The interconnect of circuit board system includes chip-to-circuit board, interconnect within PCB and interconnect between PCB and external devices. Pakapangidwe ka RF, mawonekedwe amagetsi amagetsi pamalo olumikizirana ndi amodzi mwamavuto akulu omwe amakumana nawo pakupanga kwa uinjiniya. Pepala ili limafotokoza njira zingapo pamitundu itatu yapamwambayi yolumikizira, kuphatikiza njira zoyikirira zida, kudzipatula kwa zingwe ndi njira zochepetsera kutayika kwamtsogolo.

Pali zikwangwani zosonyeza kuti matabwa osindikizidwa amapangidwa pafupipafupi. Pamene kuchuluka kwa deta kukukulirakulira, chiwongolero chofunikira pakufalitsa deta chimakankhiranso kuchuluka kwa ma frequency ku 1GHz kapena kupitilira apo. Tekinoloje yamagetsi yamafupipafupi iyi, ngakhale ili kutali kwambiri ndi millimeter wave technology (30GHz), imakhudzanso ukadaulo wa RF ndi ma microwave otsika.

Njira zopangira ukadaulo wa RF ziyenera kuthana ndi zovuta zamagetsi zamagetsi zomwe zimapangidwa pama frequency apamwamba. Magawo amagetsi amagetsiwa amatha kuyambitsa zikwangwani pamizere yoyandikana nayo kapena mizere ya PCB, zomwe zimayambitsa crosstalk (kusokoneza ndi phokoso lathunthu) ndikuwononga magwiridwe antchito. Kubwerera m’mbuyo kumayambitsidwa makamaka ndi impedance mismatch, yomwe imakhudzanso chizindikirocho ngati phokoso lowonjezera komanso zosokoneza.

Kutaya kwambiri kumabweretsa mavuto awiri: 1. Chizindikiro chomwe chimawonekeranso ku gwero lazizindikiro chimawonjezera phokoso la kachitidwe, zomwe zimapangitsa kuti zikhale zovuta kuti wolandirayo azitha kusiyanitsa phokoso ndi chizindikiro; 2. 2. Chizindikiro chilichonse chomwe chikuwonetsedwa chimachepetsa mtundu wa chizindikirocho chifukwa mawonekedwe a chizindikiro cholowera amasintha.

Ngakhale makina amama digito amakhala ololera kwambiri chifukwa amangogwira ndi ma 1 ndi 0, ma harmoniki omwe amapangidwa pomwe kuthamanga kukukwera kwambiri kumapangitsa kuti chizindikirocho chikhale chofooka pama frequency apamwamba. Ngakhale kukonza zolakwika kutsogolo kumatha kuthana ndi zovuta zina, gawo lina la magwiridwe antchito limagwiritsidwa ntchito pofalitsa zosowa, zomwe zimapangitsa kuwonongeka kwa magwiridwe antchito. Yankho labwinoko ndikukhala ndi zotsatira za RF zomwe zimathandiza m’malo mochotsa kukhulupirika pazizindikiro. Ndikulimbikitsidwa kuti kubweza konsekonse pafupipafupi kwambiri kwama digito (nthawi zambiri malo osavomerezeka) akhale -25dB, wofanana ndi VSWR wa 1.1.

Mapangidwe a PCB amayesetsa kukhala ocheperako, othamanga komanso otsika mtengo. For RF PCBS, high-speed signals sometimes limit the miniaturization of PCB designs. At present, the main method to solve the problem of cross-talk is ground management, spacing between wiring and reducing lead inductance. Njira yayikulu yochepetsera kubweza ndikufananira kwa impedance. Njirayi imaphatikizapo kuyendetsa bwino zinthu zotchingira ndikudzipatula kwa mizere yolumikizira ndi mizere yapansi, makamaka pakati pa mzere wazizindikiro ndi nthaka.

Chifukwa kulumikizana ndi cholumikizira chofooka kwambiri munyanjayi, mu kapangidwe ka RF, mawonekedwe amagetsi am’magawo olumikizirana ndiye vuto lalikulu lomwe likukumana ndi kapangidwe ka uinjiniya, gawo lililonse lolumikizirana liyenera kufufuzidwa ndikuthetsa mavuto omwe alipo kale. Kulumikizana kwa bolodi la dera kumaphatikizira kulumikizana kwa board-to-dera, kulumikizana kwa PCB ndi kulumikizana kwa kulowetsa / kulumikizana kwa siginecha pakati pa PCB ndi zida zakunja.

Interconnection between chip and PCB board

The PenTIum IV and high-speed chips containing a large number of input/output interconnects are already available. As for the chip itself, its performance is reliable, and the processing rate has been able to reach 1GHz. One of the most exciting aspects of the recent GHz Interconnect symposium (www.az.ww. Com) is that approaches to dealing with the ever-increasing volume and frequency of I/O are well known. The main problem of interconnect between chip and PCB is that the density of interconnect is too high. An innovative solution was presented that uses a local wireless transmitter inside the chip to transmit data to a nearby circuit board.

Kaya yankho ili likugwira ntchito kapena ayi, zinali zowonekeratu kwa omwe anali pamsonkhanowu kuti ukadaulo wopanga wa IC ukutsogola kwambiri kwa ukadaulo wa PCB wopangira hf.

