxhuma yinkinga enkulu ebhekene nokwakhiwa kobunjiniyela, iphoyinti ngalinye lokuxhuma kufanele liphenywe futhi kuxazululwe izinkinga ezikhona. Ukuxhumeka kwebhodi lesifunda kufaka ukuxhumana kwebhodi le-chip-to-circuit, ukuxhumana kwe-PCB nokuxhuma kokufaka / kokukhipha kwesiginali phakathi kwe-PCB namadivayisi angaphandle.

Ukuxhuma phakathi kwe-chip nebhodi le-PCB

IPenTIum IV namachipsi anejubane eliphezulu aqukethe inqwaba yezixhumanisi zokufaka / zokukhipha sezivele zitholakala. Ngokuqondene ne-chip uqobo, ukusebenza kwayo kunokwethenjelwa, futhi izinga lokucubungula likwazile ukufinyelela ku-1GHz. Enye yezinto ezithokozisa kakhulu yochungechunge lwamuva lwe-GHz Interconnect (www.az.ww. Com) ukuthi izindlela zokubhekana nomthamo okhuphuka njalo nobuningi be-I / O ziyaziwa. Inkinga enkulu yokuxhumana phakathi kwe-chip ne-PCB ukuthi ukuminyana kokuxhuma kuphakeme kakhulu. Kwethulwe isixazululo esisha esisebenzisa i-transmitter engenantambo yendawo ngaphakathi kwe-chip ukudlulisa imininingwane ebhodini lesifunda eliseduze.

Ukuthi lesi sixazululo siyasebenza noma cha, bekucacele kwababekhona ukuthi ubuchwepheshe bokuklama be-IC buhamba phambili kakhulu kobuchwepheshe bokwakha be-PCB bezicelo ze-hf.

Ukuxhumana kwe-PCB

Amasu nezindlela zokwakhiwa kwe-hf PCB zimi kanje:

1. I-Angle engu-45 ° kufanele isetshenziselwe ikhoneni lomugqa wokudlulisa ukunciphisa ukulahlekelwa okubuyayo (ISITHOMBE 1);

2 ukwahlukanisa okungaguquguquki ngokuya ngezinga lebhodi lesifunda eliqinile elilawulwa ngokuqinile. Le ndlela inenzuzo ekuphathweni okusebenzayo kwensimu ye-electromagnetic phakathi kokuvikela izinto nentambo eseduze.

3.Izincazelo zomklamo we-PCB wokunemba okuphezulu kufanele kuthuthukiswe. Cabanga ukucacisa iphutha lobubanzi bomugqa eliphelele lama- +/- 0.0007 amayintshi, ukuphatha izingxenye ezingaphansi nezinqamulelayo zezimo zewiring nokucacisa izimo zensimbi esehlangothini lodonga. Ukuphathwa okuphelele kwe-wiring (wire) geometry kanye nezindawo zokumboza kubalulekile ukubhekana nemiphumela yesikhumba ehlobene nobuningi be-microwave nokusebenzisa le mininingwane.

4. Kukhona ukuthambeka kokuthinta kumikhondo evelayo. Gwema ukusebenzisa izinto ezinemikhombandlela. Ezingxenyeni zemvamisa ephezulu, kungcono ukusebenzisa izinto ezibekwe ngaphezulu.

5. Ukuze uthole isignali ngezimbobo, gwema ukusebenzisa inqubo ye-PTH kupuleti elibucayi, ngoba le nqubo ingadala ukuhola kokungena emgodini.

6. Nikeza izingqimba zomhlaba eziningi. Izimbobo ezibunjiwe zisetshenziselwa ukuxhuma lezi zingqimba zokuvikela ukuvimbela izinkambu ze-3d zikagesi ekuthinteni ibhodi lesifunda.

7. Ukukhetha i-non-electrolysis nickel plating noma inqubo yokucwiliswa kwegolide, ungasebenzisi indlela ye-HASL plating. Le ndawo ene-electroplated inikeza umphumela wesikhumba ongcono wemisinga yamaza aphezulu (Umfanekiso 2). Ngaphezu kwalokho, le ngubo enamathele kakhulu idinga ukuhola okumbalwa, okusiza ukunciphisa ukungcoliswa kwemvelo.

