Hilinaʻi nā pūʻulu IC PCB no ka hoʻopau wela. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Hiki ke kōkua pono i ka hoʻonohonoho ʻana o PCB, ka papa papa, a me ka hoʻouka uila i ka hoʻomaikaʻi ʻana i ka hana wela no nā mea waena – a me nā noi mana kiʻekiʻe.

He paʻakikī nā mea hana Semiconductor i ka kaohi ʻana i nā ʻōnaehana i hoʻohana i kā lākou hāmeʻa. However, a system with an IC installed is critical to overall device performance. No nā polokalamu IC maʻamau, hana pū ka mea hoʻolālā ʻōnaehana me ka mea hana e hōʻoia i ka hoʻokō ʻana o ka ʻōnaehana i nā koi no ka hoʻopau wela o nā hāmeʻa mana kiʻekiʻe. Hoʻomaopopo kēia hana mua i ka hui ʻana o ka IC me nā kūlana uila a me ka hana, ʻoiai e hōʻoia ana i ka hana kūpono ma waena o ka ʻōnaehana hōʻoluʻolu o ka mea kūʻai. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. I kēia hihia, hiki iā mākou ke hoʻohana i kekahi mau kulekele laulā e kōkua i ka hoʻokō ʻana i kahi hopena dissipation heat passive heat maikaʻi aʻe no IC a me ka ʻōnaehana.

Pehea e hoʻolālā ai i ka hoʻopau wela no PCB

ʻO ka ʻano pūʻolo semiconductor maʻamau ka papa pad a i ʻole ka pūʻulu PowerPADTM. In these packages, the chip is mounted on a metal plate called a chip pad. Kākoʻo kēia ʻano pā papā i ka puʻukū i ke kaʻina hana o ka chip, a he ala pumahana maikaʻi hoʻi ia no ka hoʻopau wela ʻana o ka hāmeʻa. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Hoʻololi pinepine nā pūʻolo pad Bare ma kahi o 80% o ka wela i loko o ka PCB ma o ka lalo o ka pūʻolo. Hoʻouna ʻia ke koena 20% o ka wela ma o nā kaula uila a me nā ʻaoʻao like ʻole o ka pūʻolo. Ma lalo o 1% o ka mahuka i pakele ma o ka piko o ka pūʻolo. I ke ʻano o kēia mau pūʻolo pale pale ʻole, pono nui ka hoʻolālā dissipation wela PCB pono e hōʻoia i kekahi mau pono hana.

ʻO ka hiʻohiʻona mua o ka hoʻolālā PCB e hoʻomaikaʻi i ka hana mehana he hoʻonohonoho ʻōnaehana PCB. Ke hiki pono, e hoʻokaʻawale ʻia nā ʻāpana mana kiʻekiʻe ma ka PCB mai kekahi i kekahi. ʻO kēia ākea ākea ma waena o nā mea mana kiʻekiʻe e hoʻonui i ka wahi PCB a puni kēlā me kēia mana mana nui, kahi e kōkua ai i ka hoʻolilo wela maikaʻi aʻe. Care should be taken to separate temperature sensitive components from high power components on the PCB. Ma kahi e hiki ai, pono e hoʻonohonoho ʻia nā mea mana kiʻekiʻe mai nā kihi o ka PCB. ʻO kahi kūlana PCB waenaʻoi aku e hoʻonui i ka wahi o ka papa e pili ana i nā mea mana kiʻekiʻe, a laila e kōkua ai i ka hoʻopau ʻana i ka wela. Hōʻike ʻelua mau semiconductor manaʻo like: nā ʻāpana A a me B. ʻO ke kikowaena A, aia ma ke kihi o ka PCB, kahi mehana o kahi chip 5% ʻoi aku ka kiʻekiʻe ma mua o ka ʻāpana B, i hoʻonohonoho ʻia ma ke kikowaena. Hoʻopau ʻia ka hoʻoneʻe wela ma ke kihi o ka ʻāpana e ka ʻāpana panel liʻiliʻi e pili ana i ka mea i hoʻohana ʻia no ka hoʻopau wela.

