Baakadaha IC waxay ku tiirsan yihiin PCB kala-baxa kuleylka. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Si taxaddar leh u maareynta qaabeynta PCB, qaab dhismeedka guddiga, iyo korinta aaladda ayaa gacan ka geysan karta hagaajinta waxqabadka kala-firdhinta kulaylka ee codsiyada dhexdhexaad-iyo sare.

Soo saarayaasha semikonductor -ku waxay ku adag tahay inay xakameeyaan nidaamyada adeegsada qalabkooda. Si kastaba ha ahaatee, nidaam leh IC rakiban ayaa muhiim u ah waxqabadka guud ee qalabka. Qalabka IC ee caadada u ah, naqshadeeyaha nidaamka ayaa sida caadiga ah si dhow ula shaqeeya soo-saaraha si loo hubiyo in nidaamku buuxiyo shuruudaha kala-daadinta kulaylka badan ee aaladaha awoodda sare leh. Wada -shaqaynta hore waxay xaqiijinaysaa in IC ay buuxiso heerarka korontada iyo waxqabadka, iyada oo hubinaysa hawlgal habboon oo ku jira nidaamka qaboojinta macmiilka. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. Xaaladdan, waxaan kaliya u adeegsan karnaa qaar ka mid ah tilmaamaha guud si aan gacan uga geysanno sidii aan ku gaari lahayn xalka firdhinta kuleylka dadban ee IC iyo nidaamka.

Sida loo naqshadeeyo kala -daadinta kulaylka PCB

Nooca xirmada semiconductor -ka caadiga ah waa suuf qaawan ama xirmo PowerPADTM. In these packages, the chip is mounted on a metal plate called a chip pad. Noocan ah suufka jajabka wuxuu taageeraa jibbaarkii geedi socodkii qashin -qubka, sidoo kale waa dariiqa kuleylka u fiican kala -firdhinta kulaylka aaladda. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Baakadaha suufka bareeraha ayaa sida caadiga ah ku wareejinaya qiyaastii 80% kuleylka PCB -ga iyada oo loo marayo baakadka hoose. 20% haray ee kuleylka ayaa ka soo baxa fiilooyinka qalabka iyo dhinacyada kala duwan ee xirmada. In ka yar 1% kuleylka ayaa ka soo baxda dusha baakadda. Marka laga hadlayo baakadahaan suufka suufka ah, naqshadeynta kuleylka PCB-ga wanaagsan ayaa lagama maarmaan u ah si loo hubiyo waxqabadka aaladda qaarkood.

Qaybta koowaad ee naqshadeynta PCB ee hagaajisa waxqabadka kuleylka waa qaabeynta aaladda PCB. Mar kasta oo ay suurtogal tahay, qaybaha awoodda sare leh ee ku jira PCB waa in la kala soocaa. Kala-fogaantaan jireed ee u dhexeysa qaybaha awoodda sare waxay sare u qaadeysaa aagga PCB agagaarka qayb kasta oo awood sare leh, taas oo gacan ka geysaneysa in la gaaro ku-beddel kuleyl oo ka sii wanaagsan. Care should be taken to separate temperature sensitive components from high power components on the PCB. Meel kasta oo ay suurtogal tahay, qaybaha awoodda sare leh waa inay ku yaalliin meel ka fog geesaha PCB. Meel PCB oo dhexdhexaad ah ayaa sare u qaadeysa aagga guddiga agagaarka qeybaha awoodda sare leh, taas oo gacan ka geysaneysa kala-qaadidda kuleylka. Laba qalab semiconductor oo isku mid ah ayaa la muujiyey: qaybaha A iyo B. Qaybta A, oo ku taal geeska PCB -ga, waxay leedahay heerkulbeegga isku -xidhka chip 5% ka sarreeya qaybta B, kaas oo meel dhexe la dhigay. Kala -daadinta kulaylka ee qaybta A waxaa ku xaddidan aagga guddiyada yar ee agagaarka qaybta loo isticmaalo kala -daadinta kulaylka.

