IC packages rely on PCB yekupisa kupisa. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Kuchenjerera kubata kwePCB dhizaini, bhodhi dhizaini, uye chishandiso gomo kunogona kubatsira kuvandudza kupisa kupisa kudzikisira kwepakati – uye yakakwira-simba kunyorera.

Vagadziri veSemiconductor vane dambudziko rekudzora masystem anoshandisa zvishandiso zvavo. However, a system with an IC installed is critical to overall device performance. Kune echinyakare IC zvishandiso, iyo system dhizaina inowanzo shanda pamwe nemugadziri kuona kuti iyo sisitimu inosangana neakawanda kupisa kupisa kudzora kwezvakakwira-simba zvishandiso. This early collaboration ensures that the IC meets electrical and performance standards, while ensuring proper operation within the customer’s cooling system. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. Mune ino kesi, isu tinogona chete kushandisa mamwe akajairwa marongero ekubatsira kuwana iri nani pasiti kupisa kudzima mhinduro yeIC uye system.

Maitiro ekugadzira kupisa kupisa kwePCB

Kazhinji semiconductor package mhando haina pad kana PowerPADTM package. In these packages, the chip is mounted on a metal plate called a chip pad. Iyi mhando chip pad inotsigira iyo chip mukugadzirisa chip kugadzira, uye zvakare iri yakanaka yekupisa nzira yekushandisa kupisa kupisa kupera. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Bare pad mapakeji anowanzo shandura angangoita makumi masere muzana emoto mukati mePBBB pasi pehomwe. Iwo asara makumi maviri muzana ekupisa anoburitswa kuburikidza newaya tambo uye akasiyana mativi epakeji. Less than 1% of the heat escapes through the top of the package. Muchiitiko cheaya asina-mapakeji mapakeji, akanaka pcb kupisa kupisa dhizaini kwakakosha kuti uve nechokwadi cheimwe kifaa mashandiro.

Chinhu chekutanga chePCB dhizaini iyo inovandudza mashandiro ekuita ndeyePCB dhizaini dhizaini. Pese pazvinogoneka, masimba epamusoro-pombi paPCB anofanira kupatsanurwa kubva kune mumwe nemumwe. Iyi nzvimbo yemuviri pakati pesimba-remagetsi zvinowedzera iyo PCB nzvimbo yakatenderedza yega yega-simba chinhu, icho chinobatsira kuwana zvirinani kupisa kupisa. Care should be taken to separate temperature sensitive components from high power components on the PCB. Pese pazvinogoneka, masimba emagetsi epamusoro anofanirwa kunge ari kure nemakona ePCB. Imwe nzvimbo yepakati pcbb inokwidziridza iyo nzvimbo yebhodhi yakatenderedza epamusoro-magetsi, nekudaro ichibatsira kudzima kupisa. Mavhidhiyo maviri akafanana semiconductor anoratidzwa: zvikamu A uye B. Chikamu A, chiri pakona yePCB, ine A chip junction tembiricha 5% yakakwira kupfuura chikamu B, icho chakamisikidzwa zvakanyanya pakati. Kupisa kupisa pakona yechinhu A kunogumirwa nediki nzvimbo yepaneru yakatenderedza chikamu chinoshandiswa pakupisa kupisa.

The second aspect is the structure of PCB, which has the most decisive influence on the thermal performance of PCB design. Semitemo yakajairika, iyo yakawanda mhangura iyo PCB ine, inowedzera iko kupisa kwekushisa kweiyo system zvikamu. Iyo chaiyo yekupisa kupisa mamiriro ezvinhu e semiconductor zvishandiso ndeyekuti chip chakaiswa pane hombe block yemvura-yakatonhorera mhangura. Izvi hazvishande kune akawanda mafomu, saka isu taifanira kuita dzimwe shanduko kuPCB yekuvandudza kupisa kupisa. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Pese pazvinenge zvichibvira, kuwedzera huwandu uye ukobvu hwePCB mhangura matombo. Iko kurema kwekuvhuvhuta mhangura kunowanzo kuve kwakakura, inova yakanakisa nzira yekupisa yeiyo pcb yese kupisa kupisa. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Nekudaro, iyi wiring inowanzo kuvezwa nemagetsi, ichidzikisira mashandisiro ayo seinogona kupisa singi. Iyo yekumisikidza yekushandisa inofanirwa kuve newired senge magetsi sezvinobvira kune akawanda ma grounding matete sezvinobvira kubatsira kuwedzera kudzikisira kupisa conduction. Makomba ekupisa ekupisa muPCB pazasi peiyo semiconductor chishandiso anobatsira kupisa kupinda mukati meakadzikwa ePCB uye kuendesa kumashure kwebhodhi.