ʻO ka lua o ka hiʻohiʻona ka hanana o PCB, kahi i loaʻa ka mana hoʻoholo loa i ka hana wela o ka hoʻolālā PCB. Ma ke ʻano he kaulike, ʻo ka nui o ke keleawe i loaʻa i ka PCB, ʻo ke kiʻekiʻe ka hana mehana o nā ʻāpana o ka ʻōnaehana. ʻO ke kūlana dissipation wela maikaʻi loa no nā hāmeʻa semiconductor ʻo ia ka chip i kau ʻia ma kahi palaka nui o ke keleawe hoʻowali wai. ʻAʻole kūpono kēia no ka hapanui o nā noi, no laila pono mākou e hana i nā hoʻololi ʻē aʻe i ka PCB e hoʻomaikaʻi ai i ka wela wela. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Ke hiki, hoʻonui i ka helu a me ka mānoanoa o nā papa keleawe PCB. ʻO ke kaupaona o ke keleawe pae nui nui, kahi ala wela maikaʻi loa no ka pau ʻana o ka wela PCB. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Eia nō naʻe, hoʻopili pinepine ʻia kēia uea, e kaupalena ana i kona hoʻohana ʻia ma ke ʻano he poho wela. Pono e hoʻopili i ka pae o ka hāmeʻa e like me ka uila e like me ka hiki i nā papa honua i hiki ke kōkua i ka hoʻonui ʻana i ka hoʻowela wela. ʻO nā puka hoʻokae wela ma ka PCB ma lalo o ka hāmeʻa semiconductor kōkua i ka wela e komo i nā papa i hoʻokomo ʻia o ka PCB a hoʻololi i ka hope o ka papa.

ʻO nā papa luna a me lalo o kahi PCB he mau “wahi maikaʻi” no ka hoʻomaikaʻi maikaʻi ʻana i ka hana. Ke hoʻohana nei i nā uea ākea a me ka hoʻokele ʻana mai nā mana uila kiʻekiʻe hiki ke hāʻawi i kahi ala wela no ka hoʻopau wela. ʻO ka papa hoʻoneʻe wela kūikawā kahi ala maikaʻi loa no ka hoʻopau ʻana o ka wela PCB. Aia ka pā conductive pahana ma luna a i hope paha o ka PCB a pili pili wela i ka hāmeʻa ma o ka pili keleawe pololei a i ʻole ka puka pā wela. I ke ʻano o ka pākuhi inline (ʻo nā alakaʻi wale nō ma nā ʻaoʻao ʻelua o ka pūʻolo), hiki ke ʻike ʻia ka pā conduction wela ma ka piko o ka PCB, e like me ka “iwi ʻīlio” (ʻākiki ka waena e like me ka pūʻolo, ka keleawe mai ka pūʻolo he nui kahi, liʻiliʻi i ka waena a nui ma nā wēlau ʻelua). I ka hihia o nā ʻaoʻao ʻehā (me nā alakaʻi ma nā ʻaoʻao ʻehā), pono e hoʻonohonoho ʻia ka pā hoʻoneʻe wela ma ka hope o ka PCB a i ʻole ma loko o ka PCB.

ʻO ka hoʻonui ʻana i ka nui o ka pā hoʻoneʻe wela kahi ala maikaʻi loa ia e hoʻomaikaʻi ai i ka hana mehana o nā pūʻulu PowerPAD. Different size of heat conduction plate has great influence on thermal performance. ʻO ka pepa ʻikepili ʻikepili huahana e hōʻike maʻamau i kēia mau ana. Akā paʻakikī ka helu ʻana i ka hopena o ke keleawe i hoʻohui ʻia ma PCBS maʻamau. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Hōʻike kēia mau mea hana helu i ka nui o ka hoʻolālā PCB e hoʻohuli ai i ka hana dissipation wela. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. No nā pūʻulu laina pālua, hiki iā mākou ke hoʻohana i ke kaila “ʻīlio iwi” e hoʻopau ai i ka wela.

ʻO ka hope, hiki ke hoʻohana ʻia nā ʻōnaehana me ka PCBS nui aʻe no ka hōʻalili ʻana. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Ke noʻonoʻo nei i ka conductivity mehana a me ke kumukūʻai, pono e hoʻonui ʻia ka helu o nā ʻāʻī a hiki i kahi o ka hōʻemi ʻana i ka hoʻihoʻi. ʻOi aku ka mea anuanu o ka mea hao PCB metala ma hope o ka pili ʻana i ka pā mahana. No kekahi mau noi kahi o ka hale PCB i kahi pū, ʻo ka TYPE B solder patch material i ʻoi aku ka kiʻekiʻe o ka hana thermal ma mua o ka pūpū hoʻoluʻu lewa. Hoʻohana pinepine ʻia nā hopena anuanu, e like me nā pā a me nā peʻa, no ka hōʻoluʻolu ʻōnaehana, akā koi pinepine lākou i kahi ākea a koi paha i nā hoʻololi hoʻolālā e hoʻonui ai i ka hōʻoluʻolu.

No ka hoʻolālā ʻana i kahi ʻōnaehana me ka hana wela kiʻekiʻe, ʻaʻole lawa ka koho ʻana i kahi hāmeʻa IC maikaʻi a me ka hopena paʻa. ʻO ka hoʻolālā ʻana o ka hana hōʻoluʻolu IC i ka THE PCB a me ka hiki o ka ʻōnaehana hōʻoluʻolu e ʻae ai i nā polokalamu IC e hoʻomaʻalili wikiwiki. ʻO ka hana hoʻoluʻu passive i ʻōlelo ʻia ma luna hiki ke hoʻomaikaʻi maikaʻi i ka hana dissipation wela o ka ʻōnaehana.