Wejiga labaad waa qaab -dhismeedka PCB, kaas oo leh saamaynta ugu go’aaminta badan xagga waxqabadka kuleylka ee naqshadeynta PCB. Sida caadiga ah, hadba sida naxaasku u badan yahay PCB -ga, waxaa sare u kacaya waxqabadka kuleylka ee qaybaha nidaamka. Xaaladda kulaylka ku habboon ee aaladaha semiconductor-ka ayaa ah in guntigu ku dul rakiban yahay naxaas dareere ah oo la qaboojiyey. Tani ma aha mid wax ku ool ah inta badan codsiyada, sidaa darteed waxay ahayd inaan isbeddello kale ku samaynno PCB -ga si aan u hagaajino kala -daadinta kulaylka. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Mar kasta oo ay suurtogal tahay, kor u qaad tirada iyo dhumucda lakabyada naxaasta ee PCB. Miisaanka naxaasta dhulka hoostiisa guud ahaan waa weyn yahay, taas oo ah waddo kuleyl aad u fiican oo ku baahsan kuleylka PCB oo dhan. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Si kastaba ha ahaatee, fiilooyinkaan badiyaa waa koronto ku xiran yihiin, taas oo xaddideysa isticmaalkeeda sida kuleyl suuragal ah. Dhulka aaladda waa in lagu xiraa koronto ahaan intii suurtagal ah ilaa lakabyo badan oo dhulka ah si loo caawiyo sare u qaadista kuleylka. Godadka kala -firdhinta kulaylka ee PCB -ga ee ka hooseeya aaladda semiconductor -ka ayaa ka caawiya kulaylka inuu galo lakabyada gundhigga u ah PCB -ga oo loo wareejiyo xagga dambe ee guddiga.

Lakabka sare iyo kan hoose ee PCB -ga ayaa ah “goobaha ugu muhiimsan” si loo hagaajiyo waxqabadka qaboojinta. Isticmaalka fiilooyin ballaadhan iyo ka fogaanshaha aaladaha awoodda sare leh waxay bixin karaan waddo kuleyl ah oo kulaylku ku faafo. Guddiga tabinta kulaylka ee gaarka ahi waa hab aad u fiican oo loogu talogalay kulaylka PCB. Saxanka tabinta kuleylku wuxuu ku yaal dusha ama gadaasha PCB-ga wuxuuna si kuleyl ahaan ugu xiran yahay aaladda iyada oo loo marayo isku xirka naxaas tooska ah ama daloolka daloolka. Xaaladda baakad -ku -jira (kaliya oo leh tilmaamo ku yaal labada dhinac ee baakadka), saxanka tabinta kuleylku wuxuu ku yaalliin dusha PCB -ga, oo u eg “laf eey” (dhexda ayaa cidhiidhi u ah xirmada, naxaas ka fog baakada ayaa leh baaxad weyn, yar yar dhexda iyo weyn labada darafba). Marka la eego xirmada afarta dhinac ah (oo leh afarta dhinac dhinac kasta), saxanka tabinta kuleylka waa inuu ku yaal dhabarka PCB-ga ama gudaha PCB-ga.

Kordhinta xajmiga saxanka kuleylka waa hab aad u wanaagsan oo lagu hagaajin karo waxqabadka kuleylka ee baakadaha PowerPAD. Different size of heat conduction plate has great influence on thermal performance. Xaashida xogta badeecada shaxanka ah ayaa sida caadiga ah taxaysa cabbirradaas. Laakiin qiyaasidda saamaynta naxaas lagu daray PCBS -da caadadu waa adag tahay. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Aaladaha xisaabintaani waxay muujinayaan xadka ay naqshadda PCB saamaynayso waxqabadka kala -daadinta kulaylka. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. Baakadaha labka-dhex-dhexaadka ah, waxaan u adeegsan karnaa qaabka suufka “lafta eyga” si aan u kala qaadno kuleylka.

Ugu dambayn, nidaamyada leh PCBS ka weyn ayaa sidoo kale loo isticmaali karaa qaboojinta. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Iyadoo la tixgalinayo tabinta kuleylka iyo qiimaha, tirada boolalku waa in la kordhiyaa si loo yareeyo soo noqoshada. Qalabaynta PCB -ga birta ayaa leh aag qaboojin badan kadib markii lagu xiray saxanka kuleylka. Codsiyada qaarkood meesha ay PCB -ga ku leedahay qolof, maaddada balastarka TYPE B waxay leedahay waxqabad kaameeradeed oo ka sarreeya qolofka hawada la qaboojiyey. Xalalka qaboojinta, sida taageerayaasha iyo baalasha, ayaa sidoo kale caadi ahaan loo adeegsadaa qaboojinta nidaamka, laakiin inta badan waxay u baahan yihiin meel bannaan ama waxay u baahan yihiin wax ka beddel naqshadeyn si kor loogu qaado qaboojinta.

Si loo naqshadeeyo nidaam leh wax -qabad kuleyl sare leh, kuma filna in la doorto aalad IC wanaagsan iyo xal xiran. Jadwalka waxqabadka qaboojinta IC wuxuu ku xiran yahay PCB -ga iyo awoodda nidaamka qaboojinta si loogu oggolaado aaladaha IC inay si dhaqso leh u qaboojiyaan. Habka qaboojinta dadban ee kor ku xusan ayaa si weyn u hagaajin kara waxqabadka kala -daadinta kulaylka ee nidaamka.