Phukusi IC kudalira PCB Kutaya kutentha. In general, PCB is the main cooling method for high power semiconductor devices. A good PCB heat dissipation design has a great impact, it can make the system run well, but also can bury the hidden danger of thermal accidents. Kusamala masanjidwe a PCB, kapangidwe ka bolodi, ndi kukwera kwa zida kumatha kuthandizira kukonza magwiridwe antchito a kutentha kwa magwiritsidwe apakatikati – ndi mphamvu.

Opanga ma semiconductor amavutika kuwongolera machitidwe omwe amagwiritsa ntchito zida zawo. Komabe, kachitidwe kokhala ndi IC kokhazikitsidwa ndikofunikira pakuchita kwamagetsi. Pazipangizo zamakono za IC, wopanga makinawa amagwirira ntchito limodzi ndi wopanga kuti awonetsetse kuti dongosololi likukwaniritsa zofunikira zambiri pakutha kwa zida zamagetsi zamagetsi. Kugwirizana koyambirira uku kumatsimikizira kuti IC ikukwaniritsa miyezo yamagetsi ndi magwiridwe antchito, kwinaku ikuwonetsetsa kuti ikuchita bwino munthawi yozizira ya kasitomala. Many large semiconductor companies sell devices as standard components, and there is no contact between the manufacturer and the end application. Poterepa, titha kungogwiritsa ntchito malangizo ena kuti tithandizire kuyankha kwanyengo kwa IC ndi dongosolo.

Momwe mungapangire kutaya kwanyengo kwa PCB

Mtundu wamba wa phukusi la semiconductor wopanda phukusi kapena phukusi la PowerPADTM. In these packages, the chip is mounted on a metal plate called a chip pad. Mtundu uwu wa chip pad umathandizira chip pokonzekera chip, komanso njira yabwino yotenthetsera kutentha kwa chipangizo. When the packaged bare pad is welded to the PCB, heat is quickly exited from the package and into the PCB. The heat is then dissipated through the PCB layers into the surrounding air. Ma pare pad phukusi amatumiza pafupifupi 80% ya kutentha kulowa mu PCB kudzera pansi pake. Kutentha kotsala kwama 20% kumatulutsidwa kudzera pamawaya azida ndi mbali zosiyanasiyana za phukusi. Kutentha kochepera 1% kumatuluka pamwamba phukusi. Pankhani yama phukusi opanda pakewa, kapangidwe kabwino ka kutentha kwa PCB ndikofunikira kuti zitsimikizire magwiridwe antchito ena.

Mbali yoyamba ya kapangidwe ka PCB kamene kamakulitsa magwiridwe antchito ndikapangidwe kazipangizo za PCB. Pomwe zingatheke, zida zamagetsi zapamwamba pa PCB ziyenera kupatukana. Kutalikirana kumeneku pakati pazigawo zamagetsi apamwamba kumakulitsa dera la PCB mozungulira gawo lililonse lamphamvu, lomwe limathandizira kupititsa patsogolo kutentha. Care should be taken to separate temperature sensitive components from high power components on the PCB. Pomwe zingatheke, zida zamagetsi zazikulu ziyenera kukhala kutali ndi ngodya za PCB. Udindo wapakati wa PCB umakulitsa malo ozungulirako zida zamphamvu kwambiri, potero amathandizira kutentha. Zipangizo ziwiri zofanana za semiconductor zimawonetsedwa: zigawo A ndi B. Chigawo A, chomwe chili pakona pa PCB, chimakhala ndi kutentha kwa Chip 5% kuposa gawo B, lomwe lili pakatikati. Kutaya kwachangu pakona ya chigawo A kumangolekezedwa ndi gawo laling’ono lazungulira gawo lomwe limagwiritsidwa ntchito potaya kutentha.

Mbali yachiwiri ndi kapangidwe ka PCB, kamene kamakhudza kwambiri magwiridwe antchito a kapangidwe ka PCB. Nthawi zambiri, PCB ikamakhala ndi mkuwa wochulukirapo, ndimphamvu kwambiri momwe matenthedwe amagwirira ntchito. Mkhalidwe woyenera wa kutaya kwazida pazida zama semiconductor ndikuti chip chimakhazikika pamtengo waukulu wamkuwa utakhazikika. Izi sizothandiza pamafunso ambiri, chifukwa chake timayenera kusintha zina ku PCB kuti tithandizire kutentha. For most applications today, the total volume of the system is shrinking, adversely affecting heat dissipation performance. Larger PCBS have more surface area that can be used for heat transfer, but also have more flexibility to leave enough space between high-power components.

