Ukubunjwa kwe- Ibhodi PCB

Ibhodi yesekethe yangoku iqulathe ikakhulu oku kulandelayo:

Isekethe kunye nepateni (Ipatheni): Isekethe isetyenziswe njengesixhobo sokuqhuba phakathi kwezinto zokuqala. Kuyilo, indawo enkulu yobhedu iya kudityaniswa iyilwe njengesiseko kunye nomgangatho wamandla. Indlela kunye nomzobo zenziwa ngaxeshanye.

I-Dielectric layer (Dielectric): Isetyenziselwa ukugcina i-insulation phakathi kwesekethe kunye noluhlu ngalunye, olubizwa ngokuba yi-substrate.

Umngxuma (Ngomngxuma/ngendlela): Umngxuma odlulayo ungenza ukuba imigca engaphezulu kwesibini idityaniswe enye kwenye, inkulu ephumela emngxunyeni isetyenziswa njengenxalenye yokufaka iplagi, kwaye umngxuma ongaphumeleliyo (nPTH) udla ngokusetyenziswa. njengentaba yomhlaba Isetyenziselwa ukulungisa izikrufu ngexesha lokuhlanganisa.

I-Solder resistant / Solder Mask: Ayizizo zonke iindawo zobhedu ezifuna ukuba zibe ngamalungu e-tin-on, ngoko ke indawo engeyiyo i-tin iya kuprintwa kunye nomaleko wezinto ezikhusela umphezulu wobhedu ekutyeni i-tin (ngokuqhelekileyo i-epoxy resin), thintela iisekethe ezimfutshane. phakathi kweesekethe ezingafakwanga. Ngokweenkqubo ezahlukeneyo, ihlulwe ibe yioli eluhlaza, ioli ebomvu kunye neoli eluhlaza okwesibhakabhaka.

Isikrini sesilika (Ibali / iMakisha / isikrini seSilk): Esi sisakhiwo esingabalulekanga. Umsebenzi oyintloko kukuphawula igama kunye nesakhelo sesikhundla secandelo ngalinye kwibhodi yesiphaluka, ekulungele ukugcinwa kunye nokuchongwa emva kwendibano.

Ukugqitywa kwe-Surface: Ngenxa yokuba indawo yobhedu i-oxidized ngokulula kwindawo eqhelekileyo, ayikwazi ukutshizwa (i-solderability embi), ngoko iya kukhuselwa kwindawo yobhedu efuna ukuba ifakwe. Iindlela zokukhusela ziquka i-HASL, i-ENIG, i-Immersion Silver, i-Immersion Tin, kunye ne-Organic Solder Preservative (OSP). Indlela nganye ineenzuzo kunye nokungona kwayo, ezibizwa ngokuba yimbumba yonyango olungaphezulu.

Izibonelelo ezinkulu zeenjineli, isoftware yokuqala yohlalutyo lwePCB, cofa ukuze uyifumane simahla

Iimpawu zebhodi yePCB zinokuxinana okuphezulu. Kwiminyaka emininzi, ukuxinana okuphezulu kweebhodi eziprintiweyo ziye zakwazi ukuphuhlisa kunye nokuphuculwa kokuhlanganiswa kweesekethe ezidibeneyo kunye nokuqhubela phambili kweteknoloji yokunyuka.

Ukuthembeka okuphezulu. Ngoluhlu lokuhlolwa, iimvavanyo kunye novavanyo lokuguga, i-PCB inokusebenza ngokuthembekileyo ixesha elide (ngokuqhelekileyo iminyaka engama-20). Inokuyilwa. Kwiimfuno ezahlukeneyo zokusebenza zePCB (zombane, ezomzimba, iikhemikhali, oomatshini, njl.njl.), uyilo lwebhodi eprintiweyo lunokuphunyezwa ngokumiswa koyilo, ukulinganisa, njl., kunye nexesha elifutshane kunye nokusebenza okuphezulu.

Ukuvelisa. Ngolawulo lwanamhlanje, ukulinganisa, ukulinganisa (ubungakanani), i-automated kunye nenye imveliso inokuqhutyelwa ukuqinisekisa ukuhambelana komgangatho wemveliso.

Ukuvavanywa. Indlela yovavanyo egqibeleleyo, umgangatho wovavanyo, izixhobo ezahlukeneyo zovavanyo kunye nezixhobo ziye zasekwa ukuze kubonwe kwaye kuqwalaselwe ukufaneleka kunye nobomi benkonzo yeemveliso zePCB. Inokuhlanganiswa. Iimveliso ze-PCB azilungele kuphela ukuhlanganisana okusemgangathweni kwamacandelo ahlukeneyo, kodwa kunye nemveliso ezenzekelayo kunye nenkulu enkulu. Kwangaxeshanye, iPCB kunye neenxalenye zendibano yecandelo ezahlukeneyo zinokudityaniswa ukuze zenze iinxalenye ezinkulu kunye neenkqubo, ukuya kuthi ga kwi-maintainability epheleleyo. Ekubeni iimveliso ze-PCB kunye neenxalenye ezahlukeneyo zendibano yecandelo ziyilwe kwaye ziveliswa ngomlinganiselo omkhulu, ezi ndawo nazo zisemgangathweni. Ngoko ke, xa inkqubo ingaphumeleli, inokutshintshwa ngokukhawuleza, ngokufanelekileyo kunye nokuguquguqukayo, kwaye inkqubo inokubuyiselwa ngokukhawuleza ukuba isebenze. Kakade ke, kunokubakho imizekelo emininzi. Okufana ne-miniaturization kunye nokunciphisa ubunzima benkqubo, kunye nokuhanjiswa kwesignali yesantya esiphezulu.

Uthini umahluko phakathi kwebhodi yePCB kunye nesekethe edibeneyo?

