Ko nga kohinga IC e whakawhirinaki ana PCB mo te wera wera. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Ma te aata tirotiro i te whakatakotoranga PCB, te hanganga poari, me te whakaurunga o nga taputapu ka pai ake te whakapai ake i te mahi wera mo nga kaupapa reo-me nga tono kaha-nui.

He uaua ki nga kaiwhakanao Semiconductor te whakahaere i nga punaha e whakamahi ana i a raatau taputapu. Heoi, ko te punaha me te whakauru IC he mea nui ki te mahinga taputapu katoa. Mo nga taputapu IC ritenga, ko te kaihoahoa punaha e mahi ngatahi ana me te kaiwhakanao ki te whakarite kia tutuki i te punaha nga whakaritenga marara wera o nga taputapu kaha-nui. Ko tenei mahi tahi wawe e whakarite ana ka tutuki i te IC nga paerewa hiko me te paerewa mahi, me te whakarite kia tika te whakahaere i roto i te punaha meangiti a te kaihoko. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. I tenei keehi, ka taea noa e taatau te whakamahi i etahi aratohu whanui hei awhina i te otinga o te wera wera ngawari mo te IC me te punaha.

Me pehea te hoahoa i te wera wera mo te PCB

Ko te momo kohinga semiconductor noa he papa whanau he kohinga PowerPAD TM ranei. In these packages, the chip is mounted on a metal plate called a chip pad. Ko tenei momo papa maramara e tautoko ana i te maramara i te waahanga o te tukatuka maramara, a he pai te ara wera mo te tohatoha o te wera o te taputapu. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Ko nga kohinga papa bare e whakawhiti ana i te 80% pea o te wera ki roto i te PCB i raro o te kohinga. Ko te toenga 20% o te wera ka puta i roto i nga waea waea me nga taha katoa o te putea. He iti ake i te 1% o te wera ka puta i te tihi o te kohinga. I roto i enei kohinga papa-whanau, he mea nui te whakakahoretanga o te wera PCB pai hei whakarite i te mahinga o nga taputapu.

Ko te ahuatanga tuatahi o te hoahoa PCB e whakapai ake ana i te mahi waiariki ko te whakatakotoranga taputapu PCB. Ka taea ana, ko nga waahanga-nui o te PCB me wehe tetahi ki tetahi. Ko tenei mokowhiti i waenga i nga waahanga hiko-teitei ka whakanui i te rohe PCB huri noa i ia waahanga-mana nui, e awhina ana ki te whakawhiti wera pai ake. Care should be taken to separate temperature sensitive components from high power components on the PCB. Ka taea ana, ko nga waahanga mana-nui kia tu ke atu i nga kokonga o te PCB. Ko te tuunga PCB takawaenga ake ka whakanui i te rohe poari huri noa i nga waahanga hiko-teitei, ma reira ka aukati i te wera. E rua nga taputapu semiconductor e whakaatuhia ana: ko nga waahanga A me te B. Ko te Wae A, kei te kokonga o te PCB, he maramara hononga maramara 5% teitei ake i te waahanga B, e tuu ana i waenga ake. Ko te tohatoha wera i te kokonga o te waahanga A he mea iti na te waahanga papaiti iti noa i te waahanga e whakamahia ana mo te wera wera.

Ko te waahanga tuarua ko te hanganga o te PCB, e kaha nei te whakatau ki te mahi waiariki o te hoahoa PCB. Hei tikanga whanui, ko te nui o te parahi o te PCB, ko te teitei ake o te mahi waiariki o nga waahanga punaha. Ko te ahuatanga o te wera wera tino pai mo nga taputapu semiconductor ko te maramara kua eke ki runga i te poraka nui o te parahi matao-wai. Ehara tenei i te mahi ma te nuinga o nga tono, no reira me whakarereke etahi atu ki te PCB hei whakapai ake i te tohatoha o te wera. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Ka taea ana, whakanui i te maha me te matotoru o nga papa parahi PCB. Ko te taumaha o te parahi parahi he nui te tikanga, he ara wera tino pai mo te tohatoha wera PCB katoa. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Heoi, ko tenei waea hiko he mea hiko noa, he aukati i tona whakamahinga hei totohu wera tera pea. Me waea te papa o te taputapu ki te hiko kia taea ki te maha o nga paparanga papa kia taea ai te whakanui i te kawe wera. Ko nga kohao wera wera i te PCB kei raro o te taputapu semiconductor hei awhina i te wera ki te whakauru ki nga papa whakauru o te PCB ka whakawhiti ki muri o te papa.

Ko nga papa o runga me raro o te PCB he “waahi nui” mo te whakapai ake i te mahi tautau. Ma te whakamahi i nga waea whanui me te nekehanga atu i nga taputapu hiko-teitei ka taea te whakarato i tetahi ara wera mo te wera wera. Ko te poari whakahaere wera motuhake he tikanga pai mo te tohatoha o te wera PCB. Ko te pereti kawe waiariki kei runga a runga o muri ranei o te PCB a he hono wera ki te taputapu na roto i te hononga parahi tika, i te poka waiariki ranei. I te wa o te kohinga rarangi (ma nga taha e rua o te putea), ka tu te pereti kawe wera i runga ake o te PCB, he rite ki te “wheua kuri” (he kuiti te waenganui rite te putunga, te he nui te rohe o te parahi mai i te kete, he iti ki waenganui, he nui kei nga pito e rua). I te taha o te kete e wha-taha (me nga tohu ki nga taha e wha), me tu te pereti whakahaere wera i muri o te PCB, ki roto ranei i te PCB.

Ko te whakanui i te rahi o te pereti kawe wera he huarahi pai ki te whakapai ake i te mahi waiariki o nga kohinga PowerPAD. Different size of heat conduction plate has great influence on thermal performance. Ko te raarangi tuhinga hua rarangi e whakaatu ana i enei waahanga. Engari ko te whakatau i te paanga o te parahi ki te PCBS ritenga he uaua. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Ko enei taputapu taatai ​​e whakaatu ana i te kaha o te hoahoanga PCB ki te awe i te mahi wera wera. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. Mo nga kohinga takirua takirua, ka taea e taatau te whakamahi i te taera papa “wheua kuri” hei whakakore i te wera.

Hei whakamutunga, ka taea hoki te whakamahi i nga punaha me te PCBS nui ake hei whakamatao. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Ki te whakaarohia te kawe waiariki me te utu, me whakanui te maha o te kopara kia iti haere ai te whakahoki mai. Ko te kaitaha PCB whakarewa he nui ake te waahanga o te hauhautanga i muri i tana hono atu ki te pereti waiariki. Mo etahi tono kei i te whare PCB he angaanga, he pai ake te mahi a te TYPE B papanga papanga raima i te anga o te hau i whakamanahia. Ko nga rongoa whakamaoatanga, penei i nga kaiwhaiwhai me nga koha, ka whakamahia ano mo te hauhautanga o te punaha, engari he maha nga waahi ka hiahiatia kia hiahiatia he waahanga hoahoa kia pai ai te whakamaoatanga.

Hei hoahoa i tetahi punaha me te nui o te mahi waiariki, kaore e ranea te kowhiri i tetahi taputapu IC pai me te otinga kati. Ko te mahinga mahi whakamaoatanga a IC ka whakawhirinaki ki TE PCB me te kaha o te punaha whakamaoatanga kia tere ai te whakamatao o nga taputapu IC. Ko te tikanga tautauā hāngū kua whakahuahia i runga ake nei ka kaha ake te whakapai ake i te wera o te punaha.