Pomwe zingatheke, kwezani kuchuluka ndi makulidwe a zigawo zamkuwa za PCB. Kulemera kwake kwamkuwa kumakhala kwakukulu, komwe ndi njira yabwino kwambiri yotenthetsera kutentha kwa PCB konse. The arrangement of the wiring of the layers also increases the total specific gravity of copper used for heat conduction. Komabe, kachingwe kameneka nthawi zambiri kamakhala kotsekedwa ndi magetsi, komwe kumachepetsa kugwiritsidwa ntchito kwake ngati kotentha kotentha. Choyikiracho chiyenera kulumikizidwa ngati magetsi momwe zingathere pamitengo ingapo yothetsera kutentha. Kutentha kwa mabowo mu PCB pansi pa chipangizo cha semiconductor kumathandiza kutentha kulowa m’magawo omwe ali ndi PCB ndikusunthira kumbuyo kwa bolodi.

Magawo apamwamba ndi apansi a PCB ndi “malo abwino kwambiri” kuti azizizira bwino. Kugwiritsa ntchito mawaya ambiri ndikusunthira kutali ndi zida zamagetsi zazikulu kumatha kupereka njira yotenthetsera kutentha. Special board conduction board ndi njira yabwino kwambiri yodziwiritsira ndi kutentha kwa PCB. Chipangizo chazotentha chimakhala pamwamba kapena kumbuyo kwa PCB ndipo chimalumikizidwa motenthetsera ndi chipangizocho kudzera pakulumikizana kwachitsulo chazitsulo kapena pobowola matenthedwe. Pankhani yolumikizira mkati (kokha ndizitsulo mbali zonse ziwiri za phukusi), mbale yotenthetsera kutentha imatha kukhala pamwamba pa PCB, yopangidwa ngati “fupa la galu” (pakati pake ndi yopapatiza ngati phukusi, mkuwa kutali ndi phukusili uli ndi malo akulu, ochepa pakati ndi akulu kumapeto onse awiri). Pankhani ya phukusi la mbali zinayi (zokhala ndi zotsogolera mbali zonse zinayi), mbale yotenthetsera kutentha iyenera kukhala kumbuyo kwa PCB kapena mkati mwa PCB.

Kuchulukitsa kukula kwa mbale yotenthetsera kutentha ndi njira yabwino kwambiri yosinthira magwiridwe antchito a phukusi la PowerPAD. Different size of heat conduction plate has great influence on thermal performance. Tsamba lazidziwitso zamagulu azinthu nthawi zambiri limatchula izi. Koma kufotokozera kuchuluka kwa mkuwa wowonjezera pa PCBS yovuta ndi kovuta. With online calculators, users can select a device and change the size of the copper pad to estimate its effect on the thermal performance of a non-JEDEC PCB. Zida zowerengera izi zikuwonetsa momwe mapangidwe a PCB amakhudzira magwiridwe antchito a kutentha. For four-side packages, where the area of the top pad is just less than the bare pad area of the device, embedding or back layer is the first method to achieve better cooling. Pakapangidwe kawiri pamizere, titha kugwiritsa ntchito kalembedwe ka “galu fupa” kuti tithetse kutentha.

Pomaliza, makina okhala ndi PCBS zokulirapo atha kugwiritsidwanso ntchito kuzirala. The screws used to mount the PCB can also provide effective thermal access to the base of the system when connected to the thermal plate and ground layer. Poganizira zamagetsi ndi mtengo wake, kuchuluka kwa zomangira ziyenera kukulitsidwa mpaka kuchepa kubwerera. Chitsulo cholimba cha PCB chimakhala ndi malo ozizira kwambiri atalumikizidwa ndi mbale yotentha. Pazinthu zina zomwe nyumba ya PCB imakhala ndi chipolopolo, TYPE B solder chigamba chimakhala ndi magwiridwe antchito kwambiri kuposa chipolopolo chazirala. Njira zoziziritsira, monga mafani ndi zipsepse, zimagwiritsidwanso ntchito kuziziritsa kwadongosolo, koma nthawi zambiri zimafuna malo ochulukirapo kapena zimafunikira zosintha kapangidwe kake kuti ziziziritsa kuzirala.

Kupanga makina okhala ndi matenthedwe otentha, sikokwanira kusankha chida chabwino cha IC ndi yankho lotsekedwa. Kukhazikika kwa machitidwe ozizira a IC kumadalira THE PCB ndi kuthekera kwa njira yozizira yolola zida za IC kuziziritsa mwachangu. Njira yozizira yomwe yangotchulidwa pamwambapa imatha kusintha magwiridwe antchito a kutentha.