Iimpawu zeSekethe eziDityanisiweyo

Iisekethe ezidibeneyo zineenzuzo zobukhulu obuncinci, ubunzima obulula, iingcingo zokukhokela ezimbalwa kunye namanqaku okuthengisa, ubomi obude, ukuthembeka okuphezulu, kunye nokusebenza kakuhle. Ngexesha elifanayo, baneendleko eziphantsi kwaye zilungele ukuveliswa kobuninzi. Ayisetyenziswa kakhulu kuphela kwimizi-mveliso nakwizixhobo zombane zoluntu ezifana nezirekhoda, oomabonakude, iikhompyutha, njl. Ukusebenzisa iisekethe ezidityanisiweyo ukudibanisa izixhobo ze-elektroniki, ingxinano yendibano inokunyuswa amashumi aliqela ukuya kumawaka amaxesha kunee-transistors, kwaye ixesha elizinzileyo lokusebenza lesixhobo nalo linokuphuculwa kakhulu.

Imizekelo yeSicelo seSekethe eDityanisiweyo

Isekethe edibeneyo ye-IC1 yisekethe yexesha le-555, edityaniswe njengesekethe ezinzileyo apha. Ngokuqhelekileyo, ngenxa yokuba akukho mbane owenziweyo kwi-terminal ye-P ye-touch pad, i-capacitor C1 ikhutshwe nge-7 pin ye-555, ukuphuma kwe-3 pin iphantsi, i-KS yokubuyisela ikhutshwe, kwaye ukukhanya akwenzi. layita.

Xa ufuna ukukhanyisa isibane, chukumisa iqhekeza lentsimbi P ngesandla sakho, kwaye i-voltage yesignali ye-clutter eyenziwa ngumzimba womntu yongezwa ukusuka kwi-C2 ukuya kwi-terminal ye-trigger ye-555, ukwenzela ukuba imveliso ye-555 itshintshe ukusuka kwi-low ukuya phezulu. . I-relay KS iyatsala kwaye ukukhanya kuyajika. Eqaqambileyo. Ngexesha elifanayo, i-7 ye-pin ye-555 inqunyulwe ngaphakathi, kwaye umbane wombane uhlawulisa i-C1 nge-R1, isiqalo sexesha.

Xa i-voltage kwi-capacitor C1 iphakama ukuya kwi-2/3 ye-voltage yombane wombane, i-7 pin ye-555 ivuliwe ukukhupha i-C1, ukwenzela ukuba umphumo we-3 pin utshintshe ukusuka kwinqanaba eliphezulu ukuya kwinqanaba eliphantsi, i-relay ikhululiwe. , ukukhanya kuyacima, kwaye ixesha liyaphela.

Ubude bexesha bumiselwa yi-R1 kunye ne-C1: T1=1.1R1*C1. Ngokwexabiso eliphawulwe kumfanekiso, ixesha lexesha limalunga nemizuzu emi-4. I-D1 inokukhetha i-1N4148 okanye i-1N4001.

Uthini umahluko phakathi kwebhodi yePCB kunye nesekethe edibeneyo?

Kwisiphaluka somzobo, isiseko sexesha sesekethe i-555 idibaniswe njengesiphaluka esine-astable, kunye ne-frequency output ye-pin 3 yi-20KHz, kunye ne-duty ratio yi-1: 1 wave wave. Xa i-pin 3 iphezulu, i-C4 ihlawuliswa; xa iphantsi, i-C3 ihlawuliswa. Ngenxa yobukho be-VD1 kunye ne-VD2, i-C3 kunye ne-C4 zihlawuliswa kuphela kodwa azikhutshwa kwisiphaluka, kwaye ixabiso eliphezulu lokutshaja yi-EC. Qhagamshela i-terminal ye-B ukuya kumhlaba, kwaye i- +/-EC yamandla amabini afumaneka kuzo zombini iziphelo ze-A kunye ne-C. Imveliso yangoku yale sekethi idlula i-50mA.

Uthini umahluko phakathi kwebhodi yePCB kunye nesekethe edibeneyo?

Umahluko phakathi kwebhodi yePCB kunye nesekethe edibeneyo. Isekethe edityanisiweyo ngokubanzi ibhekisa ekudityanisweni kweechips, njenge-Northbridge chip kwi-motherboard, ingaphakathi le-CPU libizwa ngokuba yisekethe edibeneyo, kwaye igama lokuqala likwabizwa ngokuba yibhloko edibeneyo. Kwaye isekethe eprintiweyo ibhekisa kwibhodi yesekethe esiqhele ukuyibona, kunye neetshiphusi ze-solder zokushicilela kwibhodi yesekethe.

Isekethe edibeneyo (IC) ithengiswa kwibhodi yePCB; ibhodi yePCB ngumthwali wesekethe edibeneyo (IC). Ibhodi yePCB yibhodi yesekethe eprintiweyo (PCB). Iibhodi zesekethe eziprintiweyo zivela phantse kuzo zonke izixhobo zombane. Ukuba kukho iinxalenye ze-elektroniki kwisixhobo esithile, iibhodi zesekethe eziprintiweyo zonke zixhonywe kwiiPCB zobukhulu obahlukeneyo. Ukongezelela ekulungiseni iindawo ezincinci ezincinci, umsebenzi oyintloko webhodi yesekethe eprintiweyo kukudibanisa ngombane iindawo ezingaphezulu komnye nomnye.

Ukubeka nje, isekethe edibeneyo idibanisa isiphaluka-injongo jikelele kwi-chip. Iphelele. Emva kokuba yonakele ngaphakathi, i-chip nayo yonakalisiwe, kwaye i-PCB ingathengisa amacandelo ngokwayo, kwaye ithathe indawo yamacandelo ukuba yaphukile.