Iwo epamusoro uye ezasi akaturikidzana ePBB ndiwo “epamusoro nzvimbo” ekuvandudza kutonhora kuita. Kushandisa waya dzakafara uye kuendesa kure kunobva kumagetsi-emagetsi zvinogona kupa nzira yekupisa yekuparadza kupisa. Yakakosha kupisa conduction bhodhi inzira yakanaka kwazvo yePBB kupisa kupisa. Iyo yekupisa inoitisa ndiro iri kumusoro kana kumashure kwePCB uye ine thermally yakabatana kune chishandiso kuburikidza ingave yakananga mhangura yekubatanidza kana inopisa mukati-gomba. Panyaya yekuisa mukati mutsetse (chete nekutungamira kune ese mativi epakeji), iyo yekushisa conduction ndiro inogona kuve pamusoro pePCB, yakaumbwa se “imbwa pfupa” (iyo yepakati yakatetepa sepakeji, iyo mhangura kure nepakeji ine nzvimbo hombe, diki pakati nepakakura kumagumo maviri). Muchiitiko chechina-padivi pasuru (ine inotungamira kumativi ese mana), iyo yekushisa conduction ndiro inofanira kuve iri kumashure kwePCB kana mukati mePCB.

Kuwedzera saizi yeiyo inopisa conduction ndiro ndiyo yakanaka nzira yekuvandudza mashandiro emagetsi ePowerPAD mapakeji. Different size of heat conduction plate has great influence on thermal performance. Iyo tabular chigadzirwa data pepa inowanzo nyora izvi zviyero. Asi kuyera kukanganiswa kwemhangura yakawedzerwa pane tsika PCBS zvakaoma. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Aya maturusi ekuverenga anoratidzira mwero uyo pcb dhizaini inokonzeresa kupisa kupisa kuita. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. Kune maviri emukati-mutsara mapakeji, isu tinokwanisa kushandisa iyo “imbwa bone bone” pad maitiro kudzora kupisa.

Chekupedzisira, masystem ane hombe PCBS anogona zvakare kushandiswa kutonhora. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Tichifunga nezve kudziya kwekupisa uye mutengo, huwandu hwezvikwiriso hunofanirwa kukwidziridzwa kusvika padanho rekudzora kudzoka. Iyo simbi pcb stiffener ine yakawanda inotonhora nzvimbo mushure mekubatanidzwa kune yekupisa ndiro. Kune kumwe kunyorera uko imba yePCB ine goko, iyo TYPE B solder chigamba zvinhu zvine yakanyanya kupisa mashandiro pane mweya watonhodza goko. Mhinduro dzinotonhora, senge mafeni uye zvimbi, zvinowanzo shandiswa kutonhodza sisitimu, asi zvinowanzoda imwe nzvimbo kana kuda dhizaini yekugadzirisa kugadzirisa kutonhora.

Kugadzira sisitimu ine yakanyanya kupisa mashandiro, hazvina kukwana kusarudza yakanaka IC chishandiso uye yakavharwa mhinduro. IC kutonhora kuita kuronga kunoenderana neIPCBB uye kugona kweiyo kutonhora system kubvumira IC zvishandiso kutonhora nekukurumidza. Iyo yekungoita yekutonhora nzira yataurwa pamusoro inogona kuvandudza zvakanyanya kupisa kupisa kudzora kwesisitimu.