Kuyanjana kwa PCB

Maluso ndi njira zopangira hf PCB ndi izi:

1. Angle ya 45 ° iyenera kugwiritsidwa ntchito pakona yolumikizira kuti ichepetse kubwerera (CHITSANZO 1);

2 kutchinjiriza mtengo wokhazikika molingana ndi mulingo wa bolodi loyang’anira bwino lomwe limayendetsa bwino. Njirayi ndiyothandiza pakuwongolera bwino maginito amagetsi pakati pazotetezera ndi zingwe zoyandikana nazo.

3. PCB kapangidwe specifications kwa mwatsatanetsatane mkulu mwatsatanetsatane ayenera bwino. Ganizirani kutanthauzira zolakwika zonse zazitali za +/- 0.0007 mainchesi, kuyang’anira magawo odula ndi owoloka ndikuwonetsetsa zokutira zammbali zazingwe. Kuwongolera kwathunthu kwa waya (waya) masanjidwe ndi zokutira ndikofunikira kuthana ndi zovuta zakhungu zokhudzana ndi mayendedwe a microwave ndikukhazikitsa izi.

4. Pali kutengeka kwapompopompopompo potuluka. Pewani kugwiritsa ntchito zigawo ndizotsogolera. M’malo okhala pafupipafupi, ndibwino kugwiritsa ntchito zinthu zokhala pamwamba.

5. Kuti mumveke kudzera m’mabowo, pewani kugwiritsa ntchito njira ya PTH pa mbale yovuta, chifukwa njirayi imatha kuyambitsa kutulutsa pobowola.

6. Perekani nthaka yambiri. Mabowo owumbidwa amagwiritsidwa ntchito kulumikiza zigawo izi kuti zisawonongeke magawo atatu amagetsi pamagetsi kuti asakhudze dera.

7. Kusankha ma plating osagwiritsa ntchito electrolysis kapena kumiza golide, musagwiritse ntchito njira ya HASL. Malo opangira magetsiwa amapereka khungu labwino pamafupipafupi (Chithunzi 2). Kuphatikiza apo, zokutira izi zotheka kwambiri zimafunikira njira zochepa, zothandiza kuchepetsa kuwonongeka kwa chilengedwe.

8. Solder kukana wosanjikiza kumalepheretsa solder phala kuti liziyenda. Komabe, chifukwa chakusatsimikizika kwa makulidwe ndi magwiridwe antchito osadziwika, kutsekera gawo lonse la mbale ndi zotsekemera za solder kudzatsogolera kusintha kwakukulu kwamagetsi amagetsi mu kapangidwe ka microstrip. Generally, solder dam is used as solder resistance layer.

Ngati simukudziwa bwino njirazi, funsani katswiri wodziwa zamagetsi yemwe wagwirapo ntchito yama board a microwave azankhondo. Muthanso kukambirana nawo za mtengo womwe mungakwanitse. For example, it is more economical to use a copper-backed coplanar microstrip design than a strip design. Discuss this with them to get a better idea. Akatswiri abwino sangazolowere kulingalira za mtengo, koma upangiri wawo ukhoza kukhala wothandiza kwambiri. Idzakhala ntchito yayitali kuphunzitsa mainjiniya achichepere omwe sadziwa zotsatira za RF ndipo alibe chidziwitso chothana ndi zovuta za RF.

Kuphatikiza apo, mayankho ena atha kutengedwa, monga kukonza makompyuta kuti athe kuthana ndi zotsatira za RF.

PCB yolumikizana ndi zida zakunja

Tsopano titha kuganiza kuti tathetsa mavuto onse oyang’anira ma siginolo pa bolodi komanso kulumikizana kwa zinthu zophatikizika. Ndiye mumathetsa bwanji vuto lolowetsa / kutulutsa kuchokera ku board board kupita pa waya yolumikiza chida chakutali? Trompeter Electronics, an innovator in coaxial cable technology, is working on this problem and has made some important progress (Figure 3). Komanso, yang’anani gawo lamagetsi lomwe likuwonetsedwa pa Chithunzi 4 pansipa. Poterepa, timatha kusintha kuchokera pa microstrip kupita pa chingwe cha coaxial. Mu zingwe za coaxial, zigawo zapansi zimaphatikizana m’makona komanso mofanana. Mu ma microbelts, wosanjikiza pansi ndi mzere wogwira. Izi zimabweretsa zovuta zina zakumapeto zomwe zimayenera kumvedwa, kunenedweratu, ndikuganiziridwa panthawi yakapangidwe. Zachidziwikire, kusayanjananso kumeneku kumatha kubweretsanso kubwerera m’mbuyo ndipo kuyenera kuchepetsedwa kupewa phokoso ndi kusokonekera kwa siginecha.

Kuwongolera kwa vuto lamkati lamkati si vuto lakapangidwe lomwe linganyalanyazidwe. Mpweyawo umayambira pamwamba pa bolodi la dera, umadutsa olumikizirana ndi solder, ndipo umathera pa chingwe cha coaxial. Chifukwa impedance imasiyanasiyana pafupipafupi, ikachulukirachulukira, zovuta kwambiri pakuwongolera ma impedance. Vuto logwiritsa ntchito ma frequency apamwamba kupatsira ma sign pa burodibandi likuwoneka ngati vuto lalikulu pamapangidwe.

This paper summarizes

PCB platform technology needs continuous improvement to meet the requirements of IC designers. Hf signal management in PCB design and signal input/output management on PCB board need continuous improvement. Whatever exciting innovations are coming, I think bandwidth is going to get higher and higher, and using high frequency signals is going to be a prerequisite for that growth.