Rigid Flex PCBA moralo le tlhahiso

Lintho tse matlafatsang: setsi sa lesela sa khalase sa fiber

Insulating resin: polyimide resin (PI)

Botenya ba sehlahisoa: poleiti e bonolo 0.15mm; Boto e thata 0.5mm; (mamello ± 0.03mm)

Boholo ba chip e le ‘ngoe: e ka etsoa ho latela litšoantšo tse fanoeng ke bareki

Botenya ba foil ea koporo: 18 μm(0.5oz)

Solder e hanyetsa filimi / oli: filimi e mosehla / filimi e ntšo / filimi e tšoeu / oli e tala

Ho roala le botenya: OSP (12um-36um)

Boemo ba mollo: 94-V0

Teko ea ho hanyetsa mocheso: mocheso oa mocheso 288 ℃ 10sec

Dielectric kamehla: Pi 3.5; AD 3.9;

Potoloho ea ts’ebetso: matsatsi a 4 bakeng sa disampole; Matsatsi a 7 a tlhahiso ea bongata;

Sebaka sa polokelo: polokelo e lefifi le ea vacuum, mocheso <25 ℃, mongobo <70%

ditshebetso tse Product:

1. iPCB ka customized ho sebetsa HDI foufetseng lesoba impedance tshebetso le tse ling tse thata Rigid Flex PCBA moralo le tlhahiso;

2. Ts’ehetso ea OEM le ODM OEM, ho tloha ho moralo oa ho taka ho ea ho tlhahiso ea boto ea potoloho le ts’ebetso ea SMT, le ho sebelisana le bafani ba tšebeletso e le ‘ngoe;

3. Laola boleng ka thata mme o fihlelle maemo a ipc2;

Boemo ba kopo:

Lihlahisoa li sebelisoa haholo ka liselefouno, lisebelisoa tsa lapeng, taolo ea indasteri, indasteri le likarolo tse ling.