8. Isendlalelo sokumelana nesolder singavimbela ukunamathisela kwe-solder ekugelezeni. Kodwa-ke, ngenxa yokungaqiniseki kobukhulu nokusebenza okungaziwa kwe-insulation, ukumboza yonke indawo yepuleti ngezinto zokumelana ne-solder kuzoholela ekuguqukeni okukhulu kwamandla kagesi ku-microstrip design. Ngokuvamile, idamu le-solder lisetshenziswa njengolwelwesi lwe-solder.

Uma ungazazi lezi zindlela, thintana nonjiniyela wokuklama onolwazi osebenze kumabhodi wesifunda ama-microwave ezempi. Ungaxoxa futhi nabo ukuthi yiluphi uhla lwamanani ongakwazi ukulikhokhela. Isibonelo, kuyonga kakhulu ukusebenzisa idizayini eyenzelwe i-coplanar microstrip eyenziwe ngethusi kunokwakhiwa kwe-strip. Xoxa ngalokhu nabo ukuze uthole umbono ongcono. Onjiniyela abahle kungenzeka abakujwayele ukucabanga ngezindleko, kepha izeluleko zabo zingasiza kakhulu. Kuzoba ngumsebenzi wesikhathi eside ukuqeqesha onjiniyela abasha abangajwayele imiphumela ye-RF nokuntula ulwazi ekubhekaneni nemiphumela ye-RF.

Ngaphezu kwalokho, ezinye izixazululo zingasetshenziswa, njengokuthuthukisa imodeli yekhompyutha ukuze ikwazi ukusingatha imiphumela ye-RF.

Ukuxhuma kwe-PCB namadivayisi angaphandle

Manje sesingacabanga ukuthi sizixazulule zonke izinkinga zokuphathwa kwesiginali ebhodini nasekuxhumaneni kwezinto ezihlukile. Ngakho-ke uyixazulula kanjani inkinga yokufaka / yokukhipha yesiginali kusuka ebhodini lesifunda kuya ocingweni oluxhuma idivayisi ekude? UTrompeter Electronics, umqambi wobuchwepheshe bekhebula le-coaxial, usebenza kule nkinga futhi wenze inqubekela phambili ebalulekile (Umfanekiso 3). Futhi, bheka inkambu kagesi ekhonjiswe kuMdwebo 4 ngezansi. Kulokhu, silawula ukuguqulwa kusuka ku-microstrip kuya kukhebula le-coaxial. Ezintanjeni ze-coaxial, izingqimba zomhlaba ziphakathi kwamasongo futhi zihlukaniswe ngokulinganayo. Kuma-microbelts, ungqimba lokubeka phansi lungaphansi komugqa osebenzayo. Lokhu kwethula imiphumela ethile yemiphetho edinga ukuqondwa, ukubikezelwa, nokucatshangelwa ngesikhathi sokuklanywa. Vele, lokhu kungahambisani nakho kungaholela ekubuyiseleni emuva futhi kufanele kuncishiswe ukugwema umsindo nokuphazamiseka kwesiginali.

Ukuphathwa kwenkinga yangaphakathi ye-impedance akuyona inkinga yokuklama enganakwa. I-impedance iqala ebusweni bebhodi lesifunda, idlule ngokuhlangana kwe-solder kuya ejoyini, bese iphelela kukhebula le-coaxial. Ngoba i-impedance iyahluka ngokuvama, ukuphakama kwemvamisa, ukuphathwa kwe-impedance kunzima kakhulu. Inkinga yokusebenzisa amaza aphezulu ukudlulisa amasiginali nge-broadband ibonakala iyinkinga eyinhloko yokwakhiwa.

Leli phepha liyafingqa

Ubuchwepheshe besikhulumi se-PCB budinga ukuthuthuka okuqhubekayo ukuhlangabezana nezidingo zabaqambi be-IC. Ukuphathwa kwesiginali ye-Hf ekwakhiweni kwe-PCB nokuphathwa kokufaka / kokukhipha kwesiginali ebhodini le-PCB kudinga ukuthuthukiswa okuqhubekayo. Noma ngabe yiziphi izinto ezintsha ezijabulisayo ezizayo, ngicabanga ukuthi umkhawulokudonsa uzokhula uphakeme, futhi ukusebenzisa amasiginali wemvamisa ephezulu kuzoba yinto edingekayo kulokhu kukhula.