Kunshin IC ya dogara PCB don watsawar zafi. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Kulawa da kyau na shimfidar PCB, tsarin jirgi, da dutsen na’ura na iya taimakawa haɓaka aikin watsa zafi don aikace-aikacen matsakaici-da ƙarfi.

Masu kera Semiconductor suna da wahalar sarrafa tsarin da ke amfani da na’urorin su. Koyaya, tsarin da aka shigar da IC yana da mahimmanci ga aikin na’urar gaba ɗaya. Don na’urorin IC na al’ada, mai ƙirar tsarin yawanci yana aiki tare tare da mai ƙira don tabbatar da cewa tsarin ya cika buƙatun watsawar zafi na na’urori masu ƙarfi. Wannan haɗin gwiwar da wuri yana tabbatar da cewa IC ta cika ƙa’idodin lantarki da aiki, yayin tabbatar da ingantaccen aiki a cikin tsarin sanyaya abokin ciniki. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. A wannan yanayin, zamu iya amfani da wasu jagororin gabaɗaya don taimakawa cimma ingantacciyar hanyar watsa zafi don IC da tsarin.

Yadda za a zana watsawar zafi don PCB

Nau’in fakitin semiconductor na kowa shine kushin mayafi ko fakitin PowerPADTM. In these packages, the chip is mounted on a metal plate called a chip pad. Wannan nau’in guntun guntun yana goyan bayan guntu yayin aiwatar da sarrafa guntu, kuma kuma hanya ce mai kyau ta zafi don ɓarkewar zafi na na’urar. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Fakitoci na Bare pad yawanci suna canja wurin kusan kashi 80% na zafi zuwa cikin PCB ta kasan fakitin. Ragowar kashi 20% na zafi ana fitarwa ta hanyar wayoyin na’urar da bangarori daban -daban na kunshin. Kasa da 1% na zafi yana tserewa ta saman fakitin. Dangane da waɗannan fakiti-mayafi, ƙirar watsawar zafi mai kyau na PCB yana da mahimmanci don tabbatar da wasu ayyukan na’urar.

Sashin farko na ƙirar PCB wanda ke inganta aikin zafi shine ƙirar na’urar PCB. A duk lokacin da ya yiwu, yakamata a raba manyan abubuwan da ke cikin PCB daga juna. Wannan tazara ta zahiri tsakanin manyan abubuwan haɗin wuta yana haɓaka yankin PCB a kusa da kowane babban ƙarfin wutar lantarki, wanda ke taimakawa cimma ingantaccen canja wurin zafi. Care should be taken to separate temperature sensitive components from high power components on the PCB. Duk inda zai yiwu, abubuwan haɗin ƙarfi yakamata a kasance nesa da kusurwoyin PCB. Matsayin PCB mafi tsaka-tsaki yana haɓaka yankin katako kusa da manyan abubuwan da ke da ƙarfi, ta haka yana taimakawa wajen watsa zafi. An nuna na’urori biyu masu kama da semiconductor: sassan A da B. Bangaren A, wanda yake a kusurwar PCB, yana da zafin haɗin guntu na guntu 5% sama da ɓangaren B, wanda aka sanya shi a tsakiya. Karkacewar zafi a kusurwar ɓangaren A yana iyakance ta ƙaramin yankin panel kusa da ɓangaren da ake amfani da shi don watsawar zafi.

Fuska ta biyu shine tsarin PCB, wanda ke da tasiri mafi mahimmanci akan aikin zafi na ƙirar PCB. A matsayinka na yau da kullun, gwargwadon jan ƙarfe da PCB ke da shi, mafi girman aikin zafi na abubuwan tsarin. Mafi kyawun yanayin ɓarkewar zafi don na’urorin semiconductor shine cewa an ɗora guntu akan babban toshe na jan ƙarfe mai sanyaya ruwa. Wannan ba shi da amfani ga yawancin aikace -aikacen, don haka dole ne mu yi wasu canje -canje ga PCB don haɓaka watsawar zafi. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Duk lokacin da zai yiwu, haɓaka lamba da kauri na yadudduka tagulla na PCB. Nauyin jan ƙarfe na ƙasa gabaɗaya babba ne, wanda shine kyakkyawar hanyar zafi don duka watsawar zafin PCB. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Koyaya, wannan wayoyin galibi ana rufe shi da wutar lantarki, yana iyakance amfani da shi azaman matattarar zafi. Yakamata a haɗa na’urar da ke ƙasa ta hanyar lantarki kamar yadda zai yiwu zuwa yadudduka da yawa na ƙasa don taimakawa haɓaka haɓaka zafi. Ramin watsawar zafi a cikin PCB da ke ƙasa da na’urar semiconductor yana taimakawa zafi ya shiga yadudduka na PCB kuma ya canza zuwa bayan jirgin.

Layi na sama da ƙasa na PCB sune “manyan wurare” don ingantaccen aikin sanyaya. Yin amfani da wayoyi masu fadi da juyawa daga na’urori masu ƙarfi na iya samar da hanyar zafi don watsawar zafi. Kwamitin gudanar da zafi na musamman hanya ce mai kyau don watsawar zafi na PCB. Farantin mai ɗorewa yana saman ko bayan PCB kuma ana haɗa shi da zafi ta na’urar ta hanyar haɗin jan ƙarfe kai tsaye ko rami mai zafi. Dangane da fakitin inline (kawai tare da jagora a ɓangarorin biyu na fakitin), farantin jagorar zafi yana iya kasancewa a saman PCB, mai siffa kamar “ƙashin kare” (tsakiyar yana kunkuntar kamar kunshin, jan ƙarfe daga fakitin yana da babban yanki, ƙarami a tsakiya kuma babba a ƙarshen duka). Game da fakitin gefe guda huɗu (tare da jagora a duk ɓangarorin huɗu), farantin jagorar zafi ya kasance a bayan PCB ko cikin PCB.

Ƙara girman farantin madubin zafi hanya ce mai kyau don haɓaka aikin zafi na fakitin PowerPAD. Different size of heat conduction plate has great influence on thermal performance. Takaddar bayanan samfuri na samfuri galibi yana lissafa waɗannan girman. Amma ƙididdige tasirin ƙara jan ƙarfe akan PCBS na al’ada yana da wahala. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Waɗannan kayan aikin lissafin suna nuna girman abin da ƙirar PCB ke shafar aikin watsa zafi. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. Don fakitin layi biyu, za mu iya amfani da salon kushin “kare kashi” don watsa zafi.

A ƙarshe, ana iya amfani da tsarin tare da PCBS mafi girma don sanyaya. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Idan aka yi la’akari da yadda ake sarrafa ɗumbin zafi da farashi, yakamata a ƙara yawan sukurori zuwa ga rage dawowar. Ƙarfin PCB na ƙarfe yana da ƙarin yankin sanyaya bayan an haɗa shi da farantin zafi. Don wasu aikace -aikace inda gidan PCB yana da harsashi, kayan facin TYPE B yana da aikin zafi mafi girma fiye da harsashi mai sanyaya iska. Hakanan ana amfani da hanyoyin sanyaya, kamar magoya baya da fikafikan don sanyaya tsarin, amma galibi suna buƙatar ƙarin sarari ko buƙatar gyare -gyaren ƙira don inganta sanyaya.

Don tsara tsarin tare da babban aikin zafi, bai isa ba don zaɓar na’urar IC mai kyau da rufaffiyar mafita. Tsarin aikin sanyaya IC ya dogara da PCB da ƙarfin tsarin sanyaya don ba da damar na’urorin IC su yi sanyi da sauri. Hanyar kwantar da hankula da aka ambata a sama na iya inganta aikin watsawar zafi